废旧胶粉与线型SBS改性沥青对比试验研究

通过软化点、延度、弹性恢复和粘韧性试验,优选出质量比为1∶0.20的胶粉改性沥青和质量比为1∶0.06的线型SBS改性沥青。针对这2种改性沥青进行了动力学分析、差示扫描量热曲线和扫描电镜分析。试验表明:线型SBS改性沥青的变形能力、粘韧性值、韧性值都远超过胶粉改性沥青;由于线型SBS改性沥青的损耗因子较大,具有更优异的衰减冲击与震动的作用,但由于其模量较低,在应用中需充分考虑其模量;SBS在沥青中分散度更高、均一性更好,但由于其比表面积更大,吸收了更多的轻质组分,导致其粘弹性温度范围较窄。

Dynamic analytic model of mechanism with links fabricated from symmetric laminates

A four-bar linkage mechanism with links fabricated from symmetric laminates was studied. The mass matrix of the beam dement was obtained in light of the mass distribution characteristics of composite materials. The stiffness matrix of the beam element was derived from the constitutive equations of each layer and the relationship between the strain distribution and the node displacement of the beam element. The specific damping capacity of the beam element was analyzed according to the strain distribution of the beam element and the strain energy dissipation caused by vibration in each direction of each layer; and the damping coefficients were obtained according to the principle that the total energy dissipation of the beam element was equal to the work done by the equivalent damping force during a cycle of vibration, from which the damping matrix of the dynamic equations was obtained. Using the finite element method, the dynamic analytic model of the mechanism was obtained. The dynamic responses and natural frequency of the mechanism were obtained by simulation, respectively, and those of the simulation obtained by the proposed model were analyzed and compared with the results obtained by the conventional model. The work provides theoretical basis to a certain extent for the further research on nonlinear vibration characteristics and optimum design of this kind of mechanism.

Effects of static aeroelasticity on composite wing characteristics under different flight attitudes

Composite wing static aeroelasticity was analyzed through a loosely coupled method and the effects on composite wing characteristics under different flight attitudes were presented. Structural analysis and aerodynamic analysis were carried out through finite element method (FEM) software NASTRAN and computational fluid dynamics (CFD) software FLUENT, respectively. Correlative data transfer and mesh regenerate procedure were applied to couple the results of computational structure dynamics (CSD) and CFD. After static aeroelasticity analysis under different flight attitudes, it can be seen that lift increases with the increase of flight speed and the incremental value enlarges gradually in both rigid and elastic wings. Lift presents a linear increment relationship with the increase of attack angle when the flight speed is 0.4Ma or 0.6Ma, but nonlinear increment in elastic wing when flight speed is 0.8Ma. On the effect of aeroelasticity, the maximum of deformation increases with the increase of flight speed and attack angle, and the incremental value decreases with the increase of flight speed while uniform with different attack angles. The results provide a reference for engineering applications.

Methodology for Precious Metal Recovery in Computer Printed Circuit

The life of electronic equipment is becoming increasingly shorter and its replacement always generates a quantity of waste increase, giving rise to a problem of environmental character and still needed new options of solid waste management that will contribute to global sustainable development. Parts of these waste are TCI （the card＇s printed circuit） which containing dangerous elements and turns them into a polluting material from the soil, water and air, being harmful to human health if there is to proper and responsible way, so the recycling of TCI to obtain precious metals is an example of industrial materials that can be recycled. Despite this, large quantities of these are not recycled and some others are not considered. The objective of this work is to present a systematic and ecological methodology for the recovery of valuable materials contained in parts of used in computers, circuit boards using a leaching process. The method determines a set of variables to evaluate the kinetics of the reaction and the leaching of metals that form the substrate of metal and to establish the parameters that affect the rate of leaching of metals through a sensitivity analysis, to identify design alternatives. It determines the quantity and percentages that constitutes the motherboard, processor, video cards, accelerator graphics, network and memory cards RAM, among others and its content of metals such as Cu, Fe, Ag, Au and Pt.