Pyrolysis experiments of a typical printed circuit boards has been carried out under various conditions in a laboratory installation Liquid yield of 15%～21%, gas yield of 15%～20% and solid yield of about 60% were ob...Pyrolysis experiments of a typical printed circuit boards has been carried out under various conditions in a laboratory installation Liquid yield of 15%～21%, gas yield of 15%～20% and solid yield of about 60% were obtained The liquid products had high gross calorific values that might be recycled as fuel oils after simple treatment CO, CO 2 and N 2 were the main constitutes of the gas products Using combustion method, organic carbon of 7% in the solid products could be removed Then the solid products, which contained high purity fiberglass and CaCO 3, could be reused as filling materials in the process of SMC production In addition, the effects of final pyrolysis temperature (FPT) and particle size on pyrolysis products had been investigated The yield of gas products will be increased under high temperature and with powder展开更多
基金The Fundamental Research Funds for the Central Universities(GK200901002)Program for Key Science and Techology Innovation Team of Shaanxi Province(2012KCT-21)~~
文摘Pyrolysis experiments of a typical printed circuit boards has been carried out under various conditions in a laboratory installation Liquid yield of 15%～21%, gas yield of 15%～20% and solid yield of about 60% were obtained The liquid products had high gross calorific values that might be recycled as fuel oils after simple treatment CO, CO 2 and N 2 were the main constitutes of the gas products Using combustion method, organic carbon of 7% in the solid products could be removed Then the solid products, which contained high purity fiberglass and CaCO 3, could be reused as filling materials in the process of SMC production In addition, the effects of final pyrolysis temperature (FPT) and particle size on pyrolysis products had been investigated The yield of gas products will be increased under high temperature and with powder
文摘为了确定纸基印刷线路板非金属粉与环氧树脂体系的最佳固化工艺条件,采用差示扫描量热法(DSC)对环氧树脂(EP体系)、非金属粉/环氧树脂复合材料(NM-EP体系)和KH-550改性非金属粉/环氧树脂复合材料(K-NM-EP体系)的固化过程进行研究.结果表明:加入纸基印刷线路板非金属粉对各体系的固化反应过程有影响,使表观活化能提高,但不影响固化反应历程;动力学计算得到EP、NM-EP和K-NM-EP体系的最佳起始固化温度分别为333.15、353.15和343.15 K,后处理温度分别为453.15、423.15和393.15 K,固化温度均为373.15 K.
