无卤素水基助焊剂普遍存在表面张力大,活性差,残留多以及易发霉等难题,文章通过对活性剂、助溶剂、缓蚀剂以及表面活性剂等组分的优化较好地解决了这些问题,研制了一种无卤素水基免清洗助焊剂NC902。经检测,该助焊剂的各项性能均达到国...无卤素水基助焊剂普遍存在表面张力大,活性差,残留多以及易发霉等难题,文章通过对活性剂、助溶剂、缓蚀剂以及表面活性剂等组分的优化较好地解决了这些问题,研制了一种无卤素水基免清洗助焊剂NC902。经检测,该助焊剂的各项性能均达到国家相关助焊剂标准要求。助焊剂对无铅焊料Sn0.7Cu的平均铺展率达到80.75%。采用SAT-5100可焊性测试仪测试了该焊剂的润湿性能,结果显示零交时间为0.90秒,润湿时间为1.35秒,最大润湿力为3.47 m N,平均润湿角为25.60°。展开更多
1,1'‐Butylenebispyridinium hydrogen sulfate is an efficient, halogen‐free and reusable Brnsted ionic liquid catalyst for the synthesis of ethyl‐4‐aryl/heteryl‐hexahydro‐trimehtyl‐5‐ oxoquino‐line‐3‐carb...1,1'‐Butylenebispyridinium hydrogen sulfate is an efficient, halogen‐free and reusable Brnsted ionic liquid catalyst for the synthesis of ethyl‐4‐aryl/heteryl‐hexahydro‐trimehtyl‐5‐ oxoquino‐line‐3‐carboxylates by the one‐pot condensation of dimedone, aryl/heteryl aldehydes, ethyl aceto‐acetate, and ammonium acetate under solvent‐free conditions. This method has the advantages of high yield, clean reaction, simple methodology, and short reaction time. The ionic liquid can be re‐cycled five times without significant loss of the catalytic activity.展开更多
文摘无卤素水基助焊剂普遍存在表面张力大,活性差,残留多以及易发霉等难题,文章通过对活性剂、助溶剂、缓蚀剂以及表面活性剂等组分的优化较好地解决了这些问题,研制了一种无卤素水基免清洗助焊剂NC902。经检测,该助焊剂的各项性能均达到国家相关助焊剂标准要求。助焊剂对无铅焊料Sn0.7Cu的平均铺展率达到80.75%。采用SAT-5100可焊性测试仪测试了该焊剂的润湿性能,结果显示零交时间为0.90秒,润湿时间为1.35秒,最大润湿力为3.47 m N,平均润湿角为25.60°。
文摘1,1'‐Butylenebispyridinium hydrogen sulfate is an efficient, halogen‐free and reusable Brnsted ionic liquid catalyst for the synthesis of ethyl‐4‐aryl/heteryl‐hexahydro‐trimehtyl‐5‐ oxoquino‐line‐3‐carboxylates by the one‐pot condensation of dimedone, aryl/heteryl aldehydes, ethyl aceto‐acetate, and ammonium acetate under solvent‐free conditions. This method has the advantages of high yield, clean reaction, simple methodology, and short reaction time. The ionic liquid can be re‐cycled five times without significant loss of the catalytic activity.