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现代扎染三维记忆成型工艺在服装设计中的应用 被引量:2
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作者 李卉 严加平 《轻工科技》 2013年第8期114-115,共2页
从分析现代扎染三维记忆成型工艺的特色入手,归纳其工艺面料应用于服装设计中所产生的个性化特征,指出现代扎染三维记忆成型工艺在服装创新设计中的发展趋势。
关键词 现代扎染 三维记忆成型工艺 服装设计 应用
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应力记忆工艺优化对NMOS器件性能的改善
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作者 卢小雨 蔡巧明 +4 位作者 龙世兵 张烨 张陶娜 杨菁国 张云香 《微电子学》 CAS 北大核心 2019年第2期279-283,共5页
应力记忆工艺(SMT)通过在NMOS器件沟道中产生张应力,提高器件的电子迁移率,从而提升NMOS器件的性能。Si_3N_4层应力值、SiO_2层厚度以及退火顺序等三种因素,均对NMOS器件的性能产生影响,增加了SMT工艺应用的难度。对三组实验结果进行分... 应力记忆工艺(SMT)通过在NMOS器件沟道中产生张应力,提高器件的电子迁移率,从而提升NMOS器件的性能。Si_3N_4层应力值、SiO_2层厚度以及退火顺序等三种因素,均对NMOS器件的性能产生影响,增加了SMT工艺应用的难度。对三组实验结果进行分析,研究了三种因素对NMOS器件性能的影响,优化了工艺条件。结果表明,NMOS器件应用SMT工艺后,饱和漏极电流-关态漏极电流(I_(dsat)-I_(off))较传统NMOS器件提高了6%。 展开更多
关键词 应力记忆工艺 NMOS器件 饱和漏极电流-关态漏极电流
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学习障碍儿童记忆的比较研究 Ⅰ.学习障碍儿童的短时记忆和工作记忆 被引量:38
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作者 程灶火 龚耀先 《中国临床心理学杂志》 CSCD 1998年第3期129-135,共7页
目的:考查学习障碍儿童的短时记忆和工作记忆及各型学习障碍儿童短时记忆特征,比较短时记忆和工作记忆对学习的相对贡献。方法:根据儿童的学科成绩、智力水平、教师对学习能力的评定,结合临床观察,从三所小学1564名学生中筛查... 目的:考查学习障碍儿童的短时记忆和工作记忆及各型学习障碍儿童短时记忆特征,比较短时记忆和工作记忆对学习的相对贡献。方法:根据儿童的学科成绩、智力水平、教师对学习能力的评定,结合临床观察,从三所小学1564名学生中筛查出学习障碍儿童97人(男71人,女26人),正常学习儿童63人(男36,女27人),并根据主要困难所在把学习障碍儿童分为三组:语文障碍(31人)、数学障碍(21人)和混合型障碍(45人)。对每个入组儿童作个别记忆测查,内容包括短时记忆(数字、汉词和符号)和工作记忆(数字、汉词、符号、故事)。结果:混合型障碍的短时记忆和工作记忆均低于对照组,语文障碍对言语材料的短时记忆和工作记忆中的故事理解低于对照组,数学障碍仅言语材料的短时记忆低于对照组;三型学习障碍之间仅在数字广度和故事Ⅱ阅读理解二项任务上有差异;短时记忆和工作记忆与学习成绩均有中度相关,工作记忆与数学成绩的相关更高。结论:学习障碍儿童存在共同的短时记忆和工作记忆缺陷,但缺陷程度有差异,这种缺陷可能与言语编码缺陷或记忆系统本身功能障碍有关。 展开更多
关键词 学习障碍 儿童 短时记忆 工艺记忆
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Design of 256 bit single-poly MTP memory based on BCD process
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作者 KIM Kwang-il KIM Min-sung +3 位作者 PARK Young-bae PARK Mu-hun HA Pan-bong KIM Young-hee 《Journal of Central South University》 SCIE EI CAS 2012年第12期3460-3467,共8页
We propose a single-poly MTP (multi-time programmable) cell consisting of one capacitor and two transistors based on MagnaChip's BCD process. The area of a unit cell is 37.743 75μm^2. The proposed single-poly MTP ... We propose a single-poly MTP (multi-time programmable) cell consisting of one capacitor and two transistors based on MagnaChip's BCD process. The area of a unit cell is 37.743 75μm^2. The proposed single-poly MTP cell is erased and programmed by the FN tunnelling scheme. We design a 256 bit MTP memory for PMICs (power management ICs) using the proposed single-poly MTP cells. For small-area designs, we propose a selection circuit between V10V and VSV, and a WL (word-line) driver by simplifying its logic circuit. We reduce the total layout area by using pumped internal node voltages from a seven-stage cross-coupled charge pump for V10V (=10 V) and V5V (=5 V) without any additional charge pumps. The layout size of the designed 256 bit MTP memory is 618.250 μm × 437.425μm. 展开更多
关键词 multi-time programmable memory PMIC cross-coupled charge pump
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Role of Ag addition on microstructure,mechanical properties,corrosion behavior and biocompatibility of porous Ti-30 at%Ta shape memory alloys 被引量:4
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作者 Mustafa Khaleel IBRAHIM Safaa Najah SAUD +1 位作者 Esah HAMZAH Engku Mohamad NAZIM 《Journal of Central South University》 SCIE EI CAS CSCD 2020年第11期3175-3187,共13页
In the present study,the thermal,mechanical,and biological properties of xAg/Ti-30Ta(x=0,0.41,0.82 and 2.48 at%)shape memory alloys(SMAs)were investigated.The study was conducted using optical and scanning electron mi... In the present study,the thermal,mechanical,and biological properties of xAg/Ti-30Ta(x=0,0.41,0.82 and 2.48 at%)shape memory alloys(SMAs)were investigated.The study was conducted using optical and scanning electron microscopy(SEM),X-ray diffractometry(XRD),compression test,and shape memory testing.The xAg/Ti-Ta was made using a powder metallurgy technique and microwave-sintering process.The results revealed that the addition of Ag has a significant effect on the pore size and shape,whereas the smallest pore size of 11μm was found with the addition of 0.41 at%along with a relative density of 72%.The fracture stress and strain increased with the addition of Ag,reaching the minimum values around 0.41 at%Ag.Therefore,this composition showed the maximum stress and strain at fracture region.Moreover,0.82 Ag/Ti-Ta shows more excellent corrosion resistance and biocompatibility than other percentages,obtaining almost the same behaviour of the pure Ti and Ti-6Al-4V alloys,which can be recommended for their promising and potential response for biomaterial applications. 展开更多
关键词 porous xAg/Ti-Ta shape memory alloys(SMAs) microwave sintering process microstructure characteristics mechanical properties and corrosion behavior bioactivity
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Process structuring of polymers by solid phase orientation processing 被引量:11
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作者 COATES P.D. CATON-ROSE P. +1 位作者 WARD I.M. THOMPSON G. 《Science China Chemistry》 SCIE EI CAS 2013年第8期1017-1028,共12页
Solid phase orientation of polymers is one of the most successful routes to enhancement of polymer properties.It unlocks the potential of molecular orientation for the achievement of a range of enhanced physical prope... Solid phase orientation of polymers is one of the most successful routes to enhancement of polymer properties.It unlocks the potential of molecular orientation for the achievement of a range of enhanced physical properties.We provide here an overview of techniques developed in our laboratories for structuring polymers by solid phase orientation processing routes,with a particular focus on die drawing,which have allowed control of significant enhancements of a single property or combinations of properties,including Young's modulus,strength,and density.These have led to notable commercial exploitations,and examples of load bearing low density materials and shape memory materials are discussed. 展开更多
关键词 polymer ORIENTATION DRAWING STRAIN SOLID
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Research on residual stress inside Fe-Mn-Si shape memory alloy coating by laser cladding processing 被引量:2
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作者 鞠恒 林成新 +1 位作者 张佳琪 刘志杰 《Optoelectronics Letters》 EI 2016年第5期344-348,共5页
The stainless Fe-Mn-Si shape memory alloy(SMA) coating was prepared on the surface of AISI 304 stainless steel. The principal residual stress measured by the mechanical hole-drilling method indicates that the Fe-Mn-Si... The stainless Fe-Mn-Si shape memory alloy(SMA) coating was prepared on the surface of AISI 304 stainless steel. The principal residual stress measured by the mechanical hole-drilling method indicates that the Fe-Mn-Si SMA cladding specimen possesses a lower residual stress compared with the 304 stainless steel cladding specimen. The mean stress values of the former and the latter on 10-mm-thick substrate are 4.751 MPa and 7.399 MPa, respectively. What's more, their deformation values on 2-mm-thick substrate are about 0° and 15°, respectively. Meanwhile, the variation trend and the value of the residual stress simulated by the ANSYS finite element software consist with experimental results. The X-ray diffraction(XRD) pattern shows ε-martensite exists in Fe-Mn-Si SMA coating, which verifies the mechanism of low residual stress. That's the γ→ε martensite phase transformation, which relaxes the residual stress of the specimen and reduces its deformation in the laser cladding processing. 展开更多
关键词 cladding martensite thick stainless AISI specimen latter drilling diffractometer spectrometer
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