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热阴极径向温度非均匀性对本征发射度的影响 被引量:2
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作者 彭宇飞 秦臻 +6 位作者 张篁 陈弹蛋 刘平 杨安民 李建北 龙继东 石金水 《强激光与粒子束》 EI CAS CSCD 北大核心 2018年第3期127-131,共5页
从热发射理论出发,推导了非均匀发射阴极的均方根本征发射度的一般计算形式。针对一种最常见的温度径向分布近似模型,给出了均方根发射度随温度非均匀性变化趋势的理论数值解。基于有限差分法粒子仿真技术统计了热阴极的本征发射度,仿... 从热发射理论出发,推导了非均匀发射阴极的均方根本征发射度的一般计算形式。针对一种最常见的温度径向分布近似模型,给出了均方根发射度随温度非均匀性变化趋势的理论数值解。基于有限差分法粒子仿真技术统计了热阴极的本征发射度,仿真结果与理论解一致,验证了非均匀发射热阴极本征均方根发射度一般形式的正确性。结果表明,径向温度非均匀性引起均方根发射度显著变化,非均匀系数为10%时引起均方根发射度下降约15%。本文建立的理论形式和仿真方法可以有效评估束流品质控制目标和工程热设计之间的依赖关系,以指导高效费比的工程设计。 展开更多
关键词 热阴极 有限差分电磁场粒子仿真 本征发射度 温度非均匀性 阴极寿命
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大功率脉管制冷机的温度非均匀性(英文)
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作者 Kai FANG Li-min QIU +2 位作者 Xiao JIANG Zhi-hua GAN Ning-xiang TONG 《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 SCIE EI CAS CSCD 2015年第11期910-921,共12页
目的:大功率脉管制冷机中存在的温度非均匀性问题导致回热器效率低下,严重阻碍制冷机性能的提高。本文回顾回热器非均匀性问题的理论与试验研究,对当前理论与实验的研究结果进行细致的分类与探讨,并展望将来非均匀性研究可能的发展方向... 目的:大功率脉管制冷机中存在的温度非均匀性问题导致回热器效率低下,严重阻碍制冷机性能的提高。本文回顾回热器非均匀性问题的理论与试验研究,对当前理论与实验的研究结果进行细致的分类与探讨,并展望将来非均匀性研究可能的发展方向。方法:1.当前回热器非均匀性理论与实验研究主要包括形成机理、发展机制和抑制方法三个方面。其中对其形成机理和发展机制的研究以理论为主,抑制方法的研究以实验为主。2.回热器温度非均匀性的形成机理,按照其诱发因素的来源可划分为内源性与外源性因素,其中内源性因素包括与回热器相关和变径流道等,外源性因素包括自然对流效应及外界温度扰动。3.发展机制主要认为是气体粘度与温度之间的正向关系导致的回热器内温度与流阻的正反馈效应。4.抑制方法主要是增加回热器内径向热导率,阻断其发展机制,或增加回热器长径比,抑制其影响范围。结论:1.温度非均匀性形成机制复杂,为多因素耦合作用;2.气体粘度与温度之间的正向关系导致的回热器内温度与流阻的正反馈效应是导致非均匀性发展的主要因素;3.增加回热器径向热导率和回热器长径比可有效抑制非均匀性。 展开更多
关键词 温度非均匀性 内部流 大功率 脉管制冷机
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Time-temperature-property curves for quench sensitivity of 6063 aluminum alloy 被引量:6
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作者 李红英 曾翠婷 +2 位作者 韩茂盛 刘蛟蛟 鲁晓超 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2013年第1期38-45,共8页
The quench sensitivity of 6063 alloy was investigated via constructing time-temperature-property(TTP) curves by interrupted quenching technique and transmission electron microscopy(TEM) analysis.The results show t... The quench sensitivity of 6063 alloy was investigated via constructing time-temperature-property(TTP) curves by interrupted quenching technique and transmission electron microscopy(TEM) analysis.The results show that the quench sensitivity of 6063 alloy is lower than that of 6061 or 6082 alloy,and the critical temperature ranges from 300 to 410℃ with the nose temperature of about 360℃.From TEM analysis,heterogeneous precipitate β-Mg2Si is prior to nucleate on the(AlxFeySiz) dispersoids in the critical temperature range,and grows up most rapidly at the nose temperature of 360℃.The heterogeneous precipitation leads to a low concentration of solute,which consequently reduces the amount of the strengthening phase β'' after aging.In the large-scale industrial production of 6063 alloy,the cooling rate during quenching should be enhanced as high as possible in the quenching sensitive temperature range(410-300℃) to suppress the heterogeneous precipitation to get optimal mechanical properties,and it should be slowed down properly from the solution temperature to 410℃ and below 300℃ to reduce the residual stress. 展开更多
关键词 6063 aluminum alloy quench sensitivity HARDNESS time-temperature-property curve strengthening phase heterogeneous precipitation residual stress
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Quenching sensitivity and heterogeneous precipitation behavior of AA7136 alloy 被引量:3
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作者 Zhi-min MA Yong ZHANG +2 位作者 Sheng-dan LIU Yun-lai DENG Xin-ming ZHANG 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第11期3356-3369,共14页
The quenching sensitivity of AA7136 alloy was investigated by time−temperature−property(TTP)diagrams,and the heterogeneous precipitation behavior during isothermal holding was investigated using scanning electron micr... The quenching sensitivity of AA7136 alloy was investigated by time−temperature−property(TTP)diagrams,and the heterogeneous precipitation behavior during isothermal holding was investigated using scanning electron microscopy,scanning transmission electron microscopy and high resolution transmission electron microscopy.Based on 99.5%TTP diagram,the nose temperature is determined to be about 346℃ with the transformation time of about 0.245 s.The precipitation ofη(MgZn_(2)),T(Al_(2)Zn_(3)Mg_(3)),S(Al_(2)CuMg)or Cu−Zn-rich Y phases can be found depending on isothermal holding temperature and time,and it is described in a time−temperature−precipitation diagram.The size and area fraction of isothermal holding induced phase particles increase,which results in the decrease of hardness of samples after aging.The quantitative contribution to loss of hardness by grain boundaries/subgrain boundaries and dispersoids in the matrix is discussed based on the amount of heterogeneous precipitation related to them. 展开更多
关键词 AA7136 alloy quenching sensitivity time−temperature−property diagrams heterogeneous precipitation
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Effects of thermal transport properties on temperature distribution within silicon wafer
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作者 王爱华 牛义红 +1 位作者 陈铁军 P.F.HSU 《Journal of Central South University》 SCIE EI CAS 2014年第4期1402-1410,共9页
A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface... A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level. 展开更多
关键词 silicon wafer thermal transport properties temperature distribution radiation heat transfer
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