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紧凑型荧光灯涂粉技术及设备的研究
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作者 汪伟民 《中国照明电器》 2002年第5期14-16,共3页
关键词 紧凑型荧光灯 涂粉技术 设备 研究
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荧光灯
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《中国照明电器光源灯具文摘》 2001年第1期33-36,共4页
关键词 荧光灯 涂粉技术 涂粉工艺 丁脂涂粉工艺 放电现象
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Preparation of copper-coated fine molybdenum powders with electroless technique 被引量:1
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作者 王光君 王德志 +1 位作者 周杰 吴壮志 《Journal of Harbin Institute of Technology(New Series)》 EI CAS 2009年第3期386-390,共5页
The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was s... The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively, 2,2'-bipyridyl and PEG as double stabilizers, the Mo powders are coated with copper successfully with little Cu20 contained, at the same time, Mo-Cu composite powders with copper content of 15 - 85 wt% can be obtained. The optimal values of pH, temperature and HCHO concentration are 12 -13, 60 -65 ℃ and 22 -26 mL/L, respectively. 展开更多
关键词 Mo-Cu electroless copper plating POWDERS
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