Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results ...Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.展开更多
The flow behavior in a typical arc welding process is very complex and features rapid melting and solidification. In this work, the flow in the melted region was determined by the effect of surface tension, viscosity,...The flow behavior in a typical arc welding process is very complex and features rapid melting and solidification. In this work, the flow in the melted region was determined by the effect of surface tension, viscosity, and gravity. Two-dimensional change of the geometry of the melted region was analyzed using the MPS （moving particle semi-implicit） method to melt a small upper plate in a hole at the center of a base plate. The relation between the initial geometry of the upper plate and the surface flatness after welding was calculated. The calculation results showed that the upper plate with a triangular notch at its center minimized the surface unevenness after welding. The depth of notch and thickness of the upper plate were optimized.展开更多
基金Project (50975040) supported by the National Natural Science Foundation of China
文摘Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels. Experimental results show that nanogrinding can produce flatness less than 1.0μm and a surface roughness Ra of 0.42nm. It is found that nanogrinding is capable of producing much flatter SiC wafers with a lower damage than double side lapping and mechanical polishing in much less time and it can replace double side lapping and mechanical polishing and reduce the removal amount of chemical mechanical polishing.
文摘The flow behavior in a typical arc welding process is very complex and features rapid melting and solidification. In this work, the flow in the melted region was determined by the effect of surface tension, viscosity, and gravity. Two-dimensional change of the geometry of the melted region was analyzed using the MPS （moving particle semi-implicit） method to melt a small upper plate in a hole at the center of a base plate. The relation between the initial geometry of the upper plate and the surface flatness after welding was calculated. The calculation results showed that the upper plate with a triangular notch at its center minimized the surface unevenness after welding. The depth of notch and thickness of the upper plate were optimized.
