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中性溶液中焊料-铜 电偶腐蚀缓蚀剂的研究 被引量:1
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作者 张天红 徐仲斌 杜存山 《腐蚀科学与防护技术》 CAS CSCD 1994年第1期104-107,共4页
研究了在中性介质中,焊料-铜的接触腐蚀及苯骈三氮唑、液体硅酸钠的缓蚀效果。结果表明焊料-铜短接时,苯骈三氮唑、液体硅酸钠能明显减小阳极金属焊料的腐蚀。苯骈三氮唑、液体硅酸钠加入内燃机车冷却水添加剂配方中,抑制焊料电偶... 研究了在中性介质中,焊料-铜的接触腐蚀及苯骈三氮唑、液体硅酸钠的缓蚀效果。结果表明焊料-铜短接时,苯骈三氮唑、液体硅酸钠能明显减小阳极金属焊料的腐蚀。苯骈三氮唑、液体硅酸钠加入内燃机车冷却水添加剂配方中,抑制焊料电偶腐蚀。 展开更多
关键词 缓蚀剂 焊料-铜 电偶腐蚀
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铜含量对锡-铜无铅焊料和镍之间固态老化反应的影响
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作者 W.T.Chen R.Y.Ysai Y.L.Lin C.R.Kao 《现代表面贴装资讯》 2003年第3期35-41,共7页
共晶99.3Sn-0.7Cu焊料(比重:%,Sn-0.7Cu)是波峰焊接中共晶Sn-Pb焊料的最有前途的无铅替代物。而镍则被用于几个商品化的重要表面涂覆领域,如象;金/镍和钯/镍等。据文献报道,在含镍表面涂层上实施Sn-Cu焊料的再流时,铜含量... 共晶99.3Sn-0.7Cu焊料(比重:%,Sn-0.7Cu)是波峰焊接中共晶Sn-Pb焊料的最有前途的无铅替代物。而镍则被用于几个商品化的重要表面涂覆领域,如象;金/镍和钯/镍等。据文献报道,在含镍表面涂层上实施Sn-Cu焊料的再流时,铜含量的微小变化会产生完全不同的反应物[1,2]。随着铜浓度的上升,反应物从(Ni 1-xCux)3Sn4转变为(Cu1-yNiy)6Sn5+(Ni1-xCu)3Sn4,而后变为(Cu1-y、NiY)6Sn5。在本项目的研究中,我们将自己在前期研究成果的基础上[2],对铜含量的细微变化对Sn-Cu焊料和镍之间固态老化反应的影响进行了更加深入的研究。特别是在160、180和225℃下,将四种Sn-xCu焊料(x=0.2、0.4、0.6和0.7)与镍进行了反应。结果发现,在经充足时间的高温固态老化后,对铜沉积层的明显感应性消失了。对于各种不同的铜含量的研究发现,老化后在界面上形成相同类型的金属间化合物。在界面上可看到在(Ni1-x)(Cux)3Sn4层上形成了一层(Cu1-yNiY)6Sn5。研究表明再流焊一结束金属间化合物的最初差别可在高温老化后消失。(Cu1-yNiY)6Sn5与(Ni1-xCux)3Sn4的生长机理是不同的,本文中已指出了这一点。 展开更多
关键词 Sn—Cu 界面反应 表面涂层 -无铅焊料 固态老化反应
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Microstructure and mechanical properties of dissimilar Al-Cu joints by friction stir welding 被引量:9
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作者 张秋征 宫文彪 刘威 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第6期1779-1786,共8页
Dissimilar friction stir welding between 1060 aluminum alloy and annealed pure copper sheet with a thickness of 3 mm was investigated. Sound weld was obtained at a rotational speed of 1050 r/min and a welding speed of... Dissimilar friction stir welding between 1060 aluminum alloy and annealed pure copper sheet with a thickness of 3 mm was investigated. Sound weld was obtained at a rotational speed of 1050 r/min and a welding speed of 30 mm/min. Intercalation structure formed at the crown and Cu/weld nugget (WN) area promotes interracial diffusion and metallurgical bonding of aluminum and copper. However, corrosion morphology reveals the weak bonding mechanism of internal interface, which causes the joint failing across the interface with a brittle-ductile mixed fracture mode. The tensile strength of the joint is 148 MPa, which is higher than that of the aluminum matrix. Crystal defects and grain refinement by severely plastic deformation during friction stir welding facilitate short circuit diffusion and thus accelerate the formation of A14Cu9 and A12Cu intermetallic compounds (IMCs). XRD results show that A14Cu9 is mainly in Cu/WN transition zone. The high dislocation density and formation of dislocation loops are the major reasons of hardness increase in the WN. 展开更多
关键词 aluminum alloy COPPER friction stir welding dissimilar material microstructure mechanical properties
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Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate 被引量:3
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作者 卢斌 栗慧 +2 位作者 王娟辉 朱华伟 焦羡贺 《Journal of Central South University of Technology》 EI 2008年第3期313-317,共5页
The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is... The formation and the growth of Cu-Sn intermetallic compound (IMC) layer at the interface between Sn-3.0Ag-0.5Cu-xCe solder and Cu substrate during soldering and aging were studied. The results show that Cu6Sn5 IMC is observed at the interface between solder and Cu substrate in all conditions. After aging for 120 h,the Cu3Sn IMC is then obtained. With increasing aging time,the scalloped Cu6Sn5 structure changes to a plate structure. The Cu3Sn film always forms with a relatively planar interface. By adding a small amount of the rare earth element Ce (only 0.1%,mass fraction) into the Sn-3.0Ag-0.5Cu solder alloy,the growth rate of the Cu-Sn IMC at the interface of solder alloy system is decreased. When the time exponent is approximately 0.5,the growth of the IMC layer is mainly controlled by a diffusion over the studied time range. 展开更多
关键词 intermetallic compound INTERFACE Sn-3.0Ag-0.5Cu solder rare earth element
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Effect of filler metal on microstructure and mechanical properties of manganese-aluminum bronze repair welds 被引量:2
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作者 M.R.MIRZADEHRAHNI B.BEIDOKHTI M.HADDAD-SABZEVAR 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2017年第3期507-513,共7页
The repair welding of UNS C95700manganese?aluminum bronze plates was done using different filler metals.Themicrostructure and mechanical properties of welds were studied.The main microstructural constituents wereα,β... The repair welding of UNS C95700manganese?aluminum bronze plates was done using different filler metals.Themicrostructure and mechanical properties of welds were studied.The main microstructural constituents wereα,βandκphases withdifferent morphologies.The addition of manganese decreased the percentage ofαphase in the microstructure of weldments from80%(Mn-free weld)to57%(12.5%Mn weld,mass fraction).The morphology ofκphase was lamellar in high nickel specimens andit was changed to a globular morphology for high manganese welds.Although the application of high manganese filler metal yieldedthe higher tensile and bending strengths of weldment compared with the weld using high nickel filler material,the optimummechanical properties of repair welds were obtained using a non-alloy filler material(ERCuAl-A2)for the underlay and highmanganese filler metal(ERCuMnNiAl)for filling passes.This weld presented an increase of39%in tensile strength compared withthe base metal,and no cracking was observed after bending test. 展开更多
关键词 manganese.aluminum bronze WELDING filler metal MICROSTRUCTURE mechanical properties
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Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints 被引量:2
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作者 赵国际 文光华 +1 位作者 盛光敏 景彦霞 《Journal of Central South University》 SCIE EI CAS CSCD 2016年第8期1831-1838,共8页
Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, ther... Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr. 展开更多
关键词 rapid solidification Sn-Zn-RE solder microstructure interfacial property
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Influence of welding parameters on material flow,mechanical property and intermetallic characterization of friction stir welded AA6063 to HCP copper dissimilar butt joint without offset 被引量:3
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作者 T.K.BHATTACHARYA H.DAS T.K.PAL 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第9期2833-2846,共14页
Joining of dissimilar aluminium-copper is an emerging area of interest for both research and industry due to its complex nature.Friction stir welding was attempted to evaluate the joint strength without offset at the ... Joining of dissimilar aluminium-copper is an emerging area of interest for both research and industry due to its complex nature.Friction stir welding was attempted to evaluate the joint strength without offset at the butt line between AA6063 to HCP copper sheet under different combination of rotational speed of 800 and 1000 r/min and travel speed of 20 and 40 mm/min.Material flow was studied in detail for different combinations of parameters with optical microscopy and elemental mapping by energy dispersive X-ray spectroscopy(EDS).The results were correlated with the microstructural characteristics and formation of intermetallics at the bond interface using microhardness test and X-ray diffraction(XRD) technique.Material flow clearly suggests that energy input at 800 r/min and 20 mm/min is sufficient to plasticize both the materials with formation of higher amount of thermodynamically stable and hard intermetallic phases Al4Cu9 and Al Cu4(slower cooling rate of 88 K/s) than that at 800 r/min and 40 mm/min(faster cooling rate of 154 K/s),attributed maximum joint strength(~78.6% of aluminium base metal). 展开更多
关键词 friction stir welding(FSW) AA6063 alloy HCP copper material flow
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Development of processing windows for friction stir spot welding of aluminium Al5052/copper C27200 dissimilar materials 被引量:1
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作者 S. SIDDHARTH T.SENTHILKUMAR M.CHANDRASEKAR 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2017年第6期1273-1284,共12页
Friction stir spot welding technique was used to join dissimilar combinations of aluminium alloy(Al5052)with copperalloy(C27200)and friction stir spot welding windows such as tool rotational speed–dwell time and tool... Friction stir spot welding technique was used to join dissimilar combinations of aluminium alloy(Al5052)with copperalloy(C27200)and friction stir spot welding windows such as tool rotational speed–dwell time and tool rotational speed?plungedepth diagrams for effective joining of these materials were developed.Using a central composite design model,empirical relationswere developed to predict the changes in tensile shear failure load values and interface hardness of the joints with three processparameters such as tool rotational speed,plunge depth and dwell time.The adequacy of the developed model was verified usingANOVA analysis at95%confidence level.Response surface methodology was used to optimize the developed model to maximizetensile strength and minimize interface hardness.A high tensile shear failure load value of3850N and low interface hardness valueof HV81was observed for joints made under optimum conditions,and validation experiments confirmed the high predictability ofthe developed model with error less than2%.The operating windows developed shall act as reference maps for future designengineers in choosing appropriate friction stir spot welding process parameter values to obtain good joints. 展开更多
关键词 friction stir spot welding dissimilar materials aluminium COPPER processing windows response surface methodology
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采用锡铅焊膏粘接的Sn—Ag—Cu BGA元件的焊点可靠性
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《现代表面贴装资讯》 2003年第1期20-28,共9页
在转向无铅电子产品过程中,元件供应商可能需要支持无铅和合铅元件的双线生产。而这可能合在生产制造中引起广泛的后勤问题。全部使用无铅元件是这个问题的一个解决方法。因此,用锡铅共晶焊膏粘接的Sn-Ag—Cu BGA元件的焊点可靠性需... 在转向无铅电子产品过程中,元件供应商可能需要支持无铅和合铅元件的双线生产。而这可能合在生产制造中引起广泛的后勤问题。全部使用无铅元件是这个问题的一个解决方法。因此,用锡铅共晶焊膏粘接的Sn-Ag—Cu BGA元件的焊点可靠性需加讨论。在这篇论文中介绍了对两种无铅封装:超细间距BGA(VFBGA)和层叠式CSP(SCSP)的焊点可靠性评估结果,它们是应用锡铅共晶焊膏贴在PCB板上。而这些封装都是采用不同的回流曲线在标准的锡铅组装条件下组装的。采用合保温区或斜升区的热度曲线。回流峰值温度为208℃和222℃。组装后PCB(称为板级)进行温度循环(-40℃—125℃,每个循环30分钟)和落体实验。下面将会详细叙述失效分析。 展开更多
关键词 锡铅焊膏 SN-AG-CU --焊料 可靠性 球栅阵列 无铅封装 电子制造
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