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塑封IC翘曲问题 被引量:6
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作者 李双龙 《电子与封装》 2003年第4期24-27,共4页
为分析封装材料及模塑过程参数对塑封IC翘曲的影响,本文先介绍塑料四边引线扁平封装(PQFP)使用的环氧模塑化合物(EMC)的热特性。并对不同模塑样品的聚合程度(DOC)、热膨胀系数(CTE)、玻璃转变温度Tg、剪切模量G等,运用各种热分析技术进... 为分析封装材料及模塑过程参数对塑封IC翘曲的影响,本文先介绍塑料四边引线扁平封装(PQFP)使用的环氧模塑化合物(EMC)的热特性。并对不同模塑样品的聚合程度(DOC)、热膨胀系数(CTE)、玻璃转变温度Tg、剪切模量G等,运用各种热分析技术进行测量。结合不同封装过程参数,运用三维有限元分析法进行封装翘曲预测。最后对塑料四边引线扁平封装(PQFP)IC翘曲的测量值与预测值进行比较。 展开更多
关键词 环氧模塑化合物 聚合程度 热膨胀系数 玻璃转变温度 剪切模量 翘曲预测 翘曲测量
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Comparative analysis on homogeneity of Pb and Cd in epoxy molding compounds
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作者 Kyun-Gmee LEE Yong-Keun SON +2 位作者 Jin-Sook LEE Tai-Min NOH Hee-Soo LEE 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2011年第A01期160-164,共5页
Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with ... Reference materials for quantitative determination of regulated heavy metals, such as Pb and Cd in electronic components, were designed and investigated in terms of stability and homogeneity. Reference materials with two concentration levels of heavy metals were prepared by spiking Pb and Cd compounds to epoxy molding compounds made by mixing silica powders and epoxy resin. The concentration changes of the reference materials during stability test for 1 a were not observed. In the homogeneity assessment, the as-prepared reference materials were studied by using three different analytical tools, inductively coupled plasma atomic emission spectrometry (ICP-AES), X-ray fluoroescence spectrometry (XRF) and laser ablation ICP mass. The results show different homogeneities by the characteristics of analytical tools and the materials. 展开更多
关键词 epoxy molding compound PB CD reference materials HOMOGENEITY
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