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TA12钛合金电子束焊接组织性能及残余应力分析 被引量:22
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作者 付鹏飞 黄锐 +1 位作者 刘方军 左从进 《焊接学报》 EI CAS CSCD 北大核心 2007年第2期82-84,共3页
采用电子束焊接TA12钛合金薄板焊缝表面成形良好,焊缝区以马氏体组织为主,细小的稀土相呈均匀弥散分布状态;随着距焊缝距离的增加,稀土相尺寸逐渐增大,数量逐渐减少,并逐渐趋于球形,沿接头呈一定的规律性分布。小孔法残余应力测试结果表... 采用电子束焊接TA12钛合金薄板焊缝表面成形良好,焊缝区以马氏体组织为主,细小的稀土相呈均匀弥散分布状态;随着距焊缝距离的增加,稀土相尺寸逐渐增大,数量逐渐减少,并逐渐趋于球形,沿接头呈一定的规律性分布。小孔法残余应力测试结果表明,垂直于焊缝方向残余应力以纵向应力主,应力呈梯度分布,横向应力较低;焊缝区为纵向拉应力区,应力峰值低于其屈服强度,横向应力为较小的压应力;沿焊缝试板中心区(±20 mm范围内)焊接残余应力分布趋于稳定。 展开更多
关键词 TA12钛合金 电子束焊接 稀土相 残杂应力
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FE颗粒密度对CU-FE-P合金残余应力影响的数值模拟
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作者 苏娟华 许莹莹 +2 位作者 禹兴胜 陈钢 刘平 《特种铸造及有色合金》 CAS CSCD 北大核心 2006年第2期90-92,共3页
采用弹塑性有限元方法建立力学模型,模拟分析微观状态下的引线框架材料CU-FE-P合金局部铁颗粒密集区的残余应力分布,重点分析了颗粒密度对材料残余应力的影响。结果表明,颗粒密度越大则界面附近CU基体和铁颗粒的残余应力越大,并且在X方... 采用弹塑性有限元方法建立力学模型,模拟分析微观状态下的引线框架材料CU-FE-P合金局部铁颗粒密集区的残余应力分布,重点分析了颗粒密度对材料残余应力的影响。结果表明,颗粒密度越大则界面附近CU基体和铁颗粒的残余应力越大,并且在X方向FE颗粒处于压缩,CU基体主要处于拉伸状态;Y方向则是FE颗粒受拉伸,CU基体由拉伸变化到压缩状态。因此在两种反向残余应力作用下,界面两侧的应力差也越大,甚至导致界面处被撕裂,材料表面起皮,影响带材性能的发挥。 展开更多
关键词 Fe颗粒 CU-FE-P合金 有限元法 残杂应力
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Evaluation on residual stresses of silicon-doped CVD diamond films using X-ray diffraction and Raman spectroscopy 被引量:10
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作者 陈苏琳 沈彬 +2 位作者 张建国 王亮 孙方宏 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2012年第12期3021-3026,共6页
The effect of silicon doping on the residual stress of CVD diamond films is examined using both X-ray diffraction (XRD) analysis and Raman spectroscopy measurements. The examined Si-doped diamond films are deposited o... The effect of silicon doping on the residual stress of CVD diamond films is examined using both X-ray diffraction (XRD) analysis and Raman spectroscopy measurements. The examined Si-doped diamond films are deposited on WC-Co substrates in a home-made bias-enhanced HFCVD apparatus. Ethyl silicate (Si(OC2H5)4) is dissolved in acetone to obtain various Si/C mole ratio ranging from 0.1% to 1.4% in the reaction gas. Characterizations with SEM and XRD indicate increasing silicon concentration may result in grain size decreasing and diamond [110] texture becoming dominant. The residual stress values of as-deposited Si-doped diamond films are evaluated by both sin2ψ method, which measures the (220) diamond Bragg diffraction peaks using XRD, with ψ-values ranging from 0° to 45°, and Raman spectroscopy, which detects the diamond Raman peak shift from the natural diamond line at 1332 cm-1. The residual stress evolution on the silicon doping level estimated from the above two methods presents rather good agreements, exhibiting that all deposited Si-doped diamond films present compressive stress and the sample with Si/C mole ratio of 0.1% possesses the largest residual stress of ~1.75 GPa (Raman) or ~2.3 GPa (XRD). As the silicon doping level is up further, the residual stress reduces to a relative stable value around 1.3 GPa. 展开更多
关键词 silicon-doped diamond films silicon doping residual stress X-ray diffraction Raman spectroscopy
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