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护理病历完整性查检工具的设计与应用 被引量:5
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作者 王华芬 郑亚萍 +1 位作者 黄鑫 汪四花 《中国护理管理》 CSCD 2015年第10期1234-1236,共3页
目的 :设计和应用护理病历完整性查检工具,以提高护理病历质量和管理实效。方法 :根据JCI医院评审标准的患者评估及病历质量测量要素以及稽查方法,结合临床工作的实践经验,设计了护理病历完整性查检工具。其查检项目包括护理初始评估... 目的 :设计和应用护理病历完整性查检工具,以提高护理病历质量和管理实效。方法 :根据JCI医院评审标准的患者评估及病历质量测量要素以及稽查方法,结合临床工作的实践经验,设计了护理病历完整性查检工具。其查检项目包括护理初始评估和再评估、健康教育评估、护理计划4个一级指标以及24个二级指标;每月由护理病历质控专家抽取每个护理单元5%-10%的运行病历,查检结果采用“是、否、不适用”三个层级进行评判。结果 :应用护理病历完整性查检工具后,护理病历总体完整率提升了2.77%,与应用前比较差异有统计学意义(P〈0.05);护理再评估、健康教育评估、护理计划记录完整率分别提高3.59%、2.25%、9.12%,与应用前比较差异均有统计学意义(P〈0.05)。二级指标的约束评估、特殊检查/治疗、护理诊断、诊断相关因素、护理目标达成时间的记录完整率分别提高了15.83%、17.04%、22.25%、16.05%、8.42%,与应用前比较差异均有统计学意义(P〈0.01)。通过对护理病历完整性查检工具使用的评价显示,对一级指标项目内容设计满意度分别为96.0%、92.0%、90.0%、90.0%;对“是、否、不适用”评价方式的认可度为90.0%;认为其能提高护理病历完整性作用的占92.0%;查检单份病历平均耗时缩短了49.4%。结论 :应用护理病历完整性查检工具进行护理病历完整性稽查,简便高效,能提高护理病历质量,从而提升临床护士整体照护能力。 展开更多
关键词 医院评审 标准 护理病历 完整性 查检工具
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查检工具与研篆方法并臻——读王培林著《检篆释疑》
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作者 李开 《常熟理工学院学报》 2011年第7期109-113,共5页
王培林《检篆释疑》是一部查考型和研究型相结合的工具书,该书有九种查检功能。书中运用矛盾观、系统论、同一律研究小篆文字并有所发现,尤其对字形的规范有较为系统的说法。该书不但对小篆,而且对其他古文字的研究有启发作用。
关键词 小篆 查检工具 研究法 《检篆释疑》
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Double balloon enteroscopy in the old: Experience from China 被引量:2
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作者 Qiong He Qiang Zhang +11 位作者 Jian-Dong Li Ya-Dong Wang Tian-Mo Wan Zhen-Yu Chen De-Shou Pan Jian-Qun Cai Si-De Liu Bing Xiao Ya-Li Zhang Bo Jiang Yang Bai Fa-Chao Zhi 《World Journal of Gastroenterology》 SCIE CAS CSCD 2012年第22期2859-2866,共8页
AIM: To evaluate the safety, efficacy and management of double balloon enteroscopy (DBE) carried out in those aged individuals with suspicious small intestine diseases. METHODS: DBE is a wonderful invention of the pas... AIM: To evaluate the safety, efficacy and management of double balloon enteroscopy (DBE) carried out in those aged individuals with suspicious small intestine diseases. METHODS: DBE is a wonderful invention of the past decade and is widely used as an examination tool for the gastrointestinal tract. From January 2003 to July 2011, data from patients who were ≥ 65 years old and underwent DBE examination in the Nanfang Hospital were included in a retrospective analysis.RESULTS: Fifty-nine individuals were found and subsequently analyzed. The mean age was 69.63 ± 3.89 years (range 65-84), 34 were males. Indications for DBE were melena/hematochezia (36 cases), abdominal pain (15 cases), diarrhea (3 cases), stool change (1 case), weight loss (1 case), vomiting (2 cases), and debilitation (1 case). The average duration of symptoms was 33.34 ± 64.24 mo. Twenty-seven patients suffered from age-related diseases. Severe complications were not found during and after DBE. Comparison between systolic and diastolic blood pressure before and after DBE was statistically significant (mean ± SD, P < 0.01, P < 0.05, respectively). Small bowel pathologies were found by DBE in 35 patients, definite diagnoses were made in 31 cases, and detection rate and diagnostic yield for DBE were 68.6% and 60.8%, respectively. CONCLUSION: DBE is a safe and effective method for gastrointestinal examination in the aged population. Aging alone is not a risk factor for elderly patients with suspicious gastrointestinal diseases and thorough preparation prior to the DBE procedure should be made for individuals with multiple diseases especially cardiopulmonary disorders. 展开更多
关键词 Double balloon enteroscopy Capsule endos-copy Small bowel diseases Multiple systematic diseases
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Utility of pancreatography for diagnosing autoimmune pancreatitis 被引量:6
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作者 Kensuke Takuma Terumi Kamisawa +3 位作者 Taku Tabata Yoshihiko Inaba Naoto Egawa Yoshinori Igarashi 《World Journal of Gastroenterology》 SCIE CAS CSCD 2011年第18期2332-2337,共6页
AIM: To identify pancreatographic findings that facilitate differentiating between autoimmune pancreatitis (AIP) and pancreatic cancer (PC) on endoscopic retrograde cholangiopancreatography (ERCP) and magnetic resonan... AIM: To identify pancreatographic findings that facilitate differentiating between autoimmune pancreatitis (AIP) and pancreatic cancer (PC) on endoscopic retrograde cholangiopancreatography (ERCP) and magnetic resonance cholangiopancreatography (MRCP). METHODS: ERCP findings of 48 AIP and 143 PC patients were compared. Diagnostic accuracies for AIP by ERCP and MRCP were compared in 30 AIP patients. RESULTS: The following ERCP findings suggested a diagnosis of AIP rather than PC. Obstruction of the main pancreatic duct (MPD) was more frequently detected in PC (P < 0.001). Skipped MPD lesions were detected only in AIP (P < 0.001). Side branch derivation from the narrowed MPD was more frequent in AIP (P < 0.001). The narrowed MPD was longer in AIP (P < 0.001), and a narrowed MPD longer than 3 cm was more frequent in AIP (P < 0.001). Maximal diameter of the upstream MPD was smaller in AIP (P < 0.001), and upstream dilatation of the MPD less than 5 mm was more frequent in AIP (P < 0.001). Stenosis of the lower bile duct was smooth in 87% of AIP and irregular in 65% of PC patients (P < 0.001). Stenosis of the intrahepatic or hilar bile duct was detected only in AIP (P = 0.001). On MRCP, diffuse narrowing of the MPD on ERCP was shown as a skipped non-visualized lesion in 50% and faint visualization in 19%, but segmental narrowing of the MPD was visualized faintly in only 14%. CONCLUSION: Several ERCP findings are useful for differentiating AIP from PC. Although MRCP cannot replace ERCP for the diagnostic evaluation of AIP, some MRCP findings support the diagnosis of AIP. 展开更多
关键词 Autoimmune pancreatitis Pancreatic cancer Endoscopic retrograde cholangiopancreatography Magnetic resonance cholangiopancreatography
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Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm 被引量:6
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作者 LU XiangNing LIU Fan +3 位作者 HE ZhenZhi LI LiYi HU NingNing SU Lei 《Science China(Technological Sciences)》 SCIE EI CAS CSCD 2018年第9期1426-1430,共5页
Solder bumps are widely used in surface mount components, which provide electrical and mechanical connection between the chip/package and the substrate. As the solder bump getting smaller in dimension and pitch, it be... Solder bumps are widely used in surface mount components, which provide electrical and mechanical connection between the chip/package and the substrate. As the solder bump getting smaller in dimension and pitch, it becomes more difficult to inspect the solder defects hidden in the IC package. In this paper, an intelligent inspection method using the scanning acoustic microscopy(SAM) and the fuzzy C-means(FCM) algorithm was investigated. A flip chip package of FA10 was chosen as the test sample. The SAM tests of FA10 were carried out in C-scan mode. The sub-image of every solder bump was segmented from the SAM image. The statistical features were then calculated and adopted for clustering of solder bumps using the FCM algorithm. The recognition results of FCM reached a high accuracy of 94.3%. The intelligent system is effective for defect inspection in high density packages. 展开更多
关键词 solder bump defects inspection SAM technology fuzzy C-means
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