Because it is complex and inconvenient to use the common temperature field calculating method and experiment method, for arialyzing heat transfer properties of laser diode module （LDM）, an equivalent electrical netw...Because it is complex and inconvenient to use the common temperature field calculating method and experiment method, for arialyzing heat transfer properties of laser diode module （LDM）, an equivalent electrical network method is presented in this paper. Simulation results show that the temperature stability is closely related to ambient temperature, heat sink, LDM current and TEC current. Ambient temperature and TEC controller are the dominant terms effecting on temperature control in practice,展开更多
Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming an...Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering.The wick could be divided into two parts for liquid capillary pumping flow:groove sintered zone and uniform sintered zone.Both of the thermal resistance network model and the maximum heat transfer capability model of GSHP were built.Compared with the theoretical values,the heat transfer limit and thermal resistance of GSHP were measured from three aspects:copper powder size,wick thickness and number of micro grooves.The results show that the wick thickness has the greatest effect on the thermal resistance of GSHP while the copper powder size has the most important influence on the heat transfer limit.Given certain copper powder size and wick thickness,the thermal resistance of GSHP can be the lowest when micro-groove number is about 55.展开更多
An equivalent electrical network method is presented in this paper to analyze the cooling characteristics of a laser diode module (LDM).And a modified equivalent model of a thermoelectric cooler (TEC) with an adjuncti...An equivalent electrical network method is presented in this paper to analyze the cooling characteristics of a laser diode module (LDM).And a modified equivalent model of a thermoelectric cooler (TEC) with an adjunctive thermal resistance and a contact resistance is proposed.The performance of a commercial TEC has been simulated.The thermal analysis of a LDM incorporated with a TEC has been performed by using an equivalent circuit model of the LDM.In the analysis the change of LD current,TEC current,and the ambient temperature are all considered.It shows that the equivalent circuit approach is an effective tool for the qualitative analysis of TEC and LDM.展开更多
文摘Because it is complex and inconvenient to use the common temperature field calculating method and experiment method, for arialyzing heat transfer properties of laser diode module （LDM）, an equivalent electrical network method is presented in this paper. Simulation results show that the temperature stability is closely related to ambient temperature, heat sink, LDM current and TEC current. Ambient temperature and TEC controller are the dominant terms effecting on temperature control in practice,
基金Project(51205423)supported by the National Natural Science Foundation of ChinaProject(2012M510205)supported by China Postdoctoral Science Foundation+1 种基金Project(S2012040007715)supported by Natural Science Foundation of Guangdong Province,ChinaProject(20120171120036)supported by New Teachers’Fund for Doctor Stations,Ministry of Education,China
文摘Some novel grooved-sintered composite wick heat pipes(GSHP) were developed for the electronic device cooling.The grooved-sintered wicks of GSHP were fabricated by the processes of oil-filled high-speed spin forming and solid state sintering.The wick could be divided into two parts for liquid capillary pumping flow:groove sintered zone and uniform sintered zone.Both of the thermal resistance network model and the maximum heat transfer capability model of GSHP were built.Compared with the theoretical values,the heat transfer limit and thermal resistance of GSHP were measured from three aspects:copper powder size,wick thickness and number of micro grooves.The results show that the wick thickness has the greatest effect on the thermal resistance of GSHP while the copper powder size has the most important influence on the heat transfer limit.Given certain copper powder size and wick thickness,the thermal resistance of GSHP can be the lowest when micro-groove number is about 55.
文摘An equivalent electrical network method is presented in this paper to analyze the cooling characteristics of a laser diode module (LDM).And a modified equivalent model of a thermoelectric cooler (TEC) with an adjunctive thermal resistance and a contact resistance is proposed.The performance of a commercial TEC has been simulated.The thermal analysis of a LDM incorporated with a TEC has been performed by using an equivalent circuit model of the LDM.In the analysis the change of LD current,TEC current,and the ambient temperature are all considered.It shows that the equivalent circuit approach is an effective tool for the qualitative analysis of TEC and LDM.
