Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to ...Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the jtnction to aluminten metal plate, considering input power of IFD module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED fighting modules.展开更多
In order to reduce product development cycle time, aerospace companies tend to develop various correlations integrating geometric and performance parameters. This paper covers the development of a parameterization mod...In order to reduce product development cycle time, aerospace companies tend to develop various correlations integrating geometric and performance parameters. This paper covers the development of a parameterization modeling, to be used in the preliminary design phase, for the turbine cover plate of an aero-engine. The parameterization modeling of the turbine cover plate is achieved by using commercial CAD （computer aided design） software processing in batch mode. Two main approaches are presented the outer face and the skeleton models. These models can then be integrated into an iterative process for designing optimal shapes. Both models are capable of reproducing existing cover plate with reasonable accuracy in relatively shorter time periods. However, the skeleton approach provides probably the best results in terms of flexibility and accuracy, but increases programming complexity and requires greater run times.展开更多
文摘Multichip on Ahnnintnn Metal Plate（MOAMP） technology with simple structure and low thermal resistance is developed for effective heat reratrval of Light Emitting Diode（LED） p-n junction and LED lighting module to have high reliability. The thermal resistance of LED modules was numerical and experimental. Thermal resistance from the jtnction to aluminten metal plate, considering input power of IFD module using MOAMP technology, is 3.02 K/W, 3.23 K/W for the measured and calculated, respectively. We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED fighting modules.
文摘In order to reduce product development cycle time, aerospace companies tend to develop various correlations integrating geometric and performance parameters. This paper covers the development of a parameterization modeling, to be used in the preliminary design phase, for the turbine cover plate of an aero-engine. The parameterization modeling of the turbine cover plate is achieved by using commercial CAD （computer aided design） software processing in batch mode. Two main approaches are presented the outer face and the skeleton models. These models can then be integrated into an iterative process for designing optimal shapes. Both models are capable of reproducing existing cover plate with reasonable accuracy in relatively shorter time periods. However, the skeleton approach provides probably the best results in terms of flexibility and accuracy, but increases programming complexity and requires greater run times.
