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高分子材料时-温等效性的研究(Ⅲ)高分子材料的力学状态非线性松弛活化能谱的研究 被引量:2
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作者 刘薇 金日光 励杭泉 《北京化工学院学报》 CSCD 北大核心 1992年第1期15-22,共8页
在前两篇中为探讨高分子材料的力学状态松弛活化能谱,提供了理论依据及大量的实验事实,本文对实验数据进行了理论分析,得到了不同高分子材料在不同的力学状态下的松弛活化能和活化能谱。并从不同力学状态下的活化能大小出发,对活化能谱... 在前两篇中为探讨高分子材料的力学状态松弛活化能谱,提供了理论依据及大量的实验事实,本文对实验数据进行了理论分析,得到了不同高分子材料在不同的力学状态下的松弛活化能和活化能谱。并从不同力学状态下的活化能大小出发,对活化能谱作了解释,文献上尚未有这方面的报导。 展开更多
关键词 高聚物 力学状态 时-温等效性
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高分子材料时—温等效性的研究:(Ⅱ)某些高分子材料温度—形...
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作者 刘薇 金日光 《北京化工学院学报》 CSCD 北大核心 1991年第3期13-21,共9页
关键词 高分子 形变 模量 时-温等效性
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Evolution of mechanical properties,localized corrosion resistance and microstructure of a high purity Al-Zn-Mg-Cu alloy during non-isothermal aging
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作者 DAI Xuan-xuan LI Yu-zhang +2 位作者 LIU Sheng-dan YE Ling-ying BAO Chong-jun 《Journal of Central South University》 SCIE EI CAS CSCD 2024年第6期1790-1807,共18页
The evolution of mechanical properties,localized corrosion resistance of a high purity Al-Zn-Mg-Cu alloy during non-isothermal aging(NIA)was investigated by hardness test,electrical conductivity test,tensile test,inte... The evolution of mechanical properties,localized corrosion resistance of a high purity Al-Zn-Mg-Cu alloy during non-isothermal aging(NIA)was investigated by hardness test,electrical conductivity test,tensile test,intergranular corrosion test,exfoliation corrosion test,slow strain rate tensile test and electrochemical test,and the mechanism has been discussed based on microstructure examination by optical microscopy,electron back scattered diffraction,scanning electron microscopy and scanning transmission electron microscopy.The NIA treatment includes a heating stage from 40℃to 180℃with a rate of 20℃/h and a cooling stage from 180℃to 40℃with a rate of 10℃/h.The results show that the hardness and strength increase rapidly during the heating stage of NIA since the increasing temperature favors the nucleation and the growth of strengthening precipitates and promotes the transformation of Guinier-Preston(GPI)zones toη'phase.During the cooling stage,the sizes ofη'phase increase with a little change in the number density,leading to a further slight increase of the hardness and strength.As NIA proceeds,the corroded morphology in the alloy changes from a layering feature to a wavy feature,the maximum corrosion depth decreases,and the reason has been analyzed based on the microstructural and microchemical feature of precipitates at grain boundaries and subgrain boundaries. 展开更多
关键词 Al-Zn-Mg-Cu alloy non-isothermal aging mechanical properties localized corrosion resistance MICROSTRUCTURE
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Effect of non-isothermal aging on microstructure and properties of Al−5.87Zn−2.07Mg−2.42Cu alloys 被引量:5
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作者 Yao LI Guo-fu XU +3 位作者 Xiao-yan PENG Shi-chao LIU Ying DENG Xiao-peng LIANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第10期2899-2908,共10页
The evolution of microstructure and properties of Al−5.87Zn−2.07Mg−2.42Cu alloys during non-isothermal aging was studied.The mechanical properties of the alloy were tested by stretching at room temperature.The results... The evolution of microstructure and properties of Al−5.87Zn−2.07Mg−2.42Cu alloys during non-isothermal aging was studied.The mechanical properties of the alloy were tested by stretching at room temperature.The results show that in the non-isothermal aging process,when the alloy is cooled to 140℃,the ultimate tensile strength of the alloy reaches a maximum value of 582 MPa and the elongation is 11.9%.The microstructure was tested through a transmission electron microscope,and the experimental results show that the GP zones andη'phases are the main strengthening precipitates.At the cooling stage,when the temperature dropped to 180℃,the GP zones were precipitated again.Besides,the experimental results show that the main strengthening phase during non-isothermal aging isη'phases. 展开更多
关键词 Al−Zn−Mg−Cu aluminum alloy non-isothermal aging η'phases mechanical properties
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Thermal reliabilities of Sn−0.5Ag−0.7Cu−0.1Al_(2)O_(3)/Cu solder joint 被引量:1
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作者 Jie WU Guo-qiang HUANG +2 位作者 Song-bai XUE Peng XUE Yong XU 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2022年第10期3312-3320,共9页
The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could inc... The effects of trace addition of Al_(2)O_(3) nanoparticles(NPs)on thermal reliabilities of Sn−0.5Ag−0.7Cu/Cu solder joints were investigated.Experimental results showed that trace addition of Al_(2)O_(3) NPs could increase the isotheraml aging(IA)and thermal cyclic(TC)lifetimes of Sn−0.5Ag−0.7Cu/Cu joint from 662 to 787 h,and from 1597 to 1824 cycles,respectively.Also,trace addition of Al_(2)O_(3) NPs could slow down the shear force reduction of solder joint during thermal services,which was attributed to the pinning effect of Al_(2)O_(3) NPs on hindering the growth of grains and interfacial intermetallic compounds(IMCs).Theoretically,the growth coefficients of interfacial IMCs in IA process were calculated to be decreased from 1.61×10^(−10 )to 0.79×10^(−10) cm^(2)/h in IA process,and from 0.92×10^(−10) to 0.53×10^(−10) cm^(2)/h in TC process.This indicated that trace addition of Al_(2)O_(3) NPs can improve both IA and TC reliabilities of Sn−0.5Ag−0.7Cu/Cu joint,and a little more obvious in IA reliability. 展开更多
关键词 Sn−0.5Ag−0.7Cu solder Al_(2)O_(3) nanoparticles isothermal aging thermal cycling thermal reliability
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