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浅谈煤矿用铸石槽刮板机选型与功率计算
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作者 于孔玉 马守华 李楠 《煤矿现代化》 2009年第5期111-112,共2页
根据实际需要预设几个参数:运输量、运输长度、运输物料、物料的粒度、水分、密度ρ从而进行铸石槽刮板输送机的选型计算。
关键词 根据实际预设参数 计算 计算电机功率
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基于MATLAB的车刀片三维复杂槽型设计 被引量:1
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作者 冯新敏 谭光宇 《机械设计与制造》 北大核心 2009年第11期3-4,共2页
提出了一种三维复杂槽型车刀片的槽型设计方法;将有效槽型参数运用于切屑折断卷曲半径和切屑折断条件式,导出三维复杂槽型的槽宽的计算式;并用MATLAB计算出槽宽,拟合出槽型的曲线;计算出的槽宽可导入Pro/Engineer建立三维复杂槽型车刀... 提出了一种三维复杂槽型车刀片的槽型设计方法;将有效槽型参数运用于切屑折断卷曲半径和切屑折断条件式,导出三维复杂槽型的槽宽的计算式;并用MATLAB计算出槽宽,拟合出槽型的曲线;计算出的槽宽可导入Pro/Engineer建立三维复杂槽型车刀片的模型,该模型可以导入ANSYS软件进行槽型车刀片的切削仿真,分析槽型的性能,为以后槽型设计的系列化,参数化,打下了基础。 展开更多
关键词 三维复杂 槽宽计算 MATLAB
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Investigation on mechanism of polymer filling in high-aspect-ratio trenches for through-silicon-via(TSV) application 被引量:1
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作者 DING YingTao YAN YangYang +3 位作者 CHEN QianWen WANG ShiWei CHEN Xiu CHEN YueYang 《Science China(Technological Sciences)》 SCIE EI CAS 2014年第8期1616-1625,共10页
Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process bas... Vacuum-assisted spin-coating is an effective polymer filling technology for sidewall insulating of through-silicon-via(TSV).This paper investigated the flow mechanism of the vacuum-assisted polymer filling process based on experiments and numerical simulation,and studied the effect of vacuum pressure,viscosity of polymer and aspect-ratio of trench on the filling performance.A 2D axisymmetric model,consisting of polymer partially filled into the trench and void at the bottom of trench,was developed for the computational fluid dynamics(CFD)simulation.The simulation results indicate that the vacuum-assisted polymer filling process goes through four stages,including bubble formation,bubble burst,air elimination and polymer re-filling.Moreover,the simulation results suggest that the pressure significantly affects the bubble formation and the polymer re-filling procedure,and the polymer viscosity and the trench aspect-ratio influence the duration of air elimination. 展开更多
关键词 through-silicon-via (TSV) vacuum process polymer filling computational fluid dynamics (CFD)
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