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影响影像暗部再现的因素及控制(上)
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作者 陈军 《影像材料》 2002年第5期42-44,共3页
关键词 照片 暗部再现 摄影技术 镜头 底子光 胶片 控制
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Low-Cost, High-Reflectivity Silicon-on-Reflector for Optoelectronic Device Application
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作者 李成 杨沁青 +1 位作者 王红杰 王启明 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2001年第3期261-264,共4页
A silicon on reflector (SOR) substrate containing a thin crystal silicon layer and a buried Si/SiO 2 Bragg reflector is reported. The substrate, which is applied to optoelectronic devices, is fabricated by using Si... A silicon on reflector (SOR) substrate containing a thin crystal silicon layer and a buried Si/SiO 2 Bragg reflector is reported. The substrate, which is applied to optoelectronic devices, is fabricated by using Si based sol gel sticking and smart cut techniques. The reflectivity of the SOR substrate is close to unity at 1 3μm's wavelength under the normal incidence. 展开更多
关键词 silicon on reflector SiO 2/Si Bragg reflector smart cut technique optoelectronic device PHOTODETECTOR
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A New Approach to Cleave MEMS Devices from Silicon Substrates
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作者 Mehdi Rezaei Jonathan Lueke Dan Sameoto Don Raboud Walied Moussa 《Journal of Mechanics Engineering and Automation》 2013年第12期731-738,共8页
Dicing of fabricated MEMS (microelectromechanical system) devices is sometimes a source of challenge, especially when devices are overhanging structures. In this work, a modified cleaving technique is developed to p... Dicing of fabricated MEMS (microelectromechanical system) devices is sometimes a source of challenge, especially when devices are overhanging structures. In this work, a modified cleaving technique is developed to precisely separate fabricated devices from a silicon substrate without requiring a dicing machine. This technique is based on DRIE (deep reactive ion etching) which is regularly used to make cleaving trenches in the substrate during the releasing stage. Other similar techniques require some extra later steps or in some cases a long HF soak. To mask the etching process, a thick photoresist is used. It is shown that by applying different UV (ultraviolate) exposure and developing times for the photoresist, the DRIE process could be controlled to etch specific cleaving trenches with less depth than other patterns on the photoresist. Those cleaving trenches are used to cleave the wafer later, while the whole wafer remains as one piece until the end of the silicon etching despite some features being etched all the way through the wafer at the same time. The other steps of fabricating and releasing the devices are unaffected. The process flow is described in details and some results of applying this technique for cleaving fabricated cantilevers on a silicon substrate are presented. 展开更多
关键词 DICING cleaving MICROFABRICATION dry release exposure characterization deep reactive ion etching.
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Onset of the Meissner effect at 65 K in Fe Se thin film grown on Nb-doped Sr TiO_3 substrate 被引量:11
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作者 Zuocheng Zhang Yi-Hua Wang +5 位作者 Qi Song Chang Liu Rui Peng K.A.Moler Donglai Feng Yayu Wang 《Science Bulletin》 SCIE EI CAS CSCD 2015年第14期1301-1304,共4页
We report the Meissner effect studies on an Fe Se thin film grown on Nb-doped Sr Ti O3 substrate by molecular beam epitaxy. Two-coil mutual inductance measurement clearly demonstrates the onset of diamagnetic screenin... We report the Meissner effect studies on an Fe Se thin film grown on Nb-doped Sr Ti O3 substrate by molecular beam epitaxy. Two-coil mutual inductance measurement clearly demonstrates the onset of diamagnetic screening at 65 K, which is consistent with the gap opening temperature determined by previous angle-resolved photoemission spectroscopy results. The applied magnetic field causes a broadening of the superconducting transition near the onset temperature, which is the typical behavior for quasi-two-dimensional superconductors. Our results provide direct evidence that Fe Se thin film grown on Nb-doped Sr Ti O3 substrate has an onset TC* 65 K,which is the highest among all iron-based superconductors discovered so far. 展开更多
关键词 Meissner effect. FeSe thin film SrTiO3substrate Quasi-two-dimensional superconductors .Iron-based superconductors
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Photoluminescence properties of ZnSe_(1-x)Te_x thin films on GaAs/ITO substrates by electron beam evaporation technique
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作者 J.SUTHAGAR N.J.SUTHAN KISSINGER +1 位作者 M.BALASUBRAMANIAM K.PERUMAL 《Science China(Technological Sciences)》 SCIE EI CAS 2011年第1期52-57,共6页
Zinc chalcogenide which includes zinc selenide,zinc sulphide,zinc telluride and mixed crystals of these shows a great potential as an optoelectronic device material. Zinc selenotelluride is a suitable material for vis... Zinc chalcogenide which includes zinc selenide,zinc sulphide,zinc telluride and mixed crystals of these shows a great potential as an optoelectronic device material. Zinc selenotelluride is a suitable material for visible light emitting devices which are expected to cover the spectral range from yellow to blue. In our present study the composition controlled ZnSe1-xTex films with different Te content x = 0,0.2,0.4,0.6,0.8 and 1.0 were deposited by electron beam (EB) evaporation technique. GaAs films were deposited by vacuum evaporation route on indium tin oxide (ITO) substrates which were used as base for depositing the ZnSe1-xTex film. The band-gap energy change in the entire composition range was determined at room temperature by photoluminescence (PL) spectroscopy. The peak observed at about 2.56 eV shows the effect of solid solution formation between ZnSe and ZnTe which modifies the lattice and consequently the band edge emission characteristics. The heterostructures showed three peaks in the visible region of white light spectrum. 展开更多
关键词 semiconducting II-VI materials ZnSeTe electron beam evaporation PHOTOLUMINESCENCE
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