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硅通孔3D互连热-力可靠性的研究与展望
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作者 吴鲁超 陆宇青 王珺 《电子与封装》 2024年第6期18-33,共16页
硅通孔(TSV)技术是3D集成封装中用于实现高密度、高性能互连的关键技术,TSV的热-力可靠性对3D集成封装的性能和寿命有直接影响。从TSV的制造工艺、结构布局、材料可靠性以及评估方法等多个方面对TSV 3D互连的热-力可靠性进行研究,对其... 硅通孔(TSV)技术是3D集成封装中用于实现高密度、高性能互连的关键技术,TSV的热-力可靠性对3D集成封装的性能和寿命有直接影响。从TSV的制造工艺、结构布局、材料可靠性以及评估方法等多个方面对TSV 3D互连的热-力可靠性进行研究,对其研究方法和研究现状进行总结和阐述。此外,针对TSV尺寸减小至纳米级的发展趋势,探讨了纳米级TSV在应用于先进芯片背部供电及更高密度的芯片集成时所面临的可靠性挑战。 展开更多
关键词 封装技术 硅通孔 3D互连 热-力可靠性
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Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag 被引量:1
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作者 周萍 胡炳亭 +1 位作者 周孑民 杨莺 《Journal of Central South University》 SCIE EI CAS 2009年第3期339-343,共5页
The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--... The experimental tests of tensile for lead-flee solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5 × 10^-5 to 2 × 10^-2s^-1, and its stress--strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right comer of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796 × 10^4 cycles under the calculated conditions. 展开更多
关键词 lead free solder Sn-3.5Ag alloy Sn-37Pb alloy constitutive model TENSILE FEM analysis thermal cycle reliability
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Mechanical Properties and Thermal Shock Resistance of SrAl_(2)Si_(2)O_(8) Reinforced BN Ceramic Composites
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作者 WANG Bo CAI Delong +7 位作者 ZHU Qishuai LI Daxin YANG Zhihua DUAN Xiaoming LI Yanan WANG Xuan JIA Dechang ZHOU Yu 《无机材料学报》 SCIE EI CAS CSCD 北大核心 2024年第10期1182-1188,共7页
Hexagonal boron nitride(h-BN)ceramics have become exceptional materials for heat-resistant components in hypersonic vehicles,owing to their superior thermal stability and excellent dielectric properties.However,their ... Hexagonal boron nitride(h-BN)ceramics have become exceptional materials for heat-resistant components in hypersonic vehicles,owing to their superior thermal stability and excellent dielectric properties.However,their densification during sintering still poses challenges for researchers,and their mechanical properties are rather unsatisfactory.In this study,SrAl_(2)Si_(2)O_(8)(SAS),with low melting point and high strength,was introduced into the h-BN ceramics to facilitate the sintering and reinforce the strength and toughness.Then,BN-SAS ceramic composites were fabricated via hot press sintering using h-BN,SrCO_(3),Al_(2)O_(3),and SiO_(2) as raw materials,and effects of sintering pressure on their microstructure,mechanical property,and thermal property were investigated.The thermal shock resistance of BN-SAS ceramic composites was evaluated.Results show that phases of as-preparedBN-SAS ceramic composites are h-BN and h-SrAl_(2)Si_(2)O_(8).With the increase of sintering pressure,the composites’densities increase,and the mechanical properties shew a rising trend followed by a slight decline.At a sintering pressure of 20 MPa,their bending strength and fracture toughness are(138±4)MPa and(1.84±0.05)MPa·m^(1/2),respectively.Composites sintered at 10 MPa exhibit a low coefficient of thermal expansion,with an average of 2.96×10^(-6) K^(-1) in the temperature range from 200 to 1200℃.The BN-SAS ceramic composites prepared at 20 MPa display higher thermal conductivity from 12.42 to 28.42 W·m^(-1)·K^(-1) within the temperature range from room temperature to 1000℃.Notably,BN-SAS composites exhibit remarkable thermal shock resistance,with residual bending strength peaking and subsequently declining sharply under a thermal shock temperature difference ranging from 600 to 1400℃.The maximum residual bending strength is recorded at a temperature difference of 800℃,with a residual strength retention rate of 101%.As the thermal shock temperature difference increase,the degree of oxidation on the ceramic surface and cracks due to thermal stress are also increased gradually. 展开更多
关键词 BN MATRIX composite hot-press SINTERING mechanical PROPERTY thermal shock resistance service reliability
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