Silicon bulk etching is an important part of micro-electro-mechanical system(MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide(TMAH) solution heat...Silicon bulk etching is an important part of micro-electro-mechanical system(MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide(TMAH) solution heated up to boiling point. The monocrystalline silicon wafer is positioned over the solution surface and can be anisotropically etched by the produced vapor. This etching method does not rely on the expensive vacuum equipment used in dry etching. Meanwhile, it presents several advantages like low roughness, high etching rate and high uniformity compared with the conventional wet etching methods. The etching rate and roughness can reach 2.13 μm/min and 1.02 nm, respectively. Furthermore,the diaphragm structure and Al-based pattern on the non-etched side of wafer can maintain intact without any damage during the back-cavity fabrication. Finally, an etching mechanism has been proposed to illustrate the observed experimental phenomenon. It is suggested that there is a water thin film on the etched surface during the solution evaporation. It is in this water layer that the ionization and etching reaction of TMAH proceed, facilitating the desorption of hydrogen bubble and the enhancement of molecular exchange rate. This new etching method is of great significance in the low-cost and high-quality micro-electromechanical system industrial fabrication.展开更多
The density,viscosity and refractive index of aqueous solutions of tetrabutylammonium hydroxide(TBAOH),piperazine(PZ) and their aqueous blends are determined at several temperatures(303.15 to 333.15 K).All these measu...The density,viscosity and refractive index of aqueous solutions of tetrabutylammonium hydroxide(TBAOH),piperazine(PZ) and their aqueous blends are determined at several temperatures(303.15 to 333.15 K).All these measured physicochemical properties decreases with an increase in temperature.The density data is used to calculate the coefficient of thermal expansion and excess molar volume of all aqueous binary and ternary solutions.The coefficient of thermal expansion increases with increase in temperatures and concentrations.The negativity of excess molar volume for all the aqueous solution decreased with increase in temperature.Each physical property is correlated with temperature by least square method and the corresponding coefficients for each property are presented.The prediction values from correlations for the physical properties are in good agreement with the experimental values.展开更多
基金supported by the National Natu-ral Science Foundation of China(No.51675493 and No.51975542)the National Key R&D Program of China(No.2018YFF0300605,No.2019YFF0301802,and No.2019YFB2004802)Program for the Outstanding Innovative Teams of Higher Learning Institutions of Shanxi and Shanxi"1331 Project"Key Subject Construction(1331KSC).
文摘Silicon bulk etching is an important part of micro-electro-mechanical system(MEMS) technology. In this work, a novel etching method is proposed based on the vapor from tetramethylammonium hydroxide(TMAH) solution heated up to boiling point. The monocrystalline silicon wafer is positioned over the solution surface and can be anisotropically etched by the produced vapor. This etching method does not rely on the expensive vacuum equipment used in dry etching. Meanwhile, it presents several advantages like low roughness, high etching rate and high uniformity compared with the conventional wet etching methods. The etching rate and roughness can reach 2.13 μm/min and 1.02 nm, respectively. Furthermore,the diaphragm structure and Al-based pattern on the non-etched side of wafer can maintain intact without any damage during the back-cavity fabrication. Finally, an etching mechanism has been proposed to illustrate the observed experimental phenomenon. It is suggested that there is a water thin film on the etched surface during the solution evaporation. It is in this water layer that the ionization and etching reaction of TMAH proceed, facilitating the desorption of hydrogen bubble and the enhancement of molecular exchange rate. This new etching method is of great significance in the low-cost and high-quality micro-electromechanical system industrial fabrication.
基金the CO2 Management (MOR) research group of Universiti TeknologiPETRONAS for providing the financial support and facilities
文摘The density,viscosity and refractive index of aqueous solutions of tetrabutylammonium hydroxide(TBAOH),piperazine(PZ) and their aqueous blends are determined at several temperatures(303.15 to 333.15 K).All these measured physicochemical properties decreases with an increase in temperature.The density data is used to calculate the coefficient of thermal expansion and excess molar volume of all aqueous binary and ternary solutions.The coefficient of thermal expansion increases with increase in temperatures and concentrations.The negativity of excess molar volume for all the aqueous solution decreased with increase in temperature.Each physical property is correlated with temperature by least square method and the corresponding coefficients for each property are presented.The prediction values from correlations for the physical properties are in good agreement with the experimental values.
