基于润湿平衡法测试连接器焊锡性

润湿平衡法测试焊锡性能精确的将润湿时间﹑沾锡力量等参数表示出来,较传统的以面积判断焊锡性好坏的方式更加直观。本文将从测试对象﹑测试方法﹑结果判断等多个方面详细介绍这一焊锡能力检测技朮。

不同条件下化学镍钯金的可焊性研究

可焊性是印制电路板组装产品极重要的性能之一。文章讨论了化学镍钯金(ENEPIG)的可焊性,首先对化学镍金(ENIG)和化学镍钯金的特点进行了对比,然后通过实验对影响产品焊接的可能因素进行了验证,得出钯层的有效控制能解决化学镍钯金的可焊性问题。

钯镀层结晶状态及焊锡能力研究

研究了电流密度、镀液温度及镀层厚度对磷青铜上钯镀层的焊锡性与润湿平衡的影响。钯镀层的晶粒尺寸随电流密度的增加或温度的升高而变大,但受膜厚的影响不大。镀态下,不同条件下制得的钯镀层具有良好的沾锡能力。不同活性助焊剂的使用也会影响钯镀层的焊锡性能。对于经蒸汽老化后的钯镀层,采用中等活性的松香助焊剂可获得比采用非活性松香助焊剂更好的焊锡性能。

Interfacial microstructure evolution and mechanical properties of Al/Sn joints by ultrasonic-assisted soldering

Soldering aluminum alloys at low temperature have great potential to avoid softening of base metals.Pure Al was solderedwith pure tin assisted by ultrasound.The influence of primaryα(Al)on the microstructure of Al/Sn interface and its bonding strengthwas studied.It is found that the primaryα(Al)in liquid tin tends to be octahedron enclosed by Al{111}facet with the lowest surfacefree energy and growth rate.The ultrasonic action could increase the nucleation rate and refine the particles of primaryα(Al).For thelonger ultrasonic and holding time,a large amount of the octahedral primaryα(Al)particles crystallize at the Al/Sn interface.Thebonding interface exhibits the profile of rough dentation,resulting in an increment of bonding interface area and the effect ofmechanical occlusion.The bonding strength at interface could reach63MPa with ultrasonic time of40s and holding time of10min.

耐高温尼龙聚邻苯二甲酰胺的研究进展

综述了聚邻苯二甲酰胺(PPA)的特性和应用,对部分PPA新品种制备方法及表征测试作了介绍,还介绍了PPA在耐热性、吸水性、尺寸稳定性、耐焊锡性等方面的研究进展。