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半导体热电发电元件的优化分析 被引量:1
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作者 许伟明 李瑜煜 姚丽丽 《计算机仿真》 北大核心 2018年第3期65-70,共6页
半导体热发电元件的输出功率与转换效率主要由热电材料热电参数决定;对热电参数的温度特性进行研究,可为热电材料应用研究提供理论基础。文中对热电元件的优化设计进行了仿真研究,充分考虑了温度对热电元件性能的影响,在热电仿真模型的... 半导体热发电元件的输出功率与转换效率主要由热电材料热电参数决定;对热电参数的温度特性进行研究,可为热电材料应用研究提供理论基础。文中对热电元件的优化设计进行了仿真研究,充分考虑了温度对热电元件性能的影响,在热电仿真模型的基础上,利用温度相关模型求解热电元件的温度分布、输出功率与转换效率,以此对热电参数的温度特性进行详细的分析,并结合热电效应进行阐述。研究结果表明,热电仿真模型若不引入与温度相关的热电参数在热电性能预测和趋势预测方面均有欠缺;而引入与温度相关的热电参数后,模型求解的结果与实际情况相符,更能反映热电元件的实际规律。同时还发现了碲化铋热电元件转换效率及输出功率的最佳温差区间。此外,在与温度相关的热电参数中,不同的参数对输出功率、转换效率和温度分布的影响程度均有所不同。 展开更多
关键词 热电发电元件 热电仿真模型 热电参数 热电性能
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Modeling and Simulation of Heat Transfer through an Electric Wire
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作者 Ahmed Mohamed Krima Hesham Gehad Ibrahim 《Computer Technology and Application》 2011年第1期1-8,共8页
This paper illustrates the use of a general purpose differential equation (DE) solver called FlexPDE for the solution heat transfer problems in electric wire. FlexPDE uses the finite element method for the solution ... This paper illustrates the use of a general purpose differential equation (DE) solver called FlexPDE for the solution heat transfer problems in electric wire. FlexPDE uses the finite element method for the solution of boundary and initial value problems. A flexible input of the governing DE's and of material properties functions allows the simulation of non-linear variable behavior quickly and inexpensively. A modeling of temperature distribution in one-dimensional problem, a cross section of an electric wire was simulated. Comparison of those results obtained by FlexPDE with analytical and numerical solutions are done. The results compared well with those obtained from the analytical and numerical methods. The adaptability of the FlexPDE software for solving a variety of problem types was clearly demonstrated. 展开更多
关键词 MODELING heat transfer numerical solution finite element FlexPDE.
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System-level simulation of microbolometer and read-out integrated circuit
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作者 CHEN Chao JIANG YaDong +2 位作者 ZHANG Long ZHOU Yun ZHENG Xing 《Science China(Technological Sciences)》 SCIE EI CAS CSCD 2015年第5期907-915,共9页
A method for system-level simulation between microbolometer designing and Read-Out Integrated Circuit(ROIC) was studied. Three-dimensional(3D) structure modeling of the microbolometer was built. Thermal capacity, ther... A method for system-level simulation between microbolometer designing and Read-Out Integrated Circuit(ROIC) was studied. Three-dimensional(3D) structure modeling of the microbolometer was built. Thermal capacity, thermal conductivity and resistance of the model were obtained from thermoelectric coupling Finite Element Method(FEM) based on the model. An electrical equipment circuit of microbolometer which contains these three parameters was established. By using Verilog-AMS language, the electrical equipment circuit was described as a reduced-order macro-model. Then, the reduced-order macromodel was compiled in cadence to form IP unit of microbolometer, which could be used and identified in cadence. Systemlevel simulation between microbolometer and ROIC was accomplished. Key performances of the device, including input and output characteristics, were obtained in simulation and verified by experimental results. 展开更多
关键词 verified pixel Verilog histogram NETD accomplished Figure capacitance captured designing
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