The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of t...The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.展开更多
Normal skylights bring light into the spaces located below them. By the use of IR （infrared radiation） transmissive polymer films and IR-emitting and absorbing gases, an advanced version of the skylight may supply p...Normal skylights bring light into the spaces located below them. By the use of IR （infrared radiation） transmissive polymer films and IR-emitting and absorbing gases, an advanced version of the skylight may supply passive cooling and thermal insulation to the room located below it. This novel radiative skylight can, in its cooling mode, lead heat from the room below, to the cool skies located above the skylight. When cooling is no longer needed or attainable, the skylight will in its cooling mode provide the room with an optimal amount of thermal resistance. This article is a progress reporting on the modeling of the skylight. The main work is done to combine the different heat transfer methods into one single model by the use of the commercial program Comsol 4.1. The results show that a cooling effect of 100 W/ma is achievable when the skylight is compared with a similar skylight containing only air.展开更多
Laminar natural convection heat transfer inside air-filled, rectangular enclosures partially heated from below and cooled at one side is studied numerically. A computational code based on the SIMPLE-C algorithm is use...Laminar natural convection heat transfer inside air-filled, rectangular enclosures partially heated from below and cooled at one side is studied numerically. A computational code based on the SIMPLE-C algorithm is used for the solution of the system of the mass, momentum, and energy transfer governing equations. Simulations are performed for a complete range of heater size, for Rayleigh numbers based on the height of the cavity ranging from 10~3to 10~6, and for height-to-width aspect ratios of the cavity spanning from 0.25 to 4. It is found that the heat transfer rate increases with increasing the heater size and the Rayleigh number, while it decreases with increasing the aspect ratio of the cavity. Dimensionless heat transfer correlations are also proposed.展开更多
This paper investigates the heat transfer characteristics of a thermoelectric generator. The influence of heat dissipation intensity to the sub-thermal resistances distribution is experimentally studied. Based on the ...This paper investigates the heat transfer characteristics of a thermoelectric generator. The influence of heat dissipation intensity to the sub-thermal resistances distribution is experimentally studied. Based on the thermal network analysis and finite time thermodynamics, an analytical model including all thermal resistances (in both thermocouples and external heat exchangers) is developed to predict the performance of the generator. The results show that the computed values of output power agree well with the experimental values. The heat transfer enhancement on the generator cold side greatly reduces the cold side temperature and thermal resistance, and obviously improves the output power. Compare with air natural convection cooling, the main thermal resistance changes from the resistance between the fins and the ambient to the thermal contact resistances between the generator and the heat sink at the conditions of forced convection and water cooling. This study may be guide the optimization of generator structure.展开更多
Forced convective heat transfer in micro-rectangular channels can be described by a group of twodimensional differential equations. These equations take the conduction in microchannel wb along the direction of flow of...Forced convective heat transfer in micro-rectangular channels can be described by a group of twodimensional differential equations. These equations take the conduction in microchannel wb along the direction of flow of coolants into account, which are more generalized than those which neglect the conduction. For the same reason, they are suitable particularly for gases-cooled microchannels.With only numerical solution to the equations till today, an approximate analytic solution is derived here. From this solution, a rather simple formula can be introduced bober, by which the differences between considering the conduction and neglecting it are easily found. In addition, the rcasonableness of the classical fin method is also discussed. An experimental example of air-cooled microchannels is illustrated.展开更多
文摘The continuing increase in IC （Integrated Circuit） power levels and microelectronics packaging densities has resulted in the need for detailed considerations of the heat sink design for integrated circuits. One of the major components in the heat sink is the heat spreader which must be designed to effectively conduct the heat dissipated from the chip to a system of fins or extended surfaces for convective heat transfer to a flow of coolant. The heat spreader design must provide the capability to dissipate the thermal energy generated by the chip. However, the design of the heat spreader is also dependent on the convection characteristics of the fins within the heat sink, as well the material and geometry of the heat spreader. This paper focuses on the optimization of heat spreaders in a heat sink for safe and efficient performance of electronic circuits. The results of the study show that, for air-cooled electronics, the convective effects may dominate the thermal transport performance of the heat spreader in the heat sink.
文摘Normal skylights bring light into the spaces located below them. By the use of IR （infrared radiation） transmissive polymer films and IR-emitting and absorbing gases, an advanced version of the skylight may supply passive cooling and thermal insulation to the room located below it. This novel radiative skylight can, in its cooling mode, lead heat from the room below, to the cool skies located above the skylight. When cooling is no longer needed or attainable, the skylight will in its cooling mode provide the room with an optimal amount of thermal resistance. This article is a progress reporting on the modeling of the skylight. The main work is done to combine the different heat transfer methods into one single model by the use of the commercial program Comsol 4.1. The results show that a cooling effect of 100 W/ma is achievable when the skylight is compared with a similar skylight containing only air.
文摘Laminar natural convection heat transfer inside air-filled, rectangular enclosures partially heated from below and cooled at one side is studied numerically. A computational code based on the SIMPLE-C algorithm is used for the solution of the system of the mass, momentum, and energy transfer governing equations. Simulations are performed for a complete range of heater size, for Rayleigh numbers based on the height of the cavity ranging from 10~3to 10~6, and for height-to-width aspect ratios of the cavity spanning from 0.25 to 4. It is found that the heat transfer rate increases with increasing the heater size and the Rayleigh number, while it decreases with increasing the aspect ratio of the cavity. Dimensionless heat transfer correlations are also proposed.
基金supported by The Major Technology Special Program of Guangdong Province(Grant No.2008A080302002 and 2010A080405003)
文摘This paper investigates the heat transfer characteristics of a thermoelectric generator. The influence of heat dissipation intensity to the sub-thermal resistances distribution is experimentally studied. Based on the thermal network analysis and finite time thermodynamics, an analytical model including all thermal resistances (in both thermocouples and external heat exchangers) is developed to predict the performance of the generator. The results show that the computed values of output power agree well with the experimental values. The heat transfer enhancement on the generator cold side greatly reduces the cold side temperature and thermal resistance, and obviously improves the output power. Compare with air natural convection cooling, the main thermal resistance changes from the resistance between the fins and the ambient to the thermal contact resistances between the generator and the heat sink at the conditions of forced convection and water cooling. This study may be guide the optimization of generator structure.
文摘Forced convective heat transfer in micro-rectangular channels can be described by a group of twodimensional differential equations. These equations take the conduction in microchannel wb along the direction of flow of coolants into account, which are more generalized than those which neglect the conduction. For the same reason, they are suitable particularly for gases-cooled microchannels.With only numerical solution to the equations till today, an approximate analytic solution is derived here. From this solution, a rather simple formula can be introduced bober, by which the differences between considering the conduction and neglecting it are easily found. In addition, the rcasonableness of the classical fin method is also discussed. An experimental example of air-cooled microchannels is illustrated.
