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Cu-Sn-Cu互连微凸点热压键合研究 被引量:4
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作者 张潇睿 《电子与封装》 2021年第9期20-24,共5页
随着多数产品更高的I/O数需求,微铜柱凸点已经成为倒装芯片领域的主流,而热压倒装焊则是目前使用最多的键合方式之一。针对一款Cu-Sn-Cu倒装芯片,基于日本Athlete公司的CB-600低荷重半自动倒装键合机,以研究芯片键合质量为目标,完成了... 随着多数产品更高的I/O数需求,微铜柱凸点已经成为倒装芯片领域的主流,而热压倒装焊则是目前使用最多的键合方式之一。针对一款Cu-Sn-Cu倒装芯片,基于日本Athlete公司的CB-600低荷重半自动倒装键合机,以研究芯片键合质量为目标,完成了不同参数条件下的芯片键合样品,并通过光学显微镜和拉剪力测试机对样品的键合质量进行了比较,得到了键合参数对键合质量的影响规律。 展开更多
关键词 微铜柱凸点 热压键合 键合参数 拉剪力测试
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Evaluation of in-plane shear test methods for composite material laminates
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作者 王言磊 《Journal of Chongqing University》 CAS 2007年第3期221-226,共6页
In-plane shear properties of composite material laminates are very important in structural design of composite material. Four commonly used in-plane shear test methods were introduced in this paper. In order to study ... In-plane shear properties of composite material laminates are very important in structural design of composite material. Four commonly used in-plane shear test methods were introduced in this paper. In order to study the differences of various shear test methods, two ASTM standard in-plane shear test methods for composite material laminates were experimentally investigated. They are ±45° tensile shear test (ASTM D3518) and V-notched rail shear test (ASTM D7078). Five types of composite material laminates composed of E-glass fiber fabric and vinyl ester resin were utilized, whose stacking sequences are 03s, 0/903s, CSM/0/902s, ±453s and (0/90)2/(±45)2/(0/90)2s, respectively. The test results indicate that the ±45° tensile shear test can predict shear moduli of composite material laminates accurately. However, the predictions of shear strength using ±45° tensile shear test are significantly lower than those of V-notched rail shear test. 展开更多
关键词 in-plane shear test ±45° tensile shear test V-notched rail shear test comoosite material laminate
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