基于非硅微制造工艺的爆炸箔起爆器研究

为了实现爆炸箔起爆器的集成化和批量化制备,研究了爆炸箔起爆器非硅微制造工艺技术。采用磁控溅射和光刻技术制备了桥箔,通过紫外厚胶技术在桥箔上制备了聚甲基丙烯酸甲酯光刻胶飞片层,并利用SU-8光刻胶集成制造了加速膛,划片后一个衬底上制备了268个爆炸箔起爆器组件,每个组件的体积为0.018 cm3.集成后的爆炸箔起爆器50%发火感度为2 185 V.试验了爆炸箔起爆器组件的耐高温性能,结果表明在160℃下经历50 h以后,爆炸箔起爆器组件依然可以正常起爆Ⅳ型六硝基菧炸药柱。

软刻蚀——图形转移和微制造新工艺

:“软刻蚀”是相对于微制造领域中占据主导地位的刻蚀而言的微图形转移和微制造的新方法 ,总的思路就是把用昂贵设备生成的微图形通过中间介质进行简便而又精确的复制 ,提高微制作的效率 ,包括微接触印刷 ,毛细微模塑 ,溶剂辅助的微模塑 ,转移微模塑 ,微模塑 ,近场光刻蚀等。这些方法工艺简单 ,对实验室条件要求不高 ,又能在曲面上进行操作 。

微器件制造特征信息描述与输入方法的研究

以硅基加工为研究对象,提出了一种基于特征的多层次体面相结合的微器件信息描述模型与相应的输入方法.该方法将微器件的三维几何结构按加工层进行分解,每一层由层主特征和若干辅助特征组成,建立了完整的微器件三维和二维表面制造特征,并与硅基微加工方法相联系,反映了微加工工艺的约束条件,且具有确切的加工形状.同时,将微器件信息描述为总体-加工层-特征-属性4级模式,在制造特征输入过程中,形成特征索引树及特征之间的关系,因此很好地表达了微器件的几何信息和工艺信息,为随后确定微器件的加工方法和工艺顺序提供了信息基础.

微胶体推进器起始工作电压的估计方法研究

提供了一种考虑到微制造工艺实际的对微胶体推进器的起始电压进行估计的方法。本方法的关键在于把基于深度干法腐蚀的微推进器的两极简化成一组双曲等势面中的两个 ,利用拉麦方程得到微推进器两极间静电场分布的近似解。进而分析微胶体推进器源极顶端工质液滴的静电力和表面张力的平衡 ,得到微胶体推进器的起始工作电压。按照工作电压的估计方程 ,基于ICP腐蚀 ,设计了 4种微胶体推进器。利用悬臂梁和电涡流微位移传感器对微推进器的测试结果表明 。

美哈佛大学研发铌酸锂制造新技术

据科技部网站2018年1月24日报道,铌酸锂因其电光特性而闻名,已成为最广泛使用的光学材料之一.日前,哈佛大学的研究人员开发出一种技术,使用铌酸锂制造高性能光学微结构,打开了通往超高效集成光子电路、量子光子学及微波G光转换等领域的大门.该项研究使用传统微制造工艺,制造出具有超低损耗和高度光学限制的高质量铌酸锂器件.此成果是集成光子学和铌酸锂光子学的一个重大突破,将使各种光电功能成为可能,并意味着铌酸锂将解决数据中心光链路的关键应用问题.

MEMS高温温度传感器的研制与测量精度研究

航空发动机智能化及其他机械系统的智能化需要原位集成制造的传感器,为此研制了发动机涡轮叶片原位集成高温传感器。该高温传感器采用MEMS微制造工艺将厚度在微米量级的微小传感器原位集成在航空发动机涡轮叶片表面,利用微技术制造的传感器和标准的热电偶进行了一系列的高温测量试验和一系列细致的高温温度表征测量研究。该微制造工艺攻克了两项技术难关:曲表面的光刻技术和高温绝缘层的制作技术。涡轮叶片表面原位集成的微传感器不仅可以原位测量高达800℃的环境温度,并且具有很高的机械强度,可以承受高达40 g的振动和100 g的冲力。研究还表明,在高温测量环境下,高温测量精度和高温环境下的温度场(高温温度的空间分布与升温时间迟豫)密切相关。由于高温环境温度场的差异,可以产生高达10%的测量本征误差。

Comparison of microstructures and mechanical properties between forging and rolling processes for commercially pure titanium

In order to reveal the differences caused by forging and rolling process for titanium ingots, hot compression behavior, mechanical properties and the microstructures of forged billets and rolled ones were investigated in detail using Gleeble-1500 thermal mechanical simulator, universal testing machine and optical microscope （OM）. The compression deformation experimental data of commercially pure titanium （CP-Ti） were mapped to be a T vs lg diagram in which data fall into three distinct regions, i.e., three-stage work hardening, two-stage work hardening and flow softening, which can be separated by border lines at 17.5 and 15.4 for lg Z, where Z represents the Zener-Hollomon parameter. The deformation twin is found to have higher Z-value corresponding to the work hardening region. The differences in microstructures and mechanical properties for two kinds of billets indicate that forged billet consists of deformation twins and some twin intersections, and many twins cross the grain boundaries. However, nearly no twins can be seen in the microstructure of billet formed by rolling under optical microscope （OM）, but there are equiaxed and platelike grains. Tensile tests and Vickers hardness test indicate that yield strength, tensile strength and microhardness of the samples after forging are higher than those after rolling.

哈尔滨工业大学现代连接科技与技术研究中心

哈尔滨工业大学深圳研究生院现代连接科学与技术研究中心建立于2004年6月，属现代焊接生产技术国家重点实验室在珠江三角洲地区的分支研究机构，主要从事微电子组装和封装制造核心技术之一的微连接新技术的开发和互连点可靠性评价分析。中心主要研究领域包括绿色微制造工艺、封装与组装互连材料特性、微连接焊点可靠性评价、特种连接。

Effect of annealing cooling rate on microstructure and mechanical property of 100Cr6 steel ring manufactured by cold ring rolling process

Pre-heat treatment is a vital step before cold ring rolling and it has significant effect on the microstructure and mechanical properties of rolled rings.The 100Cr6 steel rings were subjected to pre-heat treatment and subsequent cold rolling process.Scanning electron microscopy and tensile tests were applied to investigate microstructure characteristic and mechanical property variations of 100Cr6 steel rings undergoing different pre-heat treatings.The results indicate that the average diameter of carbide particles,the tensile strength and hardness increase,while the elongation decreases with the decrease of cooling rate.The cooling rate has minor effect on the yield strength of sample.After cold ring rolling,the ferrite matrix shows a clear direction along the rolling direction.The distribution of cementite is more homogeneous and the cementite particles are finer.Meanwhile,the hardness of the rolled ring is higher than that before rolling.

Feasible Development of a Carbon-Based MEMS Using a MEMS Fabrication Process

We aimed to develop a process technology for constructing a carbon-based micro-electromechanical system that does not require a high-temperature and high-energy process. A HOPG （highly oriented pyrolytic graphite） crystal microsheet was prepared by exfoliation. Cantilevers and doubly clamped beams were patterned using a photoresist. The HOPG microsheet was attached by using a tantalum layer. We fabricated cantilevers and a doubly clamped beam by controlling the thickness of the HOPG microsheet and then measured the first resonance frequency. The measurements suggest a need to improve the stiffness of the beam.

Fluorinated polymer with high thermal stability for fabrication of 32-channel arrayed waveguide grating multiplexer on silicon

A cross-linkable fluorinated poly (ether ether ketone) (FPEEK) was synthesized for the fabrication of arrayed waveguide grating (AWG) multiplexer. The results of thermal gravimetric analysis (TGA) and near-infrared absorption spectrum show that the materials have high thermal stability and high optical transparency in the infrared communication region. The refractive index of FPEEK can be controlled easily by changing the fluorine content of the materials. The 32-channel AWG multiplexer is fabricated using the FPEEK and oxygen reactive ion etching technology. The AWG multiplexer exhibits that the insertion loss is from 12.8 to 17.8 dB and the channel crosstalk is less than-20 dB. The wavelength channel spacing and the center wavelength are 0.8nm and 1548nm, respectively.

表面-微加工引论

本书全面论述表面一微加工技术的各个方面，把表面微加工的制造工艺、微尺度现象和设计数据与物理形状及功能联系在一起，并介绍具体元件的理论和设计。全书分为一个引言和四个部分（含6章），第1章引言。第一部分制造（含第2～3章），介绍微制造工艺和微加工技术。第二部分设计（含第4～8章），论述微尺度物理学、力学、设计工艺、非理想工艺和设计技术。

Fabrication of iridium oxide neural electrodes at the wafer level

Electro-deposition, electrical activation, thermal oxidation, and reactive ion sputtering are the four primary methods to fabricate iridium oxide film. Among these methods, reactive ion sputtering is a commonly used method in standard micro-fabrication processes. In different sputtering conditions, the component, texture, and electrochemistry character of iridium oxide varies considerably. To fabricate the iridium oxide film compatible with the wafer-level processing of neural electrodes, the quality of iridium oxide film must be able to withstand the mechanical and chemical impact of post-processing, and simultaneously achieve good performance as a neural electrode. In this study, parameters of sputtering were researched and developed to achieve a balance between mechanical stability and good electrochemical characteristics of iridium oxide film on electrode. Iridium oxide fabricating process combined with fabrication flow of silicon electrodes, at wafer-level, is introduced to produce silicon based planar iridium oxide neural electrodes. Compared with bare gold electrodes, iridium oxide electrodes fabricated with this method exhibit particularly good electrochemical stability, low impedance of 386 kW at 1 kH z, high safe charge storage capacity of 3.2 m C/cm^2, and good impedance consistency of less than 25% fluctuation.