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厚膜基板上热沉辅助芯片焊接技术
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作者 吕晓云 叶晓飞 +4 位作者 黄栋 席亚莉 史凤 司艳 张艳 《电子工艺技术》 2022年第6期342-344,353,共4页
借助Flotherm计算仿真和热红外成像技术,探究厚膜混合集成电路中厚膜基板上金属热沉辅助功率芯片焊接技术的可行性。研究表明,在厚膜基板上使用金属热沉辅助芯片焊接后可以将芯片和基板的结壳热阻降低20%以上,热阻降低的多少主要与热沉... 借助Flotherm计算仿真和热红外成像技术,探究厚膜混合集成电路中厚膜基板上金属热沉辅助功率芯片焊接技术的可行性。研究表明,在厚膜基板上使用金属热沉辅助芯片焊接后可以将芯片和基板的结壳热阻降低20%以上,热阻降低的多少主要与热沉材料的材料类型、热沉尺寸有关。经过工艺可靠性验证,目前市面上MoCu热沉材料(Mo70Cu30和Mo80Cu20)可以满足厚膜混合集成电路厚膜基板上的焊接可靠性需求,而具体选用的热沉材料和尺寸需要综合考虑材料的兼容性和产品可靠性。 展开更多
关键词 厚膜混合集成电路 热沉辅助 焊接可靠性
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石墨片作辅助热沉的高功率半导体激光器热传导特性 被引量:8
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作者 房俊宇 石琳琳 +4 位作者 张贺 杨智焜 徐英添 徐莉 马晓辉 《发光学报》 EI CAS CSCD 北大核心 2019年第7期907-914,共8页
为使边发射高功率单管半导体激光器有源区温度降低,增加封装结构的散热性能,降低器件封装成本,提出一种采用高热导率的石墨片作为辅助热沉的高功率半导体激光器封装结构。利用有限元分析研究了采用石墨片作辅助热沉后,封装器件的工作热... 为使边发射高功率单管半导体激光器有源区温度降低,增加封装结构的散热性能,降低器件封装成本,提出一种采用高热导率的石墨片作为辅助热沉的高功率半导体激光器封装结构。利用有限元分析研究了采用石墨片作辅助热沉后,封装器件的工作热阻更低,散热效果更好。研究分析过渡热沉铜钨合金与辅助热沉石墨的宽度尺寸变化对半导体激光器有源区温度的影响。新型封装结构与使用铜钨合金作为过渡热沉的传统结构相比,有源区结温降低4.5K,热阻降低0.45K/W。通过计算可知,激光器的最大输出功率为20.6W。在研究结果的指导下,确定铜钨合金与石墨的结构尺寸,以达到最好的散热效果。 展开更多
关键词 半导体激光器 性能 石墨辅助 有限元分析 封装结构
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Microstructures and formation mechanism of headstand pyrocarbon cones developed by electromagnetic-field-assisted CVD 被引量:3
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作者 涂川俊 黄启忠 +2 位作者 张明瑜 赵新奇 陈江华 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2012年第10期2569-2577,共9页
Novel headstand pyrocarbon cones (HPCs) with hollow structure were developed on the surfaces of pyrocarbon layers of the carbon/carbon (C/C) composites at 650-750 °C by the electromagnetic-field-assisted chem... Novel headstand pyrocarbon cones (HPCs) with hollow structure were developed on the surfaces of pyrocarbon layers of the carbon/carbon (C/C) composites at 650-750 °C by the electromagnetic-field-assisted chemical vapor deposition in the absence of catalysts. The fine microstructures of the HPCs were characterized by high-resolution transmission electron microscopy. The results show that the textural features of the HPCs directly transfer from turbostratic structure in roots to a well-ordered high texture in stems. And the degree of high texture ordering decreases gradually from the stem to the tail of the HPCs. The formation mechanism of the HPCs was inferred as the comprehensive effect of polarization induction on electromagnetic fields and particle-filler property under disruptive discharge. 展开更多
关键词 headstand pyrocarbon cones chemical vapor deposition electromagnetic-field-assisted method fine microstructure formation mechanism
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Numerical study of thermal history in laser aided direct metal deposition process 被引量:8
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作者 ZHANG YongJie YU Gang HE XiuLi 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS 2012年第8期1431-1438,共8页
Temperature evolution in the laser aided direct metal deposition (LADMD) process has considerable influence on the micro-structure and properties of the final part. A 3D transient finite element model was developed to... Temperature evolution in the laser aided direct metal deposition (LADMD) process has considerable influence on the micro-structure and properties of the final part. A 3D transient finite element model was developed to study the temperature evolution during the multilayer LADMD process. To make the property analysis from thermal history easier, a critical temperature specific to thermal history was defined and the distribution of it in the part was also discussed. The simulation results indicated that the critical temperature can make the property analysis from thermal history easier. Thermal history of all the deposited materials was similar. It was also concluded that process parameters needed to be time-varying according to the real-time temperature field during the process. 展开更多
关键词 laser-aided direct metal deposition finite element modeling thermal history
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