期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
硅溶胶表面的烯键修饰研究
1
作者 崔青青 林德海 +5 位作者 孔令涛 吴官正 陈清松 李晓燕 赖寿莲 丁富传 《化工新型材料》 CAS CSCD 北大核心 2018年第1期182-184,共3页
以醋酸为催化剂,乙醇为分散剂,先将偶联剂KH-570经溶胶-凝胶过程,生成表面带烯键的硅溶胶,再将其与工业化生产的常见硅溶胶共混,经过两种硅溶胶的交换、陈化等过程,使得工业化生产的常见硅溶胶的表面带上烯键,实现对工业化硅溶胶表面的... 以醋酸为催化剂,乙醇为分散剂,先将偶联剂KH-570经溶胶-凝胶过程,生成表面带烯键的硅溶胶,再将其与工业化生产的常见硅溶胶共混,经过两种硅溶胶的交换、陈化等过程,使得工业化生产的常见硅溶胶的表面带上烯键,实现对工业化硅溶胶表面的烯键修饰。通过傅里叶红外光谱(FT-IR)、扫描电子显微镜(SEM)和热重分析(TGA)等表征手段对修饰改性前后的硅溶胶样品进行了表征。结果表明:硅烷偶联剂KH-570的不饱和烯键成功接枝到纳米硅溶胶的表面。 展开更多
关键词 硅溶胶 硅烷偶联剂KH-570 烯键修饰
下载PDF
Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn-Ag-Cu composite solder joints 被引量:6
2
作者 Yong-dian HAN Jia-hang YANG +2 位作者 Lian-yong XU Hong-yang JING Lei ZHAO 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2021年第8期2454-2467,共14页
To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0... To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process,Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density(1.0×10^(4) A/cm^(2))for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn-Ag-Cu(SAC/AgGNSs)solder joints.The experimental results showed that Ag-GNSs were homogenously dispersed in the solder joints,providing more Cu6 Sn5 grain nucleation sites,which refined these grains and reduced the thickness difference at the anode and cathode.In addition,the Cu6 Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag-GNSs and constitutional supercooling.The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag-GNSs and the microstructural changes. 展开更多
关键词 transient current bonding Ag-GNS Cu6Sn5 shear strength
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部