Introduces a new monitoring method in FMS explicated in some detail by means of the MSF(Monitoring System of FMS)under development by the au- thors.In order to push FMS technology forword,enhance machining flexibility...Introduces a new monitoring method in FMS explicated in some detail by means of the MSF(Monitoring System of FMS)under development by the au- thors.In order to push FMS technology forword,enhance machining flexibility and the flexibility of human operaters and equipment in a FMS,the authors have made some breakthroughs in traditional ways of single item,unit monitoring and self-han- dling,and suggested the idea of integrated inspection and put the MSF into more practicability.The working status of FMS can be monitored on the CRT of a micro- computer of the MSF,system troubles will be shown with icons,by the flash of the system characteristic symbol or by alarming,and so on.This explores a new way for FMS inspection in a wholly integrated manner.展开更多
According to the characteristics of flexible manufacturing systems, the article describes the equipment components and hardware architecture of flexible manufacturing systems in school. Taking welding assemble process...According to the characteristics of flexible manufacturing systems, the article describes the equipment components and hardware architecture of flexible manufacturing systems in school. Taking welding assemble process as an example to elaborate production process automation, the paper put forward a flexible manufacaxring system combined with laboratory equipment and various grades, professional knowledge and teaching characteristics and differentiated teaching programs, the creation of the laboratory project was planned and implemented to specific engineering training programs, so that students has been expanded in the depth of expertise and breadth, experimental skills and innovation capacity has been improved, the teaching effect has also been significantly improved..展开更多
For the large deformation of the flexible body may cause the fluid grid distortion,which will make the numerical calculation tedious,even to end,the numerical simulation of the flexible body coupling with the fluid is...For the large deformation of the flexible body may cause the fluid grid distortion,which will make the numerical calculation tedious,even to end,the numerical simulation of the flexible body coupling with the fluid is always a tough problem.In this paper,the flexible body is under two kinds of constrained conditions and the ratio of length-diameter is 1:30.The Reynolds number of the airflow is 513,belonging to the area of low Reynolds number.The control equations of the coupling of flexible body with airflow are built and the adaptive grid control method is adopted to conduct the three-dimensional numerical simulation of the movement of the flexible body.The numerical results show that it is possible to simulate the characteristics of the flexible body's movement in the low Reynolds number airflow when the appropriate control equations are modeled and suitable equation-solving method is adopted.Unconstrained flexible body would turn over forward along the airflow's diffusion direction,while constrained flexible body in the flow field will make periodic rotation motion along the axis of the flexible body,and the bending deformation is more obvious than that of unconstrained flexible body.The preliminary three-dimensional numerical simulation can provide references for further research on the characteristics of the yam movement in high Reynolds number airflow.展开更多
Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision...Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.展开更多
文摘Introduces a new monitoring method in FMS explicated in some detail by means of the MSF(Monitoring System of FMS)under development by the au- thors.In order to push FMS technology forword,enhance machining flexibility and the flexibility of human operaters and equipment in a FMS,the authors have made some breakthroughs in traditional ways of single item,unit monitoring and self-han- dling,and suggested the idea of integrated inspection and put the MSF into more practicability.The working status of FMS can be monitored on the CRT of a micro- computer of the MSF,system troubles will be shown with icons,by the flash of the system characteristic symbol or by alarming,and so on.This explores a new way for FMS inspection in a wholly integrated manner.
文摘According to the characteristics of flexible manufacturing systems, the article describes the equipment components and hardware architecture of flexible manufacturing systems in school. Taking welding assemble process as an example to elaborate production process automation, the paper put forward a flexible manufacaxring system combined with laboratory equipment and various grades, professional knowledge and teaching characteristics and differentiated teaching programs, the creation of the laboratory project was planned and implemented to specific engineering training programs, so that students has been expanded in the depth of expertise and breadth, experimental skills and innovation capacity has been improved, the teaching effect has also been significantly improved..
基金supported by Zhejiang Provincial Natural Science Foundation under Grant No.LZ14E050004,LQ12A02002 etc
文摘For the large deformation of the flexible body may cause the fluid grid distortion,which will make the numerical calculation tedious,even to end,the numerical simulation of the flexible body coupling with the fluid is always a tough problem.In this paper,the flexible body is under two kinds of constrained conditions and the ratio of length-diameter is 1:30.The Reynolds number of the airflow is 513,belonging to the area of low Reynolds number.The control equations of the coupling of flexible body with airflow are built and the adaptive grid control method is adopted to conduct the three-dimensional numerical simulation of the movement of the flexible body.The numerical results show that it is possible to simulate the characteristics of the flexible body's movement in the low Reynolds number airflow when the appropriate control equations are modeled and suitable equation-solving method is adopted.Unconstrained flexible body would turn over forward along the airflow's diffusion direction,while constrained flexible body in the flow field will make periodic rotation motion along the axis of the flexible body,and the bending deformation is more obvious than that of unconstrained flexible body.The preliminary three-dimensional numerical simulation can provide references for further research on the characteristics of the yam movement in high Reynolds number airflow.
文摘Flexible electronics utilizing single crystalline semiconductors typically require post-growth processes to assemble and incorporate the crystalline materials onto flexible substrates. Here we present a high-precision transfer-printing method for vertical arrays of single crystalline semiconductor materials with widely varying aspect ratios and densities enabling the assembly of arrays on flexible substrates in a vertical fashion. Complementary fabrication processes for integrating transferred arrays into flexible devices are also presented and characterized. Robust contacts to transferred silicon wire arrays are demonstrated and shown to be stable under flexing stress down to bending radii of 20 mm. The fabricated devices exhibit a reversible tactile response enabling silicon based, nonpiezoelectric, and flexible tactile sensors. The presented system leads the way towards high-throughput, manufacturable, and scalable fabrication of flexible devices.
