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3D异构集成的多层级协同仿真 被引量:1
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作者 曾燕萍 张景辉 +1 位作者 朱旻琦 顾林 《电子与封装》 2021年第10期53-71,共19页
3D异构集成技术是未来电子行业的关键技术,促使电子系统朝着高性能、低延迟、小尺寸、轻质量、低功耗和低成本的方向发展。然而,随着信号传输速率和带宽的提高,异构集成系统各层级之间的相互干扰愈发显著,亟需多层级的协同仿真技术来捕... 3D异构集成技术是未来电子行业的关键技术,促使电子系统朝着高性能、低延迟、小尺寸、轻质量、低功耗和低成本的方向发展。然而,随着信号传输速率和带宽的提高,异构集成系统各层级之间的相互干扰愈发显著,亟需多层级的协同仿真技术来捕获这种干扰,从而避免多次迭代造成的经济和时间成本增加。多层级协同建模和仿真技术可实现跨芯片-封装-系统领域的多层级协同开发以及跨电学、热学、机械学的多物理场协同分析,是实现3D异构集成的重要保障。介绍了异构集成协同仿真的基本概念,详述了协同仿真关键技术的发展和研究现状,总结了协同仿真的挑战和发展趋势。 展开更多
关键词 3D异构集成 多层级协同仿真 参数提取 信号完整性 热力协同分析
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CFD Study on Local Fluid-to-Wall Heat Transfer in Packed Beds and Field Synergy Analysis 被引量:4
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作者 PENG Wenping XU Min +1 位作者 HUAI Xiulan LIU Zhigang 《Journal of Thermal Science》 SCIE EI CAS CSCD 2016年第2期161-170,共10页
To reach the target of smaller pressure drop and better heat transfer performance, packed beds with small tube-to-particle diameter ratio(D/dp<10) have now been considered in many areas. Fluid-to-wall heat transfer... To reach the target of smaller pressure drop and better heat transfer performance, packed beds with small tube-to-particle diameter ratio(D/dp<10) have now been considered in many areas. Fluid-to-wall heat transfer coefficient is an important factor determining the performance of this type of beds. In this work, local fluid-to-wall heat transfer characteristic in packed beds was studied by Computational Fluid Dynamics(CFD) at different Reynolds number for D/dp=1.5, 3.0 and 5.6. The results show that the fluid-to-wall heat transfer coefficient is oscillating along the bed with small tube-to-particle diameter ratio. Moreover, this phenomenon was explained by field synergy principle in detail. Two arrangement structures of particles in packed beds were recommended based on the synergy characteristic between flow and temperature fields. This study provides a new local understanding of fluid-to-wall heat transfer in packed beds with small tube-to-particle diameter ratio. 展开更多
关键词 Packed bed Fluid-to-wall heat transfer Field synergy principle Computational fluid dynamics Heat transfer intensification
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