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SMSP新增TSMC0.25μm CMOS Mixed-Mode工艺
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《集成电路应用》 2002年第9期32-32,共1页
关键词 上海多项目晶圆支援计划 SMSP CMOS工艺流片 特点 ICC
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10A/300V JBS整流管设计 被引量:3
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作者 闫丽红 王永顺 刘缤璐 《电子科技》 2018年第8期31-34,共4页
在研究功率肖特基整流管的基础上,为提高反向击穿电压、漏电流、抗浪涌能力,采用加场限环的方法,设计并制造了10 A/300 V结势垒肖特基整流管(JBS)。从有源区参数、外延材料、流片工艺、产品电参数、可靠性等方面进行了全面设计。经测试... 在研究功率肖特基整流管的基础上,为提高反向击穿电压、漏电流、抗浪涌能力,采用加场限环的方法,设计并制造了10 A/300 V结势垒肖特基整流管(JBS)。从有源区参数、外延材料、流片工艺、产品电参数、可靠性等方面进行了全面设计。经测试,电参数水平正向电压VF为0.85~0.856 V,反向电流IR为4~50.5μA,反向电压VR为307.5~465.2 V,抗静电水平从低温退火的6~12 kV提高到15 kV,经高温直流老化后,可靠性电参数水平满足预期的设计要求。 展开更多
关键词 反向击穿电压 场限环 外延材料 流片工艺
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市场风云
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《电子产品与技术》 2004年第9期6-12,共7页
关键词 Synopsys公司 智芯科技公司 流片工艺 飞兆半导体公司 中国市场
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红外遥控电路中455kHz陶瓷谐振电路的设计 被引量:1
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作者 李北建 傅兴华 何智杰 《电子设计应用》 2005年第10期80-82,共3页
本文根据红外遥控电路的特性,设计了低功耗的455kHz振荡电路,经过多次试验和计算机仿真,采用1.5μmCMOS工艺流片成功,参数达到设计要求。
关键词 振荡电路 红外遥控 陶瓷谐振器 计算机仿真 工艺流片 CMOS 集成电路
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Process Optimization of Vacuum Fried Rice-Straw Mushroom (Volvariella Volvacea) Stem Chip Making 被引量:1
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作者 Subarea Suryatman Adil Basuki Ahza 《Journal of Food Science and Engineering》 2016年第3期109-120,共12页
The study was aimed to obtain the optimum conditions for vacuum frying and predicting the moisture lost during rice straw mushrooms stem chip production. The raw materials were obtained from the local farmer around th... The study was aimed to obtain the optimum conditions for vacuum frying and predicting the moisture lost during rice straw mushrooms stem chip production. The raw materials were obtained from the local farmer around the campus. A completely randomized factorial experimental design and Duncan's multiple range tests were used to achieve the objectives. Three temperatures, i.e. 80, 90 and 100 ℃ and five frying time, i.e. 3, 6, 9, and 15 minutes with a 2 mm slice thickness were studied to determine the optimum condition and predict the moisture decrease. Results showed that the vacuum frying time in general affects the chips color and oil uptake significantly (p 〈 0.01) and correlated with the moisture decrease. The chips moisture content decline significantly after vacuum frying at 90 ℃ and 100 ℃ for 3 minutes. While for the 80 ℃ vacuum frying, the significant decrease of moisture occurred due to the increase of vacuum frying time from 3 to 6 minutes (p 〈 0.01). The optimum conditions for a 2 mm slice thickness chips making are vacuum frying at 100 ℃ for 3 minutes. The chips moisture lost followed generally a two-stage of falling rate pattern during vacuum frying, and each could be well predicted by an exponential equation (R2 = 0.99). 展开更多
关键词 Fried rice straw moisture lost process optimization vacuum frying.
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