On the basis of mutual compensation of mobility and threshold voltage temperature effects, a stable CMOS band-gap voltage reference circuit was designed and fabricated in CSMC-HJ 0.6 μm CMOS technology. Operating fro...On the basis of mutual compensation of mobility and threshold voltage temperature effects, a stable CMOS band-gap voltage reference circuit was designed and fabricated in CSMC-HJ 0.6 μm CMOS technology. Operating from 0 to 85 ℃ under a supply voltage ranging from 4.5 to 5.5 V, the voltage reference circuit offers an output reference voltage ranging from 1.122 to 1.176 V and a voltage variation less than ±3.70%. The chip size including bonding pads is only 0.4 mm×0.4 mm and the power dissipation falls inside the scope of 28.3 to 48.8 mW operating at a supply voltage of 4.5 to 5.5 V.展开更多
The melt filling difficulty in micro cavity is one of the main challenges for micro-injection molding (MIM). An approach employing ultrasound in MIM was proposed. The approach was extensively studied through experimen...The melt filling difficulty in micro cavity is one of the main challenges for micro-injection molding (MIM). An approach employing ultrasound in MIM was proposed. The approach was extensively studied through experiments with a home-made experimental ultrasonic plastification device. The results of the experiments show that polymer ultrasonic plastification speed increases with ultrasonic supply voltage and plastification pressure. When the ultrasonic supply voltage is 200 V and the plastification pressure is 2.0 MPa, the polymer ultrasonic plastification speed reaches the maximum value of 0.111 1 g/s. The results also indicate that the ultrasonic cavitation effect is the most significant effect of all the three effects during polymer ultrasonic plastification process.展开更多
文摘On the basis of mutual compensation of mobility and threshold voltage temperature effects, a stable CMOS band-gap voltage reference circuit was designed and fabricated in CSMC-HJ 0.6 μm CMOS technology. Operating from 0 to 85 ℃ under a supply voltage ranging from 4.5 to 5.5 V, the voltage reference circuit offers an output reference voltage ranging from 1.122 to 1.176 V and a voltage variation less than ±3.70%. The chip size including bonding pads is only 0.4 mm×0.4 mm and the power dissipation falls inside the scope of 28.3 to 48.8 mW operating at a supply voltage of 4.5 to 5.5 V.
基金Project(107086)supported by the Key Program of Chinese Ministry of EducationProject(2009)supported by the Graduate Degree Thesis Innovation Foundation of Central South University,China
文摘The melt filling difficulty in micro cavity is one of the main challenges for micro-injection molding (MIM). An approach employing ultrasound in MIM was proposed. The approach was extensively studied through experiments with a home-made experimental ultrasonic plastification device. The results of the experiments show that polymer ultrasonic plastification speed increases with ultrasonic supply voltage and plastification pressure. When the ultrasonic supply voltage is 200 V and the plastification pressure is 2.0 MPa, the polymer ultrasonic plastification speed reaches the maximum value of 0.111 1 g/s. The results also indicate that the ultrasonic cavitation effect is the most significant effect of all the three effects during polymer ultrasonic plastification process.
