Electromagnetic levitation technique was used to undercool bulk samples of Co-20% Cu and Co-60% Cu alloys and high undercoolings up to 303 and 110 K were achieved,respectively.The dendritic growth velocities were meas...Electromagnetic levitation technique was used to undercool bulk samples of Co-20% Cu and Co-60% Cu alloys and high undercoolings up to 303 and 110 K were achieved,respectively.The dendritic growth velocities were measured as a function of undercooling.The dendrite growth velocity of the Co-20% Cu alloy was much higher than that of the Co-60% Cu alloy.The experimental data were analyzed on the basis of the LKT/BCT dendritic growth model by taking into account non-equilibrium interface kinetics.It has been revealed that a transition from solute diffusion controlled dendritic growth to thermal diffusion controlled dendritic growth occurs at an undercooling of about 66 K for the Co-20% Cu alloy,whereas the dendrite growth in Co-60% Cu alloy proceeds in a solute diffusion controlled mode within a large solidification temperature range,and the solutal undercooling plays a dominant role.It is thus deduced that certain distinct solidification temperature ranges may be responsible for the different solidification modes for the two alloys.展开更多
基金supported by the National Natural Science Foundation of China (Grant No.50871088)NPU-FFR and the Foundation of Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials,Ministry of Education,Shandong University,China
文摘Electromagnetic levitation technique was used to undercool bulk samples of Co-20% Cu and Co-60% Cu alloys and high undercoolings up to 303 and 110 K were achieved,respectively.The dendritic growth velocities were measured as a function of undercooling.The dendrite growth velocity of the Co-20% Cu alloy was much higher than that of the Co-60% Cu alloy.The experimental data were analyzed on the basis of the LKT/BCT dendritic growth model by taking into account non-equilibrium interface kinetics.It has been revealed that a transition from solute diffusion controlled dendritic growth to thermal diffusion controlled dendritic growth occurs at an undercooling of about 66 K for the Co-20% Cu alloy,whereas the dendrite growth in Co-60% Cu alloy proceeds in a solute diffusion controlled mode within a large solidification temperature range,and the solutal undercooling plays a dominant role.It is thus deduced that certain distinct solidification temperature ranges may be responsible for the different solidification modes for the two alloys.
