随着越来越多客户要求采用Via in Pad(盘内导通孔)工艺,树脂塞孔凹馅问题在制作上是一个非常让人头疼的问题,一旦产生树脂凹馅,直接影响客户SMT贴片而遭投诉,目前虽然有关于改善树脂凹陷的文献,但大多局限于理论分析及综述。因成本因素...随着越来越多客户要求采用Via in Pad(盘内导通孔)工艺,树脂塞孔凹馅问题在制作上是一个非常让人头疼的问题,一旦产生树脂凹馅,直接影响客户SMT贴片而遭投诉,目前虽然有关于改善树脂凹陷的文献,但大多局限于理论分析及综述。因成本因素考虑,PCB厂家普遍采用铝片树脂塞孔,因铝片钻孔后易出现孔口批锋及打折,从而出现树脂凹馅现象,影响树脂塞孔效果。本文将推广一种可以提高树脂塞孔良率新工艺方法,采用0.25 mm(不含铜)基板钻孔后蚀刻铜皮制作塞孔网版,替代铝片塞孔网版进行树脂塞孔,改善树脂塞孔凹陷,提升树脂塞孔良率,此工艺方法同样可提升阻焊塞孔良率。展开更多
In the field of highly integrated printed circuit board （PCB）, the heat resistant substrate with low water absorption is very important material. To get the resin composition for the high functional substrate materi...In the field of highly integrated printed circuit board （PCB）, the heat resistant substrate with low water absorption is very important material. To get the resin composition for the high functional substrate material with low moisture absorption and high glass transition temperature （Tg） simultaneously, a fluorenyl ＂Cardo＂ epoxy was incorporated into novolac cyanate ester resin. As an optimum curing agent for the fiuorenyl epoxy, methyl nadic anhydride （MNA） was selected. Silica powders as fillers were added into the resin composition. The partial replacement of the cyanate ester resin with the fluorenyl epoxy could reduce the moisture absorption with keeping high glass transition temperature over 300 ℃. The laminate, which was fabricated from prepregs made with 40 wt% silica-filled resin composition and glass fabric, showed high Tg of 317 ℃ and low moisture absorption of 0.57%.展开更多
文摘随着越来越多客户要求采用Via in Pad(盘内导通孔)工艺,树脂塞孔凹馅问题在制作上是一个非常让人头疼的问题,一旦产生树脂凹馅,直接影响客户SMT贴片而遭投诉,目前虽然有关于改善树脂凹陷的文献,但大多局限于理论分析及综述。因成本因素考虑,PCB厂家普遍采用铝片树脂塞孔,因铝片钻孔后易出现孔口批锋及打折,从而出现树脂凹馅现象,影响树脂塞孔效果。本文将推广一种可以提高树脂塞孔良率新工艺方法,采用0.25 mm(不含铜)基板钻孔后蚀刻铜皮制作塞孔网版,替代铝片塞孔网版进行树脂塞孔,改善树脂塞孔凹陷,提升树脂塞孔良率,此工艺方法同样可提升阻焊塞孔良率。
文摘In the field of highly integrated printed circuit board （PCB）, the heat resistant substrate with low water absorption is very important material. To get the resin composition for the high functional substrate material with low moisture absorption and high glass transition temperature （Tg） simultaneously, a fluorenyl ＂Cardo＂ epoxy was incorporated into novolac cyanate ester resin. As an optimum curing agent for the fiuorenyl epoxy, methyl nadic anhydride （MNA） was selected. Silica powders as fillers were added into the resin composition. The partial replacement of the cyanate ester resin with the fluorenyl epoxy could reduce the moisture absorption with keeping high glass transition temperature over 300 ℃. The laminate, which was fabricated from prepregs made with 40 wt% silica-filled resin composition and glass fabric, showed high Tg of 317 ℃ and low moisture absorption of 0.57%.
