The MacCormack method is applied to the analysis of multiconductor transmission lines by intro- ducing a new technique that does not require decoupling. This method can be used to analyze a wide range of problems and ...The MacCormack method is applied to the analysis of multiconductor transmission lines by intro- ducing a new technique that does not require decoupling. This method can be used to analyze a wide range of problems and does not have to consider the matrix forms of distributed parameters. We have developed soft- ware named MacCormack Transmission Line Analyzer based on the proposed method. Numerical examples are presented to demonstrate the accuracy and efficiency of the method and illustrate its application to analyz- ing multiconductor transmission lines.展开更多
In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package(DIP) and ball grid array(BGA) for optoelectronics are model...In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package(DIP) and ball grid array(BGA) for optoelectronics are modeled and thermally simulated, their thermal characterizations are compared and discussed by using the temperature contours and the simulated heating characterization curves in free air and forced air ambient. The results show that BGA has superior inside and outside total performances, and has the promising future in the highly integrated optoelectronics.展开更多
文摘The MacCormack method is applied to the analysis of multiconductor transmission lines by intro- ducing a new technique that does not require decoupling. This method can be used to analyze a wide range of problems and does not have to consider the matrix forms of distributed parameters. We have developed soft- ware named MacCormack Transmission Line Analyzer based on the proposed method. Numerical examples are presented to demonstrate the accuracy and efficiency of the method and illustrate its application to analyz- ing multiconductor transmission lines.
基金National Defense Foundation of China(51419020401 HK01)
文摘In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package(DIP) and ball grid array(BGA) for optoelectronics are modeled and thermally simulated, their thermal characterizations are compared and discussed by using the temperature contours and the simulated heating characterization curves in free air and forced air ambient. The results show that BGA has superior inside and outside total performances, and has the promising future in the highly integrated optoelectronics.
