It is shown that traps are generated asymmetrically in the thin gate oxides with different thickness during high field degradation,as well as the multi-mechanism plays role in the Stress Induced Leakage Current ...It is shown that traps are generated asymmetrically in the thin gate oxides with different thickness during high field degradation,as well as the multi-mechanism plays role in the Stress Induced Leakage Current (SILC).These factors perform differently in gate oxide of different thickness.A comparison is drew between several analyzing models.Trap assisted tunneling is preferred for thinner samples,while Pool-Frankel like mechanism or thermal emission mechanism should apply to the thick ones.展开更多
The hot carrier effects under off- state stress m ode( Vgs=0 ,Vds<0 ) have been investigated on9nm P- MOSFETs with channel length varying from1.0 2 5 μm to0 .5 2 5 μm.Both on- and off- state currents are discuss...The hot carrier effects under off- state stress m ode( Vgs=0 ,Vds<0 ) have been investigated on9nm P- MOSFETs with channel length varying from1.0 2 5 μm to0 .5 2 5 μm.Both on- and off- state currents are discussed. It is found that the off- state leakage current decreases after a higher voltage stressing,which is induced by the charge injection occurred close to the drain junction.However,the leakage current increases after a lower voltage stressing because of the newly generated interface traps.It is also found that the on state saturation current and threshold voltage degrade significantly with the stress tim e,which we believe is due to the charges injected near the gate- drain overlapping region and/ or the stress- induced interface trap generation.The degradation of Idsatcan be ex- pressed as a function of the product of the gate current( Ig) and the num ber of charges injected into the gate oxide ( Qinj) in a simple power law.Finally,a lifetime prediction model based on the degradation of Idsatis proposed.展开更多
文摘It is shown that traps are generated asymmetrically in the thin gate oxides with different thickness during high field degradation,as well as the multi-mechanism plays role in the Stress Induced Leakage Current (SILC).These factors perform differently in gate oxide of different thickness.A comparison is drew between several analyzing models.Trap assisted tunneling is preferred for thinner samples,while Pool-Frankel like mechanism or thermal emission mechanism should apply to the thick ones.
文摘The hot carrier effects under off- state stress m ode( Vgs=0 ,Vds<0 ) have been investigated on9nm P- MOSFETs with channel length varying from1.0 2 5 μm to0 .5 2 5 μm.Both on- and off- state currents are discussed. It is found that the off- state leakage current decreases after a higher voltage stressing,which is induced by the charge injection occurred close to the drain junction.However,the leakage current increases after a lower voltage stressing because of the newly generated interface traps.It is also found that the on state saturation current and threshold voltage degrade significantly with the stress tim e,which we believe is due to the charges injected near the gate- drain overlapping region and/ or the stress- induced interface trap generation.The degradation of Idsatcan be ex- pressed as a function of the product of the gate current( Ig) and the num ber of charges injected into the gate oxide ( Qinj) in a simple power law.Finally,a lifetime prediction model based on the degradation of Idsatis proposed.
