The Al0.3CoCrFeNi high-entropy alloy(HEA)particles reinforced Cu matrix composites(CMCs)were fabricated by mechanical alloying and sintering.Transition layer structure was obtained by multi-step ball milling to invest...The Al0.3CoCrFeNi high-entropy alloy(HEA)particles reinforced Cu matrix composites(CMCs)were fabricated by mechanical alloying and sintering.Transition layer structure was obtained by multi-step ball milling to investigate the related influence on element diffusion behavior and wear properties of CMCs.The results indicate that a new Cu transition layer is generated,and the thickness is about 5μm.Cr element diffuses into the interface via the transition layer,which forms the complex oxide.Because of the structure of Cu transition layer,the diffusion rates of Ni,Co and Fe increase,especially the Ni element.The wear resistance of CMCs is improved by 30%,which is due to the improvement of interface bonding strength,compared with the CMCs without transition layer.This method is applicable to the development of advanced HEA reinforced metallic matrix composites.展开更多
基金Projects(51701061,51705129) supported by the National Natural Science Foundation of ChinaProject(17391001D) supported by the Department of Science and Technology of Hebei Province,ChinaProject(2017-Z02) supported by the State Key Lab of Advanced Metals and Materials,China
文摘The Al0.3CoCrFeNi high-entropy alloy(HEA)particles reinforced Cu matrix composites(CMCs)were fabricated by mechanical alloying and sintering.Transition layer structure was obtained by multi-step ball milling to investigate the related influence on element diffusion behavior and wear properties of CMCs.The results indicate that a new Cu transition layer is generated,and the thickness is about 5μm.Cr element diffuses into the interface via the transition layer,which forms the complex oxide.Because of the structure of Cu transition layer,the diffusion rates of Ni,Co and Fe increase,especially the Ni element.The wear resistance of CMCs is improved by 30%,which is due to the improvement of interface bonding strength,compared with the CMCs without transition layer.This method is applicable to the development of advanced HEA reinforced metallic matrix composites.
