升温速率对复合材料修补片固化过程热应力的影响

采用有限元法数值模拟了3234/T300B热固性树脂基复合材料修补片的热补仪加热固化过程,分析了工程应用范围内不同升温速率下的复合材料修补片固化历程中的温度、热应力分布和变化特征,并研究了升温速率对补片在不同时间点的残余热应力值的影响规律。研究结果表明:升温阶段热应力主要集中在补片表面中心区域及其与母板接触的区域,降温阶段复合材料修补片内部热应力高于表面热应力;升温速率越快,固化越迅速,在升温阶段修补片内部热应力及峰值热应力越大;在保温和降温阶段,修补片内热应力分布和大小不受升温速率的影响;对于较低升温速率,热应力最大值出现在升温结束时刻;对于较高的升温速率,热应力最大值出现在接近升温末期的时刻。研究结果为合理选择升温速率从而减小升温阶段的内部热应力并控制补片分层等缺陷提供了参数依据。

RELAXATION BEHAVIOUR OF GFRP UNIDIRECTIONAL LAMINATES

In this paper two set of GFRP specimens are manufactured and tested to investigate the relaxation behaviour under cyclic loading in the longitudinal and transversel direction. The relaxation of GFRP unidirectional laminates is evident for both cyclic loadings. Under longitudinal cyclic loading the relaxation is dependent on the number of loading cycles. Under transverse loading the relaxation depends on the loading cycles as well as the time of loading. Two expressions are set up to describe the relaxation for the longitudinal and transverse loading, and the predictions agree well with the experimental data.

Synergistic regulation of current-carrying wear performance of resin matrix carbon brush composites with tungsten copper composite powder

Resin matrix carbon brush composites(RMCBCs)are critical materials for high-powered electric tools.However,effectively improving their wear resistance and heat dissipation remains a challenge.RMCBCs prepared with flake graphite powders that were evenly loaded with tungsten copper composite powder(RMCBCs-W@Cu)exhibited a low wear rate of 1.63 mm^(3)/h,exhibiting 48.6%reduction in the wear rate relative to RCMBCs without additives(RMCBCs-0).In addition,RMCBCs-W@Cu achieved a low friction coefficient of 0.243 and low electric spark grade.These findings indicate that tungsten copper composite powders provide particle reinforcement and generate a gradation effect for the epoxy resin(i.e.,connecting phase)in RMCBCs,which weakens the wear of RMCBCs caused by fatigue under a cyclic current-carrying wear.

An Investigation of Stimulating the Autoclave Curing Process of Resin Matrix/Fiber Reinforced Composite Material, Ⅰ: Process model

A mathematical model is made which describes the curing process of composites constructed from continuous fiber-reinforced, thermosetting resin matrix prepreg materials, and the consolidation of the composite is developed. The model provides the variation of temperature distribution, the cure reaction process in the resin, the resin flow and fibers stress inside the composite, and the void variation and the residual stress distribution. It can be used to illustrate the mechanism of curing process and optimize the cure cycle of composite material in order to ensure the quality of a product.

Resin Matrix/Fiber Reinforced Composite Material, Ⅱ: Method of Solution and Computer Code

According to a mathematical model which describes the curing process of composites constructed from continuous fiber-reinforced, thermosetting resin matrix prepreg materials, and the consolidation of the composites, the solution method to the model is made and a computer code is developed, which for flat-plate composites cured by a specified cure cycle, provides the variation of temperature distribution, the cure reaction process in the resin, the resin flow and fibers stress inside the composite, the void variation and the residual stress distribution.

Characteristics of Cyanate Ester and Fluorenyl Epoxy-Based Polymer-Ceramic Composites

In the field of highly integrated printed circuit board （PCB）, the heat resistant substrate with low water absorption is very important material. To get the resin composition for the high functional substrate material with low moisture absorption and high glass transition temperature （Tg） simultaneously, a fluorenyl ＂Cardo＂ epoxy was incorporated into novolac cyanate ester resin. As an optimum curing agent for the fiuorenyl epoxy, methyl nadic anhydride （MNA） was selected. Silica powders as fillers were added into the resin composition. The partial replacement of the cyanate ester resin with the fluorenyl epoxy could reduce the moisture absorption with keeping high glass transition temperature over 300 ℃. The laminate, which was fabricated from prepregs made with 40 wt% silica-filled resin composition and glass fabric, showed high Tg of 317 ℃ and low moisture absorption of 0.57%.

Thermal Analysis of Resin Composites with Ellipsoidal Filler Considering Thermal Boundary Resistance

The effective thermal conductivity of composites with ellipsoidal fillers is analyzed by using a homogenization method that is able to represent the microstructure precisely.In this study,various parameters such as the volume fraction,shape,and distribution of the filler are quantitatively estimated to understand the mechanisms of heat transfer in the composite.First,thermal boundary resistance between resin and filler is important for obtaining composites with higher thermal conductivity.Second,the anisotropy of the effective thermal conductivity arises from contact between filler in the case of ellipsoidal filler and produces lower thermal resistance.Finally,the filler network and thermal resistance are essential for the heat transfer in composites because the path of thermal conduction is improved by contact between neighboring filler particles.