The surface of silicon was passivated by A1203 and acidify using nitric acid with SiOx as the bi-layer, it was expected that hydrogen bonding reduce interface states and negative field effect which yields maximum pass...The surface of silicon was passivated by A1203 and acidify using nitric acid with SiOx as the bi-layer, it was expected that hydrogen bonding reduce interface states and negative field effect which yields maximum passivation. By optimizing the thickness of passivation layer and annealing condition, the minority carrier lifetime of p-type single crystalline Czochralski wafer could be improved from 10 μs to 190 μs. The formation and variation of hillock defect on passivation layer was founded to be affected by the thermal annealing temperature. For the purpose of obtaining high minority carrier lifetime and low hillock defect density simultaneously, using a lower heating and cooling speed in thermal annealing process is suggested.展开更多
文摘The surface of silicon was passivated by A1203 and acidify using nitric acid with SiOx as the bi-layer, it was expected that hydrogen bonding reduce interface states and negative field effect which yields maximum passivation. By optimizing the thickness of passivation layer and annealing condition, the minority carrier lifetime of p-type single crystalline Czochralski wafer could be improved from 10 μs to 190 μs. The formation and variation of hillock defect on passivation layer was founded to be affected by the thermal annealing temperature. For the purpose of obtaining high minority carrier lifetime and low hillock defect density simultaneously, using a lower heating and cooling speed in thermal annealing process is suggested.
