In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is...In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.展开更多
Triplexers are designed based on SOl flattop arrayed waveguide gratings （AWGs）. Three wavelengths （1310, 1490,and 1550nm） operate at three diffraction orders of AWGs. Simulation shows that the 3dB bandwidth,crosst...Triplexers are designed based on SOl flattop arrayed waveguide gratings （AWGs）. Three wavelengths （1310, 1490,and 1550nm） operate at three diffraction orders of AWGs. Simulation shows that the 3dB bandwidth,crosstalk, and loss are 6nm,less than -40dB, and 5dB, respectively. The output optical fields of the device fabricated in our laboratory are clear and show a good triplexing function.展开更多
A new technology for fabrication of silica on silicon arrayed waveguide grating (AWG) based on deep etching and thermal oxidation is presented.Using this method,a silicon layer is remained at the side of waveguide.The...A new technology for fabrication of silica on silicon arrayed waveguide grating (AWG) based on deep etching and thermal oxidation is presented.Using this method,a silicon layer is remained at the side of waveguide.The stress distribution and effective refractive index of waveguide fabricated by this approach are calculated using finite element and finite difference beam propagation method,respectively.The results of these studies indicate that the stress of silica on silicon optical waveguide can be matched in parallel and vertical direction and AWG polarization dependent wavelength (PDλ) can be reduced effectively due to side-silicon layer.展开更多
Arrayed waveguide grating (AWG) device,a novel compact structure,is presented based on silicon on insulator (SOI) material.A total internal reflection (TIR) waveguide mirror is fabricated at the middle of each arr...Arrayed waveguide grating (AWG) device,a novel compact structure,is presented based on silicon on insulator (SOI) material.A total internal reflection (TIR) waveguide mirror is fabricated at the middle of each arrayed waveguide.An approach of compensating TE TM mode polarization is presented by using the phase difference,which is caused by TIR at the waveguide mirror.This AWG device has advantage for its small size and simple technigue of fabrication.The experimental results are given and the feasibility of fabrication is tested.展开更多
An optical inspection method of the Ball Grid Array package(BGA) was proposed by using a machine vision system. The developed machine vision system could get main critical factors for BGA quality evaluation, such as t...An optical inspection method of the Ball Grid Array package(BGA) was proposed by using a machine vision system. The developed machine vision system could get main critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. The experiment has proved that this system is available for BGA failure detection.展开更多
The output characteristics of phase-shifted long-period fiber gratings (LPGs) are analyzed using transfer matrix method. The transmissions and their e nvelops of several kinds of these gratings are given. The characte...The output characteristics of phase-shifted long-period fiber gratings (LPGs) are analyzed using transfer matrix method. The transmissions and their e nvelops of several kinds of these gratings are given. The characteristics of pha se-shifted LPGs and Bragg gratings are compared. The possible applications of ph ase-shifted LPGs are discussed.展开更多
The large refractive index difference between Si and SiO2 makes it possible to realize ultrasmall photonic integrated circuits. A 5×5 ultracompact arrayed waveguide grating multiplexer based on 500×250 nm Si...The large refractive index difference between Si and SiO2 makes it possible to realize ultrasmall photonic integrated circuits. A 5×5 ultracompact arrayed waveguide grating multiplexer based on 500×250 nm Si nanowire waveguides is designed and fabricated by using the technologies of E-beam writing and amorphous-Si deposition. The mea- sured channel spacing is about 1.5 nm (close to the design value) and the channel crosstalk is about –8 dB.展开更多
We theoretically analyze the reflection spectra of the fiber Bragg gratings in the quadratic strain field,and resolve the numerical value with transfer matrix method.When the value of pressure is changed,we can obtain...We theoretically analyze the reflection spectra of the fiber Bragg gratings in the quadratic strain field,and resolve the numerical value with transfer matrix method.When the value of pressure is changed,we can obtain diverse reflection spectra of the fiber Bragg gratings,which is in good accordance with the experimental results.展开更多
Crossed grating stuck to metal surface was used as a strain sensor in the present work, and stress as well as strain were then investigated by accurately determining the change in the position of diffraction spot befo...Crossed grating stuck to metal surface was used as a strain sensor in the present work, and stress as well as strain were then investigated by accurately determining the change in the position of diffraction spot before and after deformed. A hardware testing system for linear CCD array, data gathering and processing was therefore developed for this purpose. Experimental results showed that the system has a good accuracy and can be used to measure stress and strain of metal surface in a real-time and quantitative manner.展开更多
文摘In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.
文摘Triplexers are designed based on SOl flattop arrayed waveguide gratings （AWGs）. Three wavelengths （1310, 1490,and 1550nm） operate at three diffraction orders of AWGs. Simulation shows that the 3dB bandwidth,crosstalk, and loss are 6nm,less than -40dB, and 5dB, respectively. The output optical fields of the device fabricated in our laboratory are clear and show a good triplexing function.
文摘A new technology for fabrication of silica on silicon arrayed waveguide grating (AWG) based on deep etching and thermal oxidation is presented.Using this method,a silicon layer is remained at the side of waveguide.The stress distribution and effective refractive index of waveguide fabricated by this approach are calculated using finite element and finite difference beam propagation method,respectively.The results of these studies indicate that the stress of silica on silicon optical waveguide can be matched in parallel and vertical direction and AWG polarization dependent wavelength (PDλ) can be reduced effectively due to side-silicon layer.
文摘Arrayed waveguide grating (AWG) device,a novel compact structure,is presented based on silicon on insulator (SOI) material.A total internal reflection (TIR) waveguide mirror is fabricated at the middle of each arrayed waveguide.An approach of compensating TE TM mode polarization is presented by using the phase difference,which is caused by TIR at the waveguide mirror.This AWG device has advantage for its small size and simple technigue of fabrication.The experimental results are given and the feasibility of fabrication is tested.
文摘An optical inspection method of the Ball Grid Array package(BGA) was proposed by using a machine vision system. The developed machine vision system could get main critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. The experiment has proved that this system is available for BGA failure detection.
文摘The output characteristics of phase-shifted long-period fiber gratings (LPGs) are analyzed using transfer matrix method. The transmissions and their e nvelops of several kinds of these gratings are given. The characteristics of pha se-shifted LPGs and Bragg gratings are compared. The possible applications of ph ase-shifted LPGs are discussed.
文摘The large refractive index difference between Si and SiO2 makes it possible to realize ultrasmall photonic integrated circuits. A 5×5 ultracompact arrayed waveguide grating multiplexer based on 500×250 nm Si nanowire waveguides is designed and fabricated by using the technologies of E-beam writing and amorphous-Si deposition. The mea- sured channel spacing is about 1.5 nm (close to the design value) and the channel crosstalk is about –8 dB.
基金Supported by the National Natural Science Foundation of China(60577018) Science and Technology Innovation Foundation of Nankai University and the Opening Project (2005-06) of KeyLaboratory of Optoelectronic Information Science and Technolo-gy ,Ministry of Education,China .
文摘We theoretically analyze the reflection spectra of the fiber Bragg gratings in the quadratic strain field,and resolve the numerical value with transfer matrix method.When the value of pressure is changed,we can obtain diverse reflection spectra of the fiber Bragg gratings,which is in good accordance with the experimental results.
文摘Crossed grating stuck to metal surface was used as a strain sensor in the present work, and stress as well as strain were then investigated by accurately determining the change in the position of diffraction spot before and after deformed. A hardware testing system for linear CCD array, data gathering and processing was therefore developed for this purpose. Experimental results showed that the system has a good accuracy and can be used to measure stress and strain of metal surface in a real-time and quantitative manner.
