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多用槽孔机简介
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作者 牟彦韬 彭彦彬 《山东机械》 2001年第1期34-35,共2页
我国的灌注桩技术发展很快,70年代出现了钻孔矩形桩和地下连续墙,80年代出现了钻孔异型桩,90年代出现了薄壁异型桩,薄壁桩、墙的诞生,使灌注桩的承载力提高了1-4倍,地下连续墙的厚度减少了60%以上,经济效益和社会效益显著,根... 我国的灌注桩技术发展很快,70年代出现了钻孔矩形桩和地下连续墙,80年代出现了钻孔异型桩,90年代出现了薄壁异型桩,薄壁桩、墙的诞生,使灌注桩的承载力提高了1-4倍,地下连续墙的厚度减少了60%以上,经济效益和社会效益显著,根据薄壁桩、墙发展的需要,在以往地工经验的基础上,我们研究设计了价格低、槽孔质量好,施工效率高的多用槽孔机。 展开更多
关键词 槽孔机 薄壁防渗墙 薄壁异型桩 灌注桩
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Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via(TSV) application 被引量:1
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作者 DING YingTao YAN YangYang +3 位作者 CHEN QianWen WANG ShiWei CHEN Xiu CHEN YueYang 《Science China(Technological Sciences)》 SCIE EI CAS 2014年第8期1616-1625,共10页
Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process bas... Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process based on experiments and numerical simulation,and studied the effect of vacuum pressure,viscosity of polymer and aspect-ratio of trench on the filling performance.A 2D axisymmetric model,consisting of polymer partially filled into the trench and void at the bottom of trench,was developed for the computational fluid dynamics(CFD)simulation.The simulation results indicate that the vacuum-assisted polymer filling process goes through four stages,including bubble formation,bubble burst,air elimination and polymer re-filling.Moreover,the simulation results suggest that the pressure significantly affects the bubble formation and the polymer re-filling procedure,and the polymer viscosity and the trench aspect-ratio influence the duration of air elimination. 展开更多
关键词 through-silicon-via (TSV) vacuum process polymer filling computational fluid dynamics (CFD)
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