本征击穿电场与禁带宽度的关系

在汇集实验数据的基础上,提出了对半导体和绝缘体材料的本征击穿电场与其禁带宽度之间关系的通用表达式。根据半导体与绝缘体本征击穿电场规律的不同,首次有依据地提出了用禁带宽度Eg值对材料进行明确统一分类的定量判据:击穿场判据。给出了直接用禁带宽度Eg表示的半导材料的各种简化优质系数表达式。基于文章提出的关系式,计算了多种重要的二元化合物半导体及高k栅介质的本征击穿电场预期值。

10μm级聚酯薄膜介质电临界击穿场强初步研究(英文)

分析了聚酯薄膜电击穿可能的模型，如本征击穿模型和电一机械击穿模型，估算了两种模型下常用聚合物介质的临界击穿场强。实验研究了平板电极结构下10μm级聚酯薄膜的自击穿电压，得出了聚酯薄膜的临界击穿场强450-500kV／mm。实验结果与理论计算值比较表明：本征击穿模型下的聚酯薄膜临界击穿场强都远小于实验结果，电～机械击穿模型下聚酯薄膜临界击穿场强大于实验结果。

Effect of Metal Contamination on Characteristics of Ultra-Thin Gate Oxide

The purpose of this work relates to study on the characteristics of ultra thin gate oxide (2 5nm thickness) and the effect of metal Al,Zr,and Ta contamination on GOI.The controlled metallic contamination experiments are carried out by depositing a few ppm contaminated metal and low pH solutions on the wafers.The maximum metal surface concentration is controlled at about 10 12 cm -2 level in order to simulate metal contamination during ultra clean processing.A ramped current stress for intrinsic charge to breakdown measurements with gate injection mode is used to examine the characteristics of these ultra thin gate oxides and the effect of metal contamination on GOI.It is the first time to investigate the influence of metal Zr and Ta contamination on 2 5nm ultra thin gate oxide.It is demonstrated that there is little effect of Al contamination on GOI,while Zr contamination is the most detrimental to GOI,and early breakdown has happened to wafers contaminated by Ta.