Cu−0.15Zr(wt.%)alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging.Evolution of microstructure,mechanical properties and electrical conductivity of the alloy durin...Cu−0.15Zr(wt.%)alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging.Evolution of microstructure,mechanical properties and electrical conductivity of the alloy during elevated-temperature annealing were investigated.The alloy exhibits good thermal stability,and its strength decreases slightly even after annealing at 700℃ for 2 h.The nano-sized Cu_(5)Zr precipitates show significant pinning effect on dislocation moving,which is the main reason for the high strength of the alloy.Additionally,the large-size Cu_(5)Zr precipitates play a major role in retarding grain growth by pinning the grain boundaries during annealing.After annealing at 700℃ for 2 h,the electrical conductivity of samples reaches the peak value of 88%(IACS),which is attributed to the decrease of vacancy defects,dislocations,grain boundaries and Zr solutes.展开更多
基金The authors are grateful for the financial supports from the Ministry of Science and Technology of China(No.2017YFB0305701).
文摘Cu−0.15Zr(wt.%)alloy with uniform and fine microstructure was fabricated by rapid solidification followed by hot forging.Evolution of microstructure,mechanical properties and electrical conductivity of the alloy during elevated-temperature annealing were investigated.The alloy exhibits good thermal stability,and its strength decreases slightly even after annealing at 700℃ for 2 h.The nano-sized Cu_(5)Zr precipitates show significant pinning effect on dislocation moving,which is the main reason for the high strength of the alloy.Additionally,the large-size Cu_(5)Zr precipitates play a major role in retarding grain growth by pinning the grain boundaries during annealing.After annealing at 700℃ for 2 h,the electrical conductivity of samples reaches the peak value of 88%(IACS),which is attributed to the decrease of vacancy defects,dislocations,grain boundaries and Zr solutes.
