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基于无掩模定域性电沉积的3D打印平面微结构工艺研究 被引量:2
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作者 苏晓冰 吴蒙华 +2 位作者 贾卫平 于昇元 贾婷婷 《现代制造工程》 CSCD 北大核心 2022年第5期18-23,共6页
平面微结构在偏振光栅、表面增强拉曼散射(Surface Enhanced Raman Scattering, SERS)等方面有着广泛的应用。基于无掩模定域性电沉积技术,采用尖锥状探针式微型阳极逐层扫描的方式,打印简单金属平面微结构;分别采用数字显微镜、扫描电... 平面微结构在偏振光栅、表面增强拉曼散射(Surface Enhanced Raman Scattering, SERS)等方面有着广泛的应用。基于无掩模定域性电沉积技术,采用尖锥状探针式微型阳极逐层扫描的方式,打印简单金属平面微结构;分别采用数字显微镜、扫描电子显微镜对平面微结构进行尺寸数据测量及微观形貌观测。研究了打印层数、电压和极间距对线条宽度及成型质量的影响规律,试验结果表明,当打印层数为80~220时,随着打印层数的增加,线条宽度保持在320μm左右,没有发生明显变化;当电压较小(<4.2 V)时,线条表面主要由粗大的胞状颗粒构成;电压增大至4.4~4.6 V时,可以打印出平滑均匀、直线度良好的线条;当电压增大至4.8 V时,线条高度方向上的均匀性变差,发生树枝晶状生长;当电压从4.2 V增大至4.8 V时,线条宽度先增大后减小;极间距从40μm增加至80μm时,线条成型质量没有发生明显变化,线条宽度在不断增大。综上所述,打印层数(>80层)并不会影响平面微结构的线条宽度,电压比极间距对平面微结构的线条宽度与成型质量有着更为显著的影响。 展开更多
关键词 无掩模定域性电沉积 3D打印 平面微结构 打印层数 电压 极间距
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Microstructure and mechanical behavior of Ti/Cu/Ti laminated composites produced by corrugated and flat rolling 被引量:2
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作者 Zhu-bo LIU Xin-yue WANG +4 位作者 Ming-shuo LIU Yuan-ming LIU Jiang-lin LIU A.V.IGNATOV Tao WANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第8期2598-2608,共11页
Ti/Cu/Ti laminated composites were fabricated by corrugated rolling(CR) and flat rolling(FR) method.Microstructure and mechanical properties of CR and FR laminated composites were investigated by scanning electron mic... Ti/Cu/Ti laminated composites were fabricated by corrugated rolling(CR) and flat rolling(FR) method.Microstructure and mechanical properties of CR and FR laminated composites were investigated by scanning electron microscopy, numerical simulation methods, peel and tensile examinations. The effect of CR and FR was comparatively analyzed. The results showed that the CR and FR laminated composites exhibited different effective plastic strain distributions of the Ti layer and Cu layer at the interface. The recrystallization texture, prismatic texture and pyramidal texture were developed in the Ti layer by CR, while the R-Goss texture and shear texture were developed in the Cu layer by CR. The typical deformation texture components were developed in the Ti layer and Cu layer of FR laminated composites. The CR laminated composites had higher bond strength, tensile strength and ductility. 展开更多
关键词 Ti/Cu/Ti laminated composites corrugated rolling flat rolling bond strength interfacial microstructure finite element analysis
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