热释电红外探测器PZT晶片粘接质量控制

热释电红外探测器芯片研制中,晶片粘接是芯片研制中的关键工艺之一。本文详细论述了粘接胶的选择依据及晶片粘接质量控制。确定了适合器件研制的粘接胶和粘胶工艺流程。对粘接中出现的问题及解决办法进行了讨论。研制出了完全能满足器件工艺要求的热释电探测器PZT晶片。

Mechanism of Wafer Bonding Process

The basic force and bonding energy in wafer bonding have been revealed in this study. The basic cause for bonding contributes to the interatomic attractive forces between surfaces or the reduction of surface energies. The amplitude of roughness component can not exceed the criterion if wafer pair is bondable. The bonding behavior and challenge during annealing have been investigated.