This paper presents a new electromagnetic functional material developed byelectron-less nickel deposition technique, with a single hollow micro-sphere as the core templateand a thin nickel layer as the shell. The micr...This paper presents a new electromagnetic functional material developed byelectron-less nickel deposition technique, with a single hollow micro-sphere as the core templateand a thin nickel layer as the shell. The micrograph taken by a scanning electron microscope showsthe microstructures of the materials in detail. Scattering parameters of the waveguide sample holderfilled with the materials have been obtained over X band. The electromagnetic parameters computedfrom the measured S parameters show that the material with metallic hollow spheres has as highrelative permeability μ'_r as 19.0 with about 0.6 magnetic loss tangent over the whole bandwidth.Compared to the material with non-metallic spheres, the permeability μ'_r and the magnetic losstangent μ'_r increase greatly, while the permittivity remains lower than 1.8.展开更多
In order to improve the interface bonding of SiCp/AZ61 composites prepared by powder metallurgy followed by hot extrusion, the electroless plating of Ni-P coating on SiCp was carried out. The influence of Ni coating o...In order to improve the interface bonding of SiCp/AZ61 composites prepared by powder metallurgy followed by hot extrusion, the electroless plating of Ni-P coating on SiCp was carried out. The influence of Ni coating on microstructure and mechanical properties of the composites was analyzed. The results show that SiC particles distribute more uniformly in the composites after surface Ni plating and there are fewer defects in Ni-coated composite. The Ni coating reacts with the magnesium matrix forming the Mg2Ni interfacial compound layer during the sintering process. The relative density of the composite increases from 97.9% to 98.4% compared with uncoated one and the hardness of the Ni-coated composite increases more rapidly as the volume fraction of SiCp increases. The tensile test results show that the tensile strength increases from 320 to 336 MPa when the volume friction of SiC particle is 9% and the Ni-coated composites have larger elongation, indicating that Ni coating improves the interfacial bonding strength and the performance of the composites. In addition, the fracture properties of SiCp/AZ61 composites were analyzed.展开更多
Nickel-plated graphite particles and unmodified graphite particles with different contents were added to the Fe-based diamond composites.The basic properties of those specimens were measured,including relative density...Nickel-plated graphite particles and unmodified graphite particles with different contents were added to the Fe-based diamond composites.The basic properties of those specimens were measured,including relative density,hardness,bending strength,abrasion ratio and holding force coefficient.And also,SEM,XRD and EDS were used to carry out microstructure characterization,phase analysis and element distribution of these specimens.The results show that nickel plating effectively improves the surface wettability of graphite particles.And it is determined that an element diffusion zone is formed on the transition interface between the nickel-plated graphite and the matrix materials,effectively enhancing the interfacial bonding strength.Also,the pores and cracks in the matrix generated by adding the graphite particles are reduced after nickel plating.Thus,the loss of basic properties of the specimens is restrained.But it is found the higher the graphite content is,the weaker the positive effect of nickel plating is.In addition,it is revealed that nickel plating plays a conducive part in the formation of graphite lubricants on the working surface,and nickel-plated graphites can slow down the thermal corrosion of the diamond particles inside the high-temperature sintered specimens.展开更多
A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction)and Ni(10%P)(mass fraction)layers.It is observed that variation of P contents in the e...A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction)and Ni(10%P)(mass fraction)layers.It is observed that variation of P contents in the electroless Ni(P)layer results in different types of microstructures of SnAgNi/Ni(P)solder joint.The morphology of Ni3Sn4 intermetallic compounds(IMCs)formed between the solder and Ni(10%P)layer is observed to be needle-like and this shape provides high speed diffusion channels for Ni to diffuse into solder that culminates in high growth rate of Ni3Sn4.The diffusion of Ni into solder furthermore results in the formation of Kirkendall voids at the interface of Ni(P)layer and SiCp/Al composites substrate.It is observed that solder reliability is degraded by the formation of Ni2SnP,P rich Ni layer and Kirkendall voids.The compact Ni3Sn4 IMC layer in Ni(5%P)solder joint prevents Ni element from diffusing into solder,resulting in a low growth rate of Ni3Sn4 layer.Meanwhile,the formation of Ni2SnP that significantly affects the reliability of solder joints is suppressed by the low P content Ni(5%P)layer.Thus,shear strength of Ni(5%P) solder joint is concluded to be higher than that of Ni(10%P)solder joint.Growth of Ni3Sn4 IMC layer and formation of crack are accounted to be the major sources of the failure of Ni(5%P)solder joint.展开更多
文摘This paper presents a new electromagnetic functional material developed byelectron-less nickel deposition technique, with a single hollow micro-sphere as the core templateand a thin nickel layer as the shell. The micrograph taken by a scanning electron microscope showsthe microstructures of the materials in detail. Scattering parameters of the waveguide sample holderfilled with the materials have been obtained over X band. The electromagnetic parameters computedfrom the measured S parameters show that the material with metallic hollow spheres has as highrelative permeability μ'_r as 19.0 with about 0.6 magnetic loss tangent over the whole bandwidth.Compared to the material with non-metallic spheres, the permeability μ'_r and the magnetic losstangent μ'_r increase greatly, while the permittivity remains lower than 1.8.
基金Project(CXZZ20140506150310438)support by the Science and Technology Program of Shenzhen,ChinaProject(2017GK2261)supported by the Science and Technology Program of Hunan,ChinaProject(2017zzts111)supported by the Fundamental Research Funds for the Central Universities of Central South University,China
文摘In order to improve the interface bonding of SiCp/AZ61 composites prepared by powder metallurgy followed by hot extrusion, the electroless plating of Ni-P coating on SiCp was carried out. The influence of Ni coating on microstructure and mechanical properties of the composites was analyzed. The results show that SiC particles distribute more uniformly in the composites after surface Ni plating and there are fewer defects in Ni-coated composite. The Ni coating reacts with the magnesium matrix forming the Mg2Ni interfacial compound layer during the sintering process. The relative density of the composite increases from 97.9% to 98.4% compared with uncoated one and the hardness of the Ni-coated composite increases more rapidly as the volume fraction of SiCp increases. The tensile test results show that the tensile strength increases from 320 to 336 MPa when the volume friction of SiC particle is 9% and the Ni-coated composites have larger elongation, indicating that Ni coating improves the interfacial bonding strength and the performance of the composites. In addition, the fracture properties of SiCp/AZ61 composites were analyzed.
文摘Nickel-plated graphite particles and unmodified graphite particles with different contents were added to the Fe-based diamond composites.The basic properties of those specimens were measured,including relative density,hardness,bending strength,abrasion ratio and holding force coefficient.And also,SEM,XRD and EDS were used to carry out microstructure characterization,phase analysis and element distribution of these specimens.The results show that nickel plating effectively improves the surface wettability of graphite particles.And it is determined that an element diffusion zone is formed on the transition interface between the nickel-plated graphite and the matrix materials,effectively enhancing the interfacial bonding strength.Also,the pores and cracks in the matrix generated by adding the graphite particles are reduced after nickel plating.Thus,the loss of basic properties of the specimens is restrained.But it is found the higher the graphite content is,the weaker the positive effect of nickel plating is.In addition,it is revealed that nickel plating plays a conducive part in the formation of graphite lubricants on the working surface,and nickel-plated graphites can slow down the thermal corrosion of the diamond particles inside the high-temperature sintered specimens.
基金Projects(50274014, 50774005) supported by the National Natural Science Foundation of ChinaProject(2006CB605207) supported by the National Basic Research Program of China+1 种基金Project(2006AA03Z557) supported by the National High-tech Research and Development of ChinaProject(I2P407) supported by MOE Program for Changjiang Scholars
文摘A novel Sn-2.5Ag-2.0Ni alloy was used for soldering SiCp/Al composites substrate deposited with electroless Ni(5%P) (mass fraction)and Ni(10%P)(mass fraction)layers.It is observed that variation of P contents in the electroless Ni(P)layer results in different types of microstructures of SnAgNi/Ni(P)solder joint.The morphology of Ni3Sn4 intermetallic compounds(IMCs)formed between the solder and Ni(10%P)layer is observed to be needle-like and this shape provides high speed diffusion channels for Ni to diffuse into solder that culminates in high growth rate of Ni3Sn4.The diffusion of Ni into solder furthermore results in the formation of Kirkendall voids at the interface of Ni(P)layer and SiCp/Al composites substrate.It is observed that solder reliability is degraded by the formation of Ni2SnP,P rich Ni layer and Kirkendall voids.The compact Ni3Sn4 IMC layer in Ni(5%P)solder joint prevents Ni element from diffusing into solder,resulting in a low growth rate of Ni3Sn4 layer.Meanwhile,the formation of Ni2SnP that significantly affects the reliability of solder joints is suppressed by the low P content Ni(5%P)layer.Thus,shear strength of Ni(5%P) solder joint is concluded to be higher than that of Ni(10%P)solder joint.Growth of Ni3Sn4 IMC layer and formation of crack are accounted to be the major sources of the failure of Ni(5%P)solder joint.
