With the scale of integration and operation speed of modern ICs increasing,a series of thermo-related problems arise.Hot spots,which are due to the uneven distribution of heat,invalidate some functions of the chip.An ...With the scale of integration and operation speed of modern ICs increasing,a series of thermo-related problems arise.Hot spots,which are due to the uneven distribution of heat,invalidate some functions of the chip.An algorithm is presented to calculate the profile.With the boundary element method,3D problems are converted into 2D ones,so the temperatures of both the chip surface and inner points can be calculated quickly.This algorithm can be used to evaluate the thermal quality of a definite chip.展开更多
文摘With the scale of integration and operation speed of modern ICs increasing,a series of thermo-related problems arise.Hot spots,which are due to the uneven distribution of heat,invalidate some functions of the chip.An algorithm is presented to calculate the profile.With the boundary element method,3D problems are converted into 2D ones,so the temperatures of both the chip surface and inner points can be calculated quickly.This algorithm can be used to evaluate the thermal quality of a definite chip.
