用热膜测速仪测量水平管内气液泡状流的液相速度和紊流结构

对热膜测速仪应用于气液两相泡状流中的测量方法进行了研究。提出了一套全新的相鉴别技术,用此方法对水平管内的气液两相泡状流的液相速度和紊流强度进行了测量。并对液相水质及温度对测量结果的影响进行了探讨。实验结果表明,在水平管泡状流中,靠管道下部液流速度和紊流强度分布与单相液流的分布差别不大;管道上部较多的气泡使两相液流速度明显低于单相液流速度,增强了紊流强度;使紊流强度分布在r/R=0.5附近有一峰值。

水平管内气液两相泡状流壁面切应力的实验测量

利用TSI-1268W热膜探针测量了内径为35mm的水平管内气液两相泡状流的壁面切应力,得到了充分发展段上壁面切应力沿周向的分布数据。测量结果表明,液相中加入气泡后,在管道下部的壁面切应力增大,在含气率较高的管道上部出现了壁面切应力减小的现象。随着气相流速的增加,管道上部的壁面切应力有较小幅度的降低,管道中下部的壁面切应力有较大幅度的增加。

Skin temperature measurement method

To improve the accuracy of skin temperature measurements in thermal comfort research,a new measurement method based on a new thermometer is proposed.A platinum film resistance（Pt1000）sensor of the thermometer is welded on a printed circuit board to eliminate the heat loss from the leads and avoid the influence of the surrounding thermal environment.In order to determine the suitable thickness of the board,a steady heat conduction model is established.The simulation results reveal that when the thickness of the board is 0.2 mm,the influence of the surrounding air can be effectively prevented and the skin temperature does not obviously increase.The experimental results of verification show that the maximum measurement error of the skin temperature measured by the thermometer is 0.24 ℃,and the average measurement error of the skin temperature is 0.04 ℃.The proposed method provides an effective and reliable option for the skin temperature measurement in thermal comfort research.

A new measurement method of crack propagation rate for brittle rock under THMC coupling condition

A new electrical method of conductive carbon-film(with waterproof and anticorrosion ability)was proposed to continuously measure crack propagation rate of brittle rock under THMC coupling condition.A self-designed coupling testing system was used to conduct THMC coupling fracture tests of the pre-cracked red sandstone specimens(where the temperature is only changed)by this new electrical method of conductive carbon-film.Calculation results obtained by the energy method coincide well with the test results.And the higher the temperature is,the earlier the crack is initiated and the larger the crack propagation rate and accelerated velocity are,which can prove the validity of the new electrical method.This new electrical method has advantages of continuously measuring crack propagation rate over the conventional electrical,optical and acoustic methods,and can provide important basis for safety assessment and cracking-arrest design of deep rock mass engineering.

Measurement of thickness and heat transfer coefficient of water film out of tube in an evaporative air cooler

Thickness of falling water film out of tubes is one of critical factors of heat transfer of evaporative air cooler. A new method of resistance measurement was developed to measure thickness of the film. When the resistance probe on the tip of micrometer touches the surface and bottom of the film, two corresponding sudden reductions of resistance occurs, and the difference of two graduations on the micrometer displays the thickness of the film. The film thickness of eleven angles was measured in five kinds of water flows and results varies from 0.8933mm to 1.7233 mm. Mean thickness and mean heat transfer coefficient of the film out of the tube was calculated.

Ultrafast Electron Diffraction with Spatiotemporal Resolution of Atomic Motion

Ultrafast electron diffraction （UED） is a rapidly advancing technique capable of recording the atomic-detail structural dynamics in real time. We report the establishment of the first UED system in China. Employing this UED apparatus, both the coherent and the concurrent thermal lattice motions in an aluminium thin-film, trigged by ultrafast laser heating, have been observed. These results demonstrate its ability to directly measure a sub-milli-angstrom lattice spacing change on a sub-picosecond time scale.

Measurement of the thermal transport properties of dielectric thin films using the micro-Raman method

The micro-Raman method is a non-contact and non-destructive method for thermal conductivity measurement.To reduce the measurement error induced by the poor fit of the basic equation of the original micro-Raman method,we developed a new basic equation for the heat source of a Gaussian laser beam.Based on the new basic equation,an analytical heat transfer model has been built to extend the original micro-Raman method to thin films with submicrometer-or nanometer-scale thickness.Ex-periments were performed to measure the thermal conductivity of dielectric thin films with submicrometer-or nanometer-scale thickness.The thermal resistance of the interface between dielectric thin films and their silicon substrate was also obtained.The obtained thermal conductivity of silicon dioxide film is 1.23W/(m.K),and the interface thermal resistance between silicon dioxide film and substrate is 2.35×10-8m2.K/W.The thermal conductivity and interface thermal resistance of silicon nitride film are 1.07W/(m.K)and 3.69×10-8m2.K/W,respectively.The experimental results are consistent with reported data.