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热壁CVD法GaN微晶粒的制备
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作者 薛成山 魏芹芹 +2 位作者 孙振翠 曹文田 董志华 《科学技术与工程》 2003年第3期269-271,274,共4页
用热壁CVD法在Si(111)衬底上生长GaN薄膜,用扫描电镜(SEM)观察发现在表面上有大量微晶粒,这些晶粒的直径在2-4μm之间。用扫描电镜(SEM)、选区电子衍射(SAED)、X射线衍射谱(XRD)、傅里叶红外透射谱(FTIR)、光致荧光谱(PL)对样品进行了... 用热壁CVD法在Si(111)衬底上生长GaN薄膜,用扫描电镜(SEM)观察发现在表面上有大量微晶粒,这些晶粒的直径在2-4μm之间。用扫描电镜(SEM)、选区电子衍射(SAED)、X射线衍射谱(XRD)、傅里叶红外透射谱(FTIR)、光致荧光谱(PL)对样品进行了结构、组分及发光特性分析。结果表明:这些微晶粒为GaN六方铅锌矿。 展开更多
关键词 GaN微晶粒 制备方法 热壁cvd 氮化镓薄膜 薄膜结构 发光特性
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热壁CVD制备铂薄膜的沉积室内壁材料选择研究
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作者 李颖 胡劲 +3 位作者 武晋文 王玉天 于晓东 谭成文 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2016年第2期445-448,共4页
选择合适的沉积室内壁材料是热壁化学气相沉积制备Pt薄膜过程中降低前驱体在沉积室内壁上大量消耗,进而保证沉积室内Pt前驱体分压的关键。本研究对比了Pt在镍基高温合金,备选沉积室内壁材料——有氧化层的Cu以及紫铜表面的沉积的难易程... 选择合适的沉积室内壁材料是热壁化学气相沉积制备Pt薄膜过程中降低前驱体在沉积室内壁上大量消耗,进而保证沉积室内Pt前驱体分压的关键。本研究对比了Pt在镍基高温合金,备选沉积室内壁材料——有氧化层的Cu以及紫铜表面的沉积的难易程度,发现在有氧化层的Cu的表面Pt薄膜很难沉积,因此当镍基高温合金为沉积基体时有氧化层的Cu可以作为热壁CVD的沉积室内壁衬底材料,但是只能一次性使用。 展开更多
关键词 Pt薄膜 热壁cvd 沉积室内材料
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Micro-Raman Spectroscopy for Stress Evaluation of 3C-SiC Epitaxially Grown on Si Substrate by Hot Wall CVD
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作者 ZHUWen-liang ZHUJi-liang PEZZOTTIGiuseppe 《材料热处理学报》 EI CAS CSCD 北大核心 2004年第05B期803-806,共4页
A series of cubic SiC single crystals were heteroepitaxially grown by the hot-wall chemical vapor deposition (CVD) using a HMDS-C3H8-H2 system on 2 inch silicon substrates with the orientations of (100), (111), (110) ... A series of cubic SiC single crystals were heteroepitaxially grown by the hot-wall chemical vapor deposition (CVD) using a HMDS-C3H8-H2 system on 2 inch silicon substrates with the orientations of (100), (111), (110) and (211), respectively. Even though an initial carbonization was carried out to reduce the large lattice mismatch, residual stress could not be completely relieved, partly also due to the difference of their thermal expansion coefficients. Raman scattering studies for the specimens were performed to estimate the internal stress in the SiC epilayer and the substrate. Raman spectra were mapped out on the sample surface as well as on the cross section using an automated x-y stage with a spatial resolution capable of 100 nm. For all the samples, two Raman peaks corresponding to the transverse optical (TO) and longitudinal optical (LO) phonon modes were observed, even though the intensity varied with the polarization configurations. In the SiC epilayers, tensile stresses decrease away from the interface, while compressive stresses exist in the substrate, with the magnitudes dependent on the growth orientation. The lattice strains were discussed in terms of the elastic deformation theory for the comparison. 展开更多
关键词 显微喇曼光谱学 应力测定 3C-SIC 热壁cvd 外延生长
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Uniformity Investigation in 3C-SiC Epitaxial Layers Grown on Si Substrates by Horizontal Hot-Wall CVD
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作者 李家业 赵永梅 +6 位作者 刘兴昉 孙国胜 罗木昌 王雷 赵万顺 曾一平 李晋闽 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2007年第1期1-4,共4页
50mm 3C-SiC epilayers are grown on (100) and (111) Si substrates in a newly developed horizontal lowpressure hot-wall CVD reactor under different growth pressures and flow rates of H2 carrier gas. The structure,el... 50mm 3C-SiC epilayers are grown on (100) and (111) Si substrates in a newly developed horizontal lowpressure hot-wall CVD reactor under different growth pressures and flow rates of H2 carrier gas. The structure,electrical properties, and thickness uniformity of the 3C-SiC epilayers are investigated by X-ray diffraction (XRD) ,sheet resistance measurement, and spectroscopic ellipsometry. XRD patterns show that the 3C-SiC films have excellent crystallinity. The narrowest full widths at half maximum of the SIC(200) and (111) peaks are 0.41° and 0.21°, respectively. The best electrical uniformity of the 50mm 3C-SiC films obtained by sheet resistance measurement is 2.15%. A σ/mean value of ± 5.7% in thickness uniformity is obtained. 展开更多
关键词 3C-SIC heteroepitaxial growth horizontal hot-wall cvd UNIFORMITY
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Effect of Growth Time on Properties of GaN Micro-grains Grown by Hot-wall CVD Method
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作者 LIZhong WEIQin-qin +1 位作者 LILing XUECheng-shan 《Semiconductor Photonics and Technology》 CAS 2004年第3期182-185,共4页
GaN microcrystalline grains were grown by hot-wall chemical vapor deposition on Si(111)substrate.These grains with diameters of 2-4 μm were detected by scanning electron microscopy.X-ray diffraction,Fourier transform... GaN microcrystalline grains were grown by hot-wall chemical vapor deposition on Si(111)substrate.These grains with diameters of 2-4 μm were detected by scanning electron microscopy.X-ray diffraction,Fourier transformation infrared transmission spectroscopy and photoluminescence were used to analyze the structure, composition and the optical properties of the samples.The results show that the microcrystalline grains are hexagonal wurtzite GaN,and the property of the grains was greatly affected by the growth time. 展开更多
关键词 Hot-wall chemical vapor deposition GAN Micro-grains
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Homoepitaxial Growth and Characterization of 4H-SiC Epilayers by Low-Pressure Hot-Wall Chemical Vapor Deposition
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作者 孙国胜 高欣 +4 位作者 张永兴 王雷 赵万顺 曾一平 李晋闽 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2004年第12期1549-1554,共6页
Horizontal air-cooled low-pressure hot-wall CVD (LP-HWCVD) system is developed to get highly qualitical 4H-SiC epilayers.Homoepitaxial growth of 4H-SiC on off-oriented Si-face (0001) 4H-SiC substrates is performed at ... Horizontal air-cooled low-pressure hot-wall CVD (LP-HWCVD) system is developed to get highly qualitical 4H-SiC epilayers.Homoepitaxial growth of 4H-SiC on off-oriented Si-face (0001) 4H-SiC substrates is performed at 1500℃ with a pressure of 1.3×103Pa by using the step-controlled epitaxy.The growth rate is controlled to be about 1.0μm/h.The surface morphologies and structural and optical properties of 4H-SiC epilayers are characterized with Nomarski optical microscope,atomic force microscopy (AFM),X-ray diffraction,Raman scattering,and low temperature photoluminescence (LTPL).N-type 4H-SiC epilayers are obtained by in-situ doping of NH 3 with the flow rate ranging from 0.1 to 3sccm.SiC p-n junctions are obtained on these epitaxial layers and their electrical and optical characteristics are presented.The obtained p-n junction diodes can be operated at the temperature up to 400℃,which provides a potential for high-temperature applications. 展开更多
关键词 H-SiC HWcvd homoepitaxial growth off-oriented substrates
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N型4H-SiC同质外延生长 被引量:6
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作者 贾仁需 张义门 +1 位作者 张玉明 王悦湖 《物理学报》 SCIE EI CAS CSCD 北大核心 2008年第10期6649-6653,共5页
利用水平式低压热壁CVD(LP-HW-CVD)生长系统,台阶控制生长和衬底旋转等优化技术,在偏晶向的4H-SiCSi(0001)晶面衬底上进行4H-SiC同质外延生长,生长温度和压力分别为1550℃和104Pa,用高纯N2作为n型掺杂剂的4H-SiC原位掺杂技术,生长速率... 利用水平式低压热壁CVD(LP-HW-CVD)生长系统,台阶控制生长和衬底旋转等优化技术,在偏晶向的4H-SiCSi(0001)晶面衬底上进行4H-SiC同质外延生长,生长温度和压力分别为1550℃和104Pa,用高纯N2作为n型掺杂剂的4H-SiC原位掺杂技术,生长速率控制在5μm/h左右.采用扫描电镜(SEM)、原子力显微镜(AFM),傅里叶变换红外光谱(FTIR)和Hg/4H-SiC肖特基结构对同质外延表面形貌、厚度、掺杂浓度以及均匀性进行了测试.实验结果表明,4H-SiC同质外延在表面无明显缺陷,厚度均匀性1.74%,1.99%和1.32%(σ/mean),掺杂浓度均匀性为3.37%,2.39%和2.01%.同种工艺条件下,样品间的厚度和掺杂浓度误差为1.54%和3.63%,有很好的工艺可靠性. 展开更多
关键词 4H-SIC 同质外延生长 水平热壁cvd 均匀性
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