This paper presents a general analytical model of flexible isolation system for application to the installation of high-speed machines and lightweight structures. Piezoelectric stack actuators are employed in the mode...This paper presents a general analytical model of flexible isolation system for application to the installation of high-speed machines and lightweight structures. Piezoelectric stack actuators are employed in the model to achieve vibration control of flexible structures, and dynamic characteristics are also investigated. Mobility technique is used to derive the governing equations of the system. The power flow transmitted into the foundation is solved and considered as a cost function to achieve optimal control of vibration isolation. Some numerical simulations revealed that the analytical model is effective as piezoelectric stack actuators can achieve substantial vibration attenuation by selecting proper value of the input voltage.展开更多
Holistic tin-plating on the outer conductor is one of the key processes in the manufacture of semi-flexible coaxial cable, which is widely applied to the third generation (3G) mobile communication system. However, in ...Holistic tin-plating on the outer conductor is one of the key processes in the manufacture of semi-flexible coaxial cable, which is widely applied to the third generation (3G) mobile communication system. However, in the traditional horizontal tin-plating process, disadvantages such as the pinhole defects and low productivity effect cannot be avoided. In this paper, a vertical tin-plating process was proposed to reduce the pinhole defects and improve the tincoating quality. Compared with the traditional horizontal tin-plating process, the immersion length was reduced from 300-400 mm to 10-100 mm and the tin-plating time was reduced from 7 s to 3 s in the proposed method. The experimental results indicate that immersion length and time are key parameters for the tin-plating quality. With this new tin-plating process, the experimental results show that the pinhole defects can be eliminated effectively by controlling the immersion depth below 100 mm and tin-plating time at 3 s. The thickness of tin-coating increased from not more than 5 μm to 12.3 μm with the proposed vertical tin-plating process. Meanwhile, the thickness of the intermetallic compounds (IMCs) layer between the tin-coating and copper wires was reduced from 3.26 μm to 0.62 μm if the immersion time decreased from 30 s to 1 s. Besides, a self-developed flux, which possesses a boiling point or decomposed temperature of active components over 300℃, exhibits a better efficiency in reducing the pinhole formation.展开更多
基金Project (No. 2004035223) supported by the Postdoctoral ScienceFoundation of China
文摘This paper presents a general analytical model of flexible isolation system for application to the installation of high-speed machines and lightweight structures. Piezoelectric stack actuators are employed in the model to achieve vibration control of flexible structures, and dynamic characteristics are also investigated. Mobility technique is used to derive the governing equations of the system. The power flow transmitted into the foundation is solved and considered as a cost function to achieve optimal control of vibration isolation. Some numerical simulations revealed that the analytical model is effective as piezoelectric stack actuators can achieve substantial vibration attenuation by selecting proper value of the input voltage.
基金Supported by Science and Technology Support Project of Tianjin Science and Technology Commission (No.10ZCKFGX3500)
文摘Holistic tin-plating on the outer conductor is one of the key processes in the manufacture of semi-flexible coaxial cable, which is widely applied to the third generation (3G) mobile communication system. However, in the traditional horizontal tin-plating process, disadvantages such as the pinhole defects and low productivity effect cannot be avoided. In this paper, a vertical tin-plating process was proposed to reduce the pinhole defects and improve the tincoating quality. Compared with the traditional horizontal tin-plating process, the immersion length was reduced from 300-400 mm to 10-100 mm and the tin-plating time was reduced from 7 s to 3 s in the proposed method. The experimental results indicate that immersion length and time are key parameters for the tin-plating quality. With this new tin-plating process, the experimental results show that the pinhole defects can be eliminated effectively by controlling the immersion depth below 100 mm and tin-plating time at 3 s. The thickness of tin-coating increased from not more than 5 μm to 12.3 μm with the proposed vertical tin-plating process. Meanwhile, the thickness of the intermetallic compounds (IMCs) layer between the tin-coating and copper wires was reduced from 3.26 μm to 0.62 μm if the immersion time decreased from 30 s to 1 s. Besides, a self-developed flux, which possesses a boiling point or decomposed temperature of active components over 300℃, exhibits a better efficiency in reducing the pinhole formation.
