In integrated circuits, the defects associated with photolithography are assumed to be in the shape of circular discs in order to perform the estimation of yield and fault analysis. However,real defects exhibit a grea...In integrated circuits, the defects associated with photolithography are assumed to be in the shape of circular discs in order to perform the estimation of yield and fault analysis. However,real defects exhibit a great variety of shapes. In this paper,a novel yield model is presented and the critical area model of short circuit is correspondingly provided. In comparison with the circular model corrently available, the new model takes the similarity shape to an original defect, the two-dimensional distributional characteristic of defects, the feature of a layout routing and the character of yield estimation into account. As for the aspect of prediction of yield, the experimental results show that the new model may predict the yield caused by real defects more accurately than the circular model does. It is significant that the yield is accurately estimated and improved using the proposed model.展开更多
A mathematical model of resin flow and temperature variation in the filling stage of the resin transfer molding (RTM) is developed based on the control volume/finite element method (CV/FEM). The effects of the heat tr...A mathematical model of resin flow and temperature variation in the filling stage of the resin transfer molding (RTM) is developed based on the control volume/finite element method (CV/FEM). The effects of the heat transfer and chemical reaction of the resin on the flow and temperature are considered. The numerical algorithm of the resin flow and temperature variation in the process of RTM are studied. Its accuracy and convergence are analyzed. The comparison of temperature variations between experimental results and model predictions is carried out for two RTM cases. Result shows that the model is efficient for evaluating the flow and temperature variation in the filling stage of RTM and there is a good coincidence between theory and experiment.展开更多
文摘In integrated circuits, the defects associated with photolithography are assumed to be in the shape of circular discs in order to perform the estimation of yield and fault analysis. However,real defects exhibit a great variety of shapes. In this paper,a novel yield model is presented and the critical area model of short circuit is correspondingly provided. In comparison with the circular model corrently available, the new model takes the similarity shape to an original defect, the two-dimensional distributional characteristic of defects, the feature of a layout routing and the character of yield estimation into account. As for the aspect of prediction of yield, the experimental results show that the new model may predict the yield caused by real defects more accurately than the circular model does. It is significant that the yield is accurately estimated and improved using the proposed model.
文摘A mathematical model of resin flow and temperature variation in the filling stage of the resin transfer molding (RTM) is developed based on the control volume/finite element method (CV/FEM). The effects of the heat transfer and chemical reaction of the resin on the flow and temperature are considered. The numerical algorithm of the resin flow and temperature variation in the process of RTM are studied. Its accuracy and convergence are analyzed. The comparison of temperature variations between experimental results and model predictions is carried out for two RTM cases. Result shows that the model is efficient for evaluating the flow and temperature variation in the filling stage of RTM and there is a good coincidence between theory and experiment.
