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玻璃焊带直线检测算法研究
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作者 刘凡 张权 +2 位作者 刘祎 赵明 桂志国 《测试技术学报》 2017年第6期461-468,共8页
为了实现工业上玻璃焊带高效、高精度的自动切割,提出了一种投影梯度法(Projection Gradient Method,PGM):新方法首先将待检测的原图像进行模板匹配,获得一个待检测直线区域的子图像,再将子图像在垂直方向进行投影,获得灰度投影向量并... 为了实现工业上玻璃焊带高效、高精度的自动切割,提出了一种投影梯度法(Projection Gradient Method,PGM):新方法首先将待检测的原图像进行模板匹配,获得一个待检测直线区域的子图像,再将子图像在垂直方向进行投影,获得灰度投影向量并求梯度得到灰度投影梯度向量,然后将子图像围绕中心旋转,当待检测直线与投影方向平行的时候,投影梯度向量的极大值是最大的,再根据图像的旋转和平移变换可求出待检测直线的方程.实验结果表明:梯度投影法能够满足玻璃焊带实时检测切割的要求. 展开更多
关键词 玻璃焊 模板匹配 子图像 图像旋转 直线检测
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一种新颖的焊封玻璃
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作者 姜继直 《中外技术情报》 1995年第6期24-25,共2页
焊封玻璃是用于金属基块之间、金属基块与玻璃或陶瓷间封装的粘结材料。按照焊封对象,焊封玻璃必须具备不同的热胀系数和软化点。
关键词 玻璃 玻璃 耐水性 机械强度
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Y-Al-Si-O-C氧碳玻璃的研制
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作者 蔡富春 曹优明 《渝西学院学报(自然科学版)》 2003年第2期31-33,共3页
以SiO_2,Al_2O_3,Y_2O_3,α-SiC粉体为原料,采用粉末烧结法,于1550℃~1650℃无压烧结2hr.,研制Y-Al-Si-O-C氧碳玻璃。结果表明:在1650℃×2h.的烧结条件下,在元素质量百分比为(wt%)Y(15.75)-Al(5.29)-Si(28.82)-O(49.14)-C(1.00)... 以SiO_2,Al_2O_3,Y_2O_3,α-SiC粉体为原料,采用粉末烧结法,于1550℃~1650℃无压烧结2hr.,研制Y-Al-Si-O-C氧碳玻璃。结果表明:在1650℃×2h.的烧结条件下,在元素质量百分比为(wt%)Y(15.75)-Al(5.29)-Si(28.82)-O(49.14)-C(1.00)和Y(15.75)-Al(5.29)-Si(29.60)-O(47.36)-C(2.00)的两个成份点可获得氧碳玻璃。 展开更多
关键词 氧碳玻璃 粉末烧结 玻璃焊
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Preparation and Characterization of ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)System Low Melting Sealing Glasses
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作者 HE Yifeng LI Xiuying +5 位作者 LI Chaoyuan GUO Huiming XIAO Zhuohao ZHU Shengbin DONG Hongbo FU Zhen 《陶瓷学报》 CAS 北大核心 2024年第5期931-940,共10页
Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the gl... Lead-free low melting glasses,ZnO-CuO-Bi_(2)O_(3)-B_(2)O_(3)-SiO_(2)system,with fixed contents of 15 mol%CuO and 20 mol%Bi_(2)O_(3),were prepared by using melt cooling method.Structure and thermal properties of the glasses were studied by using X-ray diffractometer(XRD),infrared spectrometer(FIT-IR),thermal dilatometer and differential thermal analyzer(DTA).Chemical durability of the glasses was studied by using dissolution rate method.Wettability of glasses on substrate was tested by using button sintering experiment.It is found that alkaline resistance of the glass solders is lower than that of plate glass and the water resistance is comparable with that of plate glass.The sealing temperatures are Ts=445-490℃,while the average thermal expansion coefficient from room temperature to 300℃is in the range of(65-82)×10^(−7)℃^(−1).At sealing temperature,the glass solders have good wettability on plate glass or alumina substrate.They are not crystallized even sintered at the sealing temperature for 30 min.The solder glasses are suitable for sealing plate glass,alumina and other inorganic non-metallic materials. 展开更多
关键词 bismuth borate glass solder glasses WETTABILITY chemical durability thermal properties
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Microstructure and fracture behavior of SiO_2 glass ceramic and TC4 alloy joint brazed with TiZrNiCu alloy 被引量:1
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作者 刘多 张丽霞 +2 位作者 冯吉才 刘洪斌 何鹏 《Journal of Central South University》 SCIE EI CAS 2009年第5期713-718,共6页
Vacuum brazing of SiO2 glass ceramic and TC4 alloy using a commercially available TiZrNiCu foil was investigated. The interfacial microstructure and the fractures were examined with an optical microscope (OM) and an... Vacuum brazing of SiO2 glass ceramic and TC4 alloy using a commercially available TiZrNiCu foil was investigated. The interfacial microstructure and the fractures were examined with an optical microscope (OM) and an S-4700 scanning electron microscope (SEM) equipped with an energy dispersive spectrometer (EDS) and an electron probe X-ray microanalyzer (EPMA). The structure of joint interface was identified by XRD (JDX-3530M). Meanwhile, the fracture paths of the joints were comprehensively studied. The results show that processing parameters, especially the brazing temperature, have a significant effect on the microstructure and mechanical properties of joints. The typical interface structure is SiO2/Ti2O+Zr3Si2+Ti5Si3/(Ti,Zr)+Ti2O+ TiZrNiCu/Ti(s.s)/TiZrNiCu+Ti(s.s)+Ti2(Cu,Ni)/TC4 from SiO2 glass ceramic to TC4 alloy side. Based on the mechanical property tests, the joints brazed at 880 ℃ for 5 rain has the maximum shear strength of 23 MPa. 展开更多
关键词 SiO2 glass ceramic TC4 alloy BRAZING joints interface MICROSTRUCTURE mechanical properties
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真空管闷晒热水器——评介与建议 被引量:1
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作者 熊尚义 《中国建设动态(阳光能源)》 2005年第08M期53-55,共3页
本文介绍了国外典型的真空管闷晒热水器产品,其性能优异,开发利用此类产品,节约资源,市场会看好,前景广阔。同时指出了国内开发此类产品工艺技术未全部过关的问题,并介绍了此产品高新技术含量的内涵及其关键,特别是玻璃-金属焊封技术可... 本文介绍了国外典型的真空管闷晒热水器产品,其性能优异,开发利用此类产品,节约资源,市场会看好,前景广阔。同时指出了国内开发此类产品工艺技术未全部过关的问题,并介绍了此产品高新技术含量的内涵及其关键,特别是玻璃-金属焊封技术可供借鉴。 展开更多
关键词 真空管闷晒热水器 技术性能 玻璃-金属封技术 金属件 真空度
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Ultrasonic-assisted rapid cold welding of bulk metallic glasses 被引量:2
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作者 Zhiyuan Huang Jianan Fu +7 位作者 Xin Li Wenxin Wen Hongji Lin Yan Lou Feng Luo Zhenxuan Zhang Xiong Liang Jiang Ma 《Science China Materials》 SCIE EI CAS CSCD 2022年第1期255-262,共8页
Glass-forming ability is a long-standing concern in the field of metallic glasses(MGs),which greatly limits their maximum casting size and extensive applications.In this work,we report an ultrasonic-assisted rapid col... Glass-forming ability is a long-standing concern in the field of metallic glasses(MGs),which greatly limits their maximum casting size and extensive applications.In this work,we report an ultrasonic-assisted rapid cold welding of bulk MGs without using any additives.MGs with various compositions are welded together under a 20,000-Hz highfrequency ultrasonic vibration without losing their amorphous nature.The ultrasonic technology offers the advantages of rapid bonding(<1 s)at low temperature(near room temperature)and low stress(<1 MPa).According to the phenomenon observed in the experiment,the activated fresh atoms diffuse through the broken channel port under continuous rupture of the oxide layer,and the ultrasonic vibration accelerates the atomic-diffusion process.Finally,stable bonding of the MG interface is realized.This universal ultrasonic-assisted welding process can realize the composition design of dissimilar MGs as well as tuning of new materials with new performance. 展开更多
关键词 metallic glass glass-forming ability ultrasonicassisted welding atomic diffusion composition design
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