A Review of Heat Transfer Enhancement through Flow Disruption in a Microchannel

In this paper a comprehensive review of heat transfer enhancement through microchannels has been presented. Over the past few years due to multifunetion, shrinking package size and high power dissipation, the heat flux per unit area has increased significantly. Microchannels, with their large heat transfer surface to volume ratio and their small volumes, have shown a good thermal performance. Microchannels have been proven to be a high per- formaace cooling technique which is able to dissipate heat flux effectively from localized hot spots over small surface area. A good amount of heat transfer augmentation techniques have been reported on flow disruption through microchannel. These techniques promote free stream separation at the leading edge which results in boundary layer development and enhanced mixing leading to increased heat transfer. Flow disruption can be achieved through passive surface modifications, such as, shape of channel, dimple surfaces, ribs, cavities, groove structures, porous medium, etc. Combined effects of these geometrical configurations in heat transfer augmenta- tion are also reported in the literature. In this paper recent developments in experimental and numerical simula- tions of single-phase liquid cooled microchannel have been discussed to analyze the pressure drop, friction and heat transfer characteristics due to different flow conditions, roughness structure and passive surface modifica- tions. It has been observed that the flow disruption techniques are effective for heat transfer enhancement with lower penalties of increased pressure drop. The review concludes with suggestions for future research in this area.

Optimization of Dimples in Microchannel Heat Sink with Impinging Jets Part A： Mathematical Model and the Influence of Dimple Radius

With increasing heat fluxes caused by electronic components, dimples have attracted wide attention by researchers and have been applied to microchannel heat sink in modem advanced cooling technologies. In this work, the combination of dimples, impinging jets and microchannel heat sink was proposed to improve the heat transfer performance on a cooling surface with a constant heat flux 500 W/cm2. A mathematical model was ad- vanced for numerically analyzing the fluid flow and heat transfer characteristics of a microchannel heat sink with impinging jets and dimples （MHSIJD）, and the velocity distribution, pressure drop, and thermal performance of MI-ISIJD were analyzed by varying the radii of dimples. The results showed that the combination of dimples and MHSIJ can achieve excellent heat transfer performance; for the MHSIJD model in this work, the maximum and average temperatures can be as low as 320 K and 305 K, respectively when mass flow rate is 30 g/s; when dimple radius is larger than 0.195 mm, both the heat transfer coefficient and the overall performance h/AP of MHSIJD are higher than those of MHSIJ.